Weekly recap cover, week ending August 21, 2026An HBM stack of DRAM dies on a base die, joined by through-silicon vias, the lead topic of the week ending August 21, 2026; below it, one drawing for each topic the week covered: DRAM and HBM (1), SSDs and storage systems (1), Standards (1), Market and earnings (1), Research papers (2).THE WEEK IN MEMORY AND STORAGEWEEK ENDINGAugust 212026LEAD · DRAM AND HBM11112

Week endingFriday, August 21, 2026Covers August 15 to August 21, 2026 · 6 items

SK hynix Returns Cash to Holders, Micron Opens a Research Hub, and Sandisk Adds NAS SSDs

The week had few product launches and several corporate moves. SK hynix announced a large share repurchase and cancellation program and a wider shareholder return policy, Micron unveiled Micron Research Labs, a long horizon research hub in Boise, and Sandisk introduced a line of high endurance SSDs for network attached storage.

On the technical side, SK hynix published a co packaged optics roadmap with university partners in Nature Electronics, positioning optical links as the next step beyond HBM for AI systems. JEDEC announced its automotive electronics forum for September, and a new paper analyzed reliability for HBM systems with partial service.

Top stories

The rest of the week

Market and earnings

Research papers

  1. SK hynix and university partners publish a co packaged optics roadmap in Nature Electronics (opens in a new tab)

    The paper traces optics from 2D packaging through 2.5D interposers to 3D integration and argues optical links will matter once the bandwidth between systems, not just chips, is the limit.

    SK hynix ·

  2. Paper models HBM reliability when a stack can deliver partial bandwidth (opens in a new tab)

    The author builds an exact reliability framework for HBM systems where units may deliver full, reduced or no bandwidth, and shows when a simpler binary model misleads.

    arXiv ·