Bit Market

Market Board: The Storage and Memory Market as a Whole

How big the memory and storage markets are, who holds them, and how tight supply is, from analysts’ measures of the industry.

What the numbers say

$154.73BThe whole DRAM industry earned this much revenue in Q2 2026. See the chartQ2 2026 · actual · TrendForce
87%Samsung, SK hynix and Micron hold this share of DRAM revenue between them. See the chartQ2 2026 · estimate · Counterpoint, top three summed by EoF
−4 to −5%NAND supply falls this far short of demand in 2026, as a share of demand. See the chart2026 · forecast · TrendForce, July 2026

These figures measure the industry: market size and share from TrendForce and Counterpoint, wafer counts from SEMI, and the makers’ own fab dates and drive records. Each chart names its source and period, and all are listed under Sources. How each company did is on the Earnings Desk, and new papers, patents and maker news are in Webster’s Corner. Not investment advice.

Market size

TrendForce adds up each quarter’s revenue for the memory makers it ranks. Its DRAM figure covers the whole industry. Its NAND figure covers the five largest brands only, so YMTC and the smaller makers sit outside it.

Market size

Memory revenue grew several times over in five quarters

Quarterly revenue as TrendForce publishes it, split by maker

Each bar is as long as the quarter’s total revenue; DRAM is the whole industry, NAND only TrendForce’s top five listed brands, so YMTC and smaller makers are left out; each market has its own dollar scale. Source: TrendForce quarterly DRAM and NAND revenue rankings (secondary).

Each company’s own filed revenue, quarter by quarter, is on the Earnings Desk.

Who holds the supply

Counterpoint estimates each maker’s share of DRAM, HBM and NAND revenue and of NAND bits shipped, and TrendForce does the same for foundries. Makers that publish no results, such as CXMT and YMTC, appear only through estimates like these.

Who holds the supply

Three makers hold nearly all DRAM and HBM

Share of revenue by maker, 2Q26. Chinese makers in copper

Figure M1 · DRAM and HBM sit with three companies; CXMT, the Chinese maker gaining share fastest, held 4% of DRAM revenue a year earlier (2Q25) and 10% now. Counterpoint’s shares are rounded, so a bar can add up to 101. Source: Counterpoint Research, September 2026 (DRAM, HBM).

Who holds the supply

NAND is spread across six makers

Share by maker, 2Q26: revenue, then bits shipped. Chinese makers in copper

Figure M2 · No maker holds more than 28% of NAND revenue; YMTC is third by bits but fifth by revenue because most of its bits go into consumer parts. Counterpoint’s shares are rounded, so a bar can add up to 101. Source: Counterpoint Research, September 2026 (NAND).

Who holds the supply

One foundry holds most logic

Share of foundry revenue by maker, 2Q26. SMIC, China’s foundry, in copper

Figure M3 · TSMC alone holds nearly three quarters of foundry revenue; SMIC, the one Chinese foundry among the five largest, holds 5.4%. Source: TrendForce, September 2026 (foundry).

Counterpoint rounds its shares, so a bar can add up to slightly more than the whole.

Concentration over time

The same Counterpoint estimates quarter by quarter, with the share the three largest makers hold together.

Concentration over time

Each bar is one quarter of revenue; the right column is the top three’s combined share

Whole-percent shares as Counterpoint published them, so a bar can add to 99 or 101 and the top three carries the same rounding; Counterpoint includes YMTC and CXMT, which publish no results, and never counts Others in the top three. Source: Counterpoint Research Memory Tracker, 2Q25 to 2Q26 (secondary). Derived: the top three is the sum of the three largest shares.

When the top three’s share falls, smaller makers are taking a larger part of the market.

Supply short of demand

TrendForce measures how far supply falls short of demand, as a share of demand. SEMI counts the memory wafers the industry can start each month.

Supply short of demand

Demand outruns supply, and SEMI’s wafer count rises about 2%

Supply minus demand (TrendForce) and 300mm memory wafers per month (SEMI)

Figure S1 · Both memories ran short in 2026, and on SEMI’s count wafers rise about 2% in 2027, so most of the extra bits have to come from denser chips. Source: TrendForce, July 2026; SEMI 300mm Fab Outlook, June 2026; Micron FQ4 2026 prepared remarks.

With the wafer count nearly flat, most of the extra bits have to come from denser chips.

