Week endingFriday, October 2, 2026Covers September 26 to October 2, 2026 · 15 items
Micron reported record results for its fiscal fourth quarter and full year and pointed to tight memory supply ahead, with new LPDDR6 samples and a ramp of its data center SSDs. TrendForce raised its HBM price outlook for next year and said contract prices keep climbing. SK hynix told shareholders that nothing has been decided on Solidigm after press reports about a listing, and showed its HBM and SSD lineup at TSMC's partner event.
On the technology side, Everspin demonstrated MRAM behind a CXL interface at the SNIA Developer Conference, JEDEC released its first reliability standard for silicon photonics, and three preprints looked at flash for LLM serving and NVMe data placement. Eyes on Flash added several labs and a set of new articles.
Responding to press reports about a possible listing, SK hynix said Solidigm is reviewing ways to strengthen its competitiveness but no matters have been determined, and that any outside capital would be weighed against its effect on existing shareholders.
SK hynix ·
At TSMC's Open Innovation Platform conference, SK hynix displayed HBM4 and HBM4E parts, server DRAM modules and its first QLC enterprise SSD. It also took TSMC's partner award for HBM integration and described chiplet based controllers for future PCIe SSDs.
SK hynix ·
At the SNIA Developer Conference, Everspin and Wolley showed MRAM modules read and written over CXL on a server with an FPGA based CXL controller, which Everspin calls the first such platform. It is ready for customers to test their own workloads.
Everspin ·
The standard sets common qualification and reliability testing for silicon photonics devices and spells out who owns reliability among foundries, assembly houses and system builders. It matters to memory and storage mainly through optical links in AI systems.
Micron said AI demand drove record results and a record outlook for its next fiscal year. It also reported a volume ramp of its data center SSD, sampling of LPDDR6 for physical AI markets and server LPDDR SOCAMM revenue that more than doubled from the prior quarter.
TrendForce says HBM and ordinary DRAM keep competing for scarce advanced capacity, so it raised its HBM price view for 2027. It expects some GPU and ASIC makers to weigh shorter HBM stacks in place of taller ones to save cost and supply.
Reported by TrendForce (analysis); the company has not confirmed it yet.
TrendForce's latest outlook says suppliers are still prioritizing advanced capacity for AI servers, keeping the DRAM market undersupplied, though the pace of contract price increases is expected to ease.
Reported by TrendForce (analysis); the company has not confirmed it yet.
The paper commits scarce fast tier space only when a cached KV prefix is about to be needed, using the time to retrieve it from flash, and reports less fast tier use with serving gains kept.
arXiv ·
Trace driven simulations of an HBM, flash and host hierarchy look at completion time, energy and flash write lifetime, and find that cache aware scheduling stretches the flash's estimated life.
arXiv ·
The authors test FDP SSDs, which let software steer data into reclaim units, and show lower write amplification and better latency for two common storage systems without invasive changes.
arXiv ·