Why new fabs come late

Each maker dates its own fabs, from groundbreaking to first output. The shaded years are the ones the makers call supply constrained.

Why new fabs come late

Most new capacity arrives inside the shortage, not before it

Announced memory fabs and cleanrooms, groundbreaking to first output, dated by each maker

Figure S2 · A fab takes years from groundbreaking to first wafers, and Micron says output only becomes meaningful a few quarters after that. Source: Micron FQ4 2026 prepared remarks and 10-K; Kioxia FY2026 Q1 results; SK hynix 2Q26 results.

Micron says a new fab’s output becomes meaningful only a few quarters after its first wafers.

HBM takes the wafers

HBM stacks DRAM dies, so a wafer turned to HBM yields fewer bits than it would as ordinary DRAM.

HBM takes the wafers

SI memory takes more wafers per bit, and more of the budget

HBM share of DRAM wafers and bits (top three suppliers); memory share of major cloud capex

Figure S3 · Every wafer moved to HBM yields fewer bits than it did as ordinary DRAM, and the cloud providers pay for the difference. Source: TrendForce, June and August 2026.

The cloud providers pay for the difference, and memory takes a larger share of their spending each year.

Price outlook, quarter by quarter

TrendForce publishes a contract price outlook for conventional DRAM and NAND each quarter and revises it as the quarter nears. These are forecasts, not prices paid.

Price outlook, quarter by quarter

TrendForce’s contract price forecasts, quarter by quarter

Expected change from the quarter before; a faint range is an earlier forecast that was later revised

Forecast rises stayed in the teens through 2025, then jumped in early 2026; the 1Q26 outlook was raised within a month of being published. Source: TrendForce press releases, Mar 2025 to Sep 2026 (secondary).

Show the numbers

Quarter	Conventional DRAM, QoQ	NAND Flash, QoQ
Q2 2025	-5 to 0%TrendForce, 2025-03-25	no overall figure
Q3 2025	+10 to +15%TrendForce, 2025-07-07	+5 to +10%TrendForce, 2025-07-09
Q4 2025	+8 to +13%TrendForce, 2025-09-24	+5 to +10%TrendForce, 2025-09-25
Q1 2026	+90 to +95%first forecast +55 to +60% (2026-01-05)TrendForce, 2026-02-02	+55 to +60%first forecast +33 to +38% (2026-01-05)TrendForce, 2026-02-02
Q2 2026	+58 to +63%TrendForce, 2026-03-31	+70 to +75%TrendForce, 2026-03-31
Q3 2026	+13 to +18%TrendForce, 2026-07-03	+10 to +15%TrendForce, 2026-07-03
Q4 2026	+10 to +15%TrendForce, 2026-09-30	+15 to +20%TrendForce, 2026-09-30

Where TrendForce revised a forecast, the earlier range is drawn faint behind the newer one. Company revenue guidance against results is on the Earnings Desk.

Prices carry the gap

Contract prices are where the shortage reaches buyers, and the sources differ on how long it lasts.

Prices carry the gap

Server DRAM prices are set to rise about 270% in 2026, SSDs 235%

Contract price rises (TrendForce), and what the sources expect next

Figure S4 · Prices carry the shortage, and DRAM has no relief in sight while NAND may ease in late 2027 if TrendForce is right. Source: TrendForce, July and August 2026; Micron FQ4 2026 prepared remarks; Kioxia FY2026 Q1 results.

Each of these four steps is explained at length in The Memory Cycle.

Storage Seagate shipped

Seagate is the one drive maker that reports the storage it ships each quarter, in exabytes. Backblaze, which buys hard drives in bulk for its cloud, paid about $114 a terabyte in 2009 and $14.4 by 2022.

Storage Seagate shipped

Seagate’s hard drive shipments nearly doubled in two years

Hard drive exabytes Seagate shipped each quarter

Western Digital publishes no exabyte figure, so these are Seagate’s shipments alone, not the whole hard drive market. Seagate’s fiscal quarters sit in the calendar quarter they mostly cover; the average drive held 13.0 TB in FQ4 2025, the last quarter Seagate published it. Source: Seagate supplemental financial information, FQ4 2024 to FQ4 2026.

Western Digital reports its revenue but not its exabytes, so its drives appear on the Earnings Desk only.

The biggest drives

Each maker announces its largest drive, samples it to customers, then ships it. The chart marks the stage each record had reached.

The biggest drives

The biggest drives: SSDs pulled far ahead of hard drives

Largest capacity by date, from each maker’s release, log scale

Each point is a maker’s own release, with its own status word; hard drives still cost far less per terabyte than SSDs. Source: Seagate, Western Digital, Solidigm, Kioxia and Micron releases, 2022 to 2026.

Hard drives still cost far less per terabyte than SSDs, which is why both keep selling.

How much a die holds

Every NAND and DRAM die on the EoF die timelines, by date, with the record holder at each step.

How much a die holds

How much a die holds, record by record

Every die as a dot; the stepped line follows each new record; log scale

A straight climb on a log scale is steady doubling; NAND climbs faster than DRAM because it stacks layers, while DRAM still shrinks one flat layer of cells. Source: EoF NAND and DRAM die timelines (sourced per die).

Each die and its source are on the NAND die timeline and the DRAM die timeline.

Who makes what

Who makes the memory, who designs and fabricates the chips that buy it, and who designs the controller in every SSD.

Drive brands such as ADATA, Transcend, Longsys and Biwin make no chips: they buy them from the memory makers. Most SI chip companies design chips and pay a foundry to make them. Arm only licenses designs, TSMC only makes chips for others, and Intel and Samsung do both.

Memory and flash makers

Designs and fabricates9

Samsung Electronics
DRAM, HBM and NAND; charted as its chip division
ListedOn the charts
Designs and fabricates; also a foundry for others
SK hynix
DRAM, HBM and NAND (with its Solidigm subsidiary)
ListedOn the charts
Micron
DRAM, HBM and NAND
ListedOn the charts
Kioxia
NAND
ListedOn the charts
YMTC (Yangtze Memory)
NAND
PrivateNo public results
CXMT (ChangXin Memory)
DRAM
ListedOn the charts
Nanya Technology
DRAM for PCs, consumer and industrial devices
ListedOn the charts
Winbond Electronics
Specialty DRAM, NOR and SLC NAND
ListedOn the charts
Macronix International
NOR flash, SLC NAND and ROM
ListedOn the charts

Other6

Sandisk
NAND
ListedOn the charts
Designs; fabricates jointly with Kioxia
ADATA Technology
DRAM modules and SSDs
ListedOn the charts
Buys memory chips; builds SSDs and modules (no chip fabs)
Transcend Information
Memory cards, SSDs and DRAM modules
ListedOn the charts
Buys memory chips; builds SSDs and modules (no chip fabs)
Longsys
SSDs, embedded storage and modules (FORESEE, Lexar)
ListedOn the charts
Buys memory chips; builds SSDs and modules (no chip fabs)
Biwin Storage
Embedded storage, SSDs and modules
ListedOn the charts
Buys memory chips; builds SSDs and modules (no chip fabs)
Kingston Technology
DRAM modules, SSDs and flash cards
PrivateNo public results
Buys memory chips; builds SSDs and modules (no chip fabs)

Show the table

Maker	Designs or makes	Status	Products	On the charts
Samsung Electronics	Designs and fabricates; also a foundry for others	ListedKRX: 005930	DRAM, HBM and NAND; charted as its chip division	Yes
SK hynix	Designs and fabricates	ListedKRX: 000660	DRAM, HBM and NAND (with its Solidigm subsidiary)	Yes
Micron	Designs and fabricates	ListedNasdaq: MU	DRAM, HBM and NAND	Yes
Kioxia	Designs and fabricates	ListedTSE: 285A	NAND	Yes
Sandisk	Designs; fabricates jointly with Kioxia	ListedNasdaq: SNDK	NAND	Yes
YMTC (Yangtze Memory)	Designs and fabricates	Private	NAND	No public results
CXMT (ChangXin Memory)	Designs and fabricates	ListedSSE STAR: 688825	DRAM	Yes
Nanya Technology	Designs and fabricates	ListedTWSE: 2408	DRAM for PCs, consumer and industrial devices	Yes
Winbond Electronics	Designs and fabricates	ListedTWSE: 2344	Specialty DRAM, NOR and SLC NAND	Yes
Macronix International	Designs and fabricates	ListedTWSE: 2337	NOR flash, SLC NAND and ROM	Yes
ADATA Technology	Buys memory chips; builds SSDs and modules (no chip fabs)	ListedTPEx: 3260	DRAM modules and SSDs	Yes
Transcend Information	Buys memory chips; builds SSDs and modules (no chip fabs)	ListedTWSE: 2451	Memory cards, SSDs and DRAM modules	Yes
Longsys	Buys memory chips; builds SSDs and modules (no chip fabs)	ListedSZSE: 301308	SSDs, embedded storage and modules (FORESEE, Lexar)	Yes
Biwin Storage	Buys memory chips; builds SSDs and modules (no chip fabs)	ListedSSE STAR: 688525	Embedded storage, SSDs and modules	Yes
Kingston Technology	Buys memory chips; builds SSDs and modules (no chip fabs)	Private	DRAM modules, SSDs and flash cards	No public results

The chips that pull demand

Designs and fabricates2

Intel
CPUs, AI accelerators and foundry services
ListedOn the charts
Designs and fabricates; also a foundry for others
Samsung Electronics
Memory, Exynos processors and foundry services
ListedOn the charts
Designs and fabricates; also a foundry for others

Designs only (fabless)3

NVIDIA
AI accelerators (GPUs), CPUs and networking
ListedOn the charts
Designs only (fabless); TSMC fabricates
AMD
CPUs, GPUs and AI accelerators
ListedOn the charts
Designs only (fabless); TSMC fabricates most
Marvell
Data center chips, custom AI silicon and SSD controllers
ListedOn the charts

Fabricates for others1

TSMC
Wafers for fabless designers, including the advanced packaging (CoWoS) that joins GPUs to HBM
ListedOn the charts
Fabricates for others (foundry)

Licenses designs1

Arm Holdings
CPU designs and instruction set licences
ListedOn the charts
Licenses designs (IP); others build the chips

Show the table

Company	Designs or makes	Status	Products	On the charts
NVIDIA	Designs only (fabless); TSMC fabricates	ListedNasdaq: NVDA	AI accelerators (GPUs), CPUs and networking	Yes
AMD	Designs only (fabless); TSMC fabricates most	ListedNasdaq: AMD	CPUs, GPUs and AI accelerators	Yes
Arm Holdings	Licenses designs (IP); others build the chips	ListedNasdaq: ARM	CPU designs and instruction set licences	Yes
Marvell	Designs only (fabless)	ListedNasdaq: MRVL	Data center chips, custom AI silicon and SSD controllers	Yes
TSMC	Fabricates for others (foundry)	ListedTWSE: 2330, NYSE: TSM	Wafers for fabless designers, including the advanced packaging (CoWoS) that joins GPUs to HBM	Yes
Intel	Designs and fabricates; also a foundry for others	ListedNasdaq: INTC	CPUs, AI accelerators and foundry services	Yes
Samsung Electronics	Designs and fabricates; also a foundry for others	ListedKRX: 005930	Memory, Exynos processors and foundry services	Yes

SSD controllers

Designs only (fabless)18

Silicon Motion
Client, mobile and enterprise SSD controllers; UFS and eMMC
ListedOn the charts
Phison
Client and enterprise SSD controllers, plus finished SSDs and modules
ListedOn the charts
Maxio Technology
SATA and PCIe 3.0 to 5.0 SSD controllers, UFS 3.1
ListedOn the charts
FADU
Enterprise and data center SSD controllers
ListedOn the charts
Marvell
Enterprise SSD controllers inside a data infrastructure chip business
ListedOn the charts
JMicron
USB and PCIe bridge chips, older SATA SSD controllers (JMF667H, JMF670H)
ListedNot charted yet
InnoGrit
Client and enterprise SSD controllers
PrivateNo public results
Realtek
Entry-level SSD controllers (RTS5766DL, RTS5772DL); in 2024 it showed a PCIe 5.0 controller on its roadmap
ListedNot charted yet
Microchip
Enterprise NVMe SSD controller Flashtec NVMe 5016 (PCIe 5.0, 16 channels)
ListedNot charted yet
Goke Microelectronics
SSD controller chips GK2301 and GK2302 (the GK2302 on a Loongson CPU), the GK2302 also in its own SSDs
ListedNot charted yet
YEESTOR
PCIe, SATA, UFS, eMMC, USB and SD controllers
Not listedNo public results
TenaFe
PCIe 4.0 SSD controller TC2201
No listing foundNo public results
Starblaze
SSD controllers STAR1000P and STAR2000
No listing foundNo public results
ScaleFlux
Enterprise SSD controller SFX 5016, for PCIe 5.0 platforms
No listing foundNo public results
DERA
Controllers TAI (enterprise NVMe), MENG and EMEI
No listing foundNo public results
Hosin
SSD controllers HG283 (PCIe 3.0 x4, DRAM-less) and HG2259 (SATA)
No listing foundNo public results
DapuStor
Enterprise PCIe 5.0 SSD controllers of the DP800 series, used in its Roealsen6 SSDs
No listing foundNo public results
Designs only (fabless); also sells its own SSDs
Hyperstone
Flash memory controllers: X1 (SATA SSD), U9 (USB) and S9 (SD)
SubsidiaryNo public results

Vertically integrated6

Samsung
SSD controllers Pascal, Presto and Piccolo
In-houseControllers public; revenue not broken out
SK hynix
SSD controllers Aries, Alistar and Atomos Prime ACNT081M
In-houseControllers public; revenue not broken out
Solidigm
Sentinel Rock Plus, the controller in its D7-P5520 SSD
In-houseControllers public; revenue not broken out
Kioxia
In-house designed controllers in its client SSDs and in the CD8P data center drives
In-houseControllers public; revenue not broken out
Micron
The controllers in its Crucial P5 Plus and 9550 drives
In-houseControllers public; revenue not broken out
Also uses Phison or Silicon Motion chips in some drives.
Sandisk
SSD controller Polaris 3
In-houseControllers public; revenue not broken out
Also uses Silicon Motion chips in some drives.

Each designs controllers for its own SSDs. About 35% of the 2024 global SSD controller market was NAND makers’ own designs, by CFM figures in Maxio’s 2025 annual report.

Show the table

Designer	Designs or makes	Status	Products	On the charts
Silicon Motion	Designs only (fabless)	ListedNasdaq: SIMO	Client, mobile and enterprise SSD controllers; UFS and eMMC	Yes
Phison	Designs only (fabless)	ListedTPEx: 8299	Client and enterprise SSD controllers, plus finished SSDs and modules	Yes
Maxio Technology	Designs only (fabless)	ListedSSE STAR Market: 688449	SATA and PCIe 3.0 to 5.0 SSD controllers, UFS 3.1	Yes
FADU	Designs only (fabless)	ListedKOSDAQ: 440110	Enterprise and data center SSD controllers	Yes
Marvell	Designs only (fabless)	ListedNasdaq: MRVL	Enterprise SSD controllers inside a data infrastructure chip business	Yes
JMicron	Designs only (fabless)	ListedTPEx: 4925	USB and PCIe bridge chips, older SATA SSD controllers (JMF667H, JMF670H)	Not yet
InnoGrit	Designs only (fabless)	Private	Client and enterprise SSD controllers	No public results
Realtek	Designs only (fabless)	ListedTWSE: 2379	Entry-level SSD controllers (RTS5766DL, RTS5772DL); in 2024 it showed a PCIe 5.0 controller on its roadmap	Not yet
Microchip	Designs only (fabless)	ListedNasdaq: MCHP	Enterprise NVMe SSD controller Flashtec NVMe 5016 (PCIe 5.0, 16 channels)	Not yet
Goke Microelectronics	Designs only (fabless)	ListedSZSE: 300672	SSD controller chips GK2301 and GK2302 (the GK2302 on a Loongson CPU), the GK2302 also in its own SSDs	Not yet
YEESTOR	Designs only (fabless)	Not listed	PCIe, SATA, UFS, eMMC, USB and SD controllers	No public results
TenaFe	Designs only (fabless)	No listing found	PCIe 4.0 SSD controller TC2201	No public results
Starblaze	Designs only (fabless)	No listing found	SSD controllers STAR1000P and STAR2000	No public results
ScaleFlux	Designs only (fabless)	No listing found	Enterprise SSD controller SFX 5016, for PCIe 5.0 platforms	No public results
DERA	Designs only (fabless)	No listing found	Controllers TAI (enterprise NVMe), MENG and EMEI	No public results
Hosin	Designs only (fabless)	No listing found	SSD controllers HG283 (PCIe 3.0 x4, DRAM-less) and HG2259 (SATA)	No public results
DapuStor	Designs only (fabless); also sells its own SSDs	No listing found	Enterprise PCIe 5.0 SSD controllers of the DP800 series, used in its Roealsen6 SSDs	No public results
Hyperstone	Designs only (fabless)	SubsidiaryAcquired by Swissbit (announced December 2020)	Flash memory controllers: X1 (SATA SSD), U9 (USB) and S9 (SD)	No public results
Samsung	Designs in-house for its own drives	In-house	SSD controllers Pascal, Presto and Piccolo	Controllers public; revenue not broken out
SK hynix	Designs in-house for its own drives	In-house	SSD controllers Aries, Alistar and Atomos Prime ACNT081M	Controllers public; revenue not broken out
Solidigm	Designs in-house for its own drives	In-house	Sentinel Rock Plus, the controller in its D7-P5520 SSD	Controllers public; revenue not broken out
Kioxia	Designs in-house for its own drives	In-house	In-house designed controllers in its client SSDs and in the CD8P data center drives	Controllers public; revenue not broken out
Micron	Designs in-house for its own drives	In-house	The controllers in its Crucial P5 Plus and 9550 drivesAlso uses Phison or Silicon Motion chips in some drives.	Controllers public; revenue not broken out
Sandisk	Designs in-house for its own drives	In-house	SSD controller Polaris 3Also uses Silicon Motion chips in some drives.	Controllers public; revenue not broken out

Vertically integrated: Each designs controllers for its own SSDs. About 35% of the 2024 global SSD controller market was NAND makers’ own designs, by CFM figures in Maxio’s 2025 annual report.

Data and sources

The company figures behind these charts as files, and every source they come from.

CSV or JSON. Each row carries the words it quotes and the source to check it against; money is in US dollars first, then as filed.

Company resultsOne row per filed figure: CSV or JSON
Exchange ratesOne row per quarterly rate: CSV or JSON
Company guidanceOne row per guided range: CSV or JSON
Analyst forecastsOne row per forecast range: CSV or JSON

Sources

Primary is the original paper, standard or datasheet. Secondary is a review, a vendor summary or a news report. Measured is my own test data.

Show all 408 sources, 343 primary

Secondary[News] China’s NAND Giant YMTC Reportedly Moves into HBM Using TSV, Following CXMT and HuaweiTrendForce
Secondary[News] China’s YMTC Launches $3B Wuhan Phase III Venture, Signaling NAND Expansion AmbitionsTrendForce
Secondary[News] CXMT G5 DRAM Enters Mass Production with 50%+ Higher Dies Per Wafer; SAQP Enables 11.95nm Half-PitchTrendForce
Secondary[News] Micron Taiwan Investment Tops NT$1.6T as Four-Site Expansion Accelerates; Nanya Adds Pingtung ProjectTrendForce
Secondary[News] Samsung Reportedly Plans 200K 1c DRAM Wafers/Month by 2026, About One-Third of Its Total OutputTrendForce
Secondary[News] SK hynix Reportedly to Double DRAM Capacity in 2H26 to Match Samsung, Pulls Back on NANDTrendForce
Secondary[News] SK hynix Reportedly to Double DRAM Capacity to 1M Monthly Wafers by 2030, Speeds Yongin ExpansionTrendForce
Primary1Q25 Consolidated Financial Report and April Revenue AnnouncementPhison
Primary1Q26 Consolidated Financial Report and April Revenue AnnouncementPhison
Secondary2Q25 DRAM Revenue Jumps 17.1%, SK hynix Expands Market Share as Taiwanese Vendors Deliver Strong Growth, Says TrendForce (publisher page printed to PDF)TrendForce, 2025
Primary2Q26 Consolidated Financial Report AnnouncementPhison
Primary3Q25 Consolidated Financial Report and October Revenue AnnouncementPhison
Secondary3Q25 NAND Flash Contract Prices Projected to Rise 5–10%; Weak Smartphone Demand Limits eMMC and UFS Growth, Says TrendForceTrendForce
Primary4Q25 Consolidated Financial Report and February Revenue AnnouncementPhison
Primary5 things you should know about High NA in EUVASML, 2024
PrimaryAbout CXMTCXMT
PrimaryADATA Announces Q1 2026 Financial ResultsADATA Technology, 2026
PrimaryADATA Announces Q2 2026 Financial ResultsADATA Technology, 2026
PrimaryADATA Announces Q3 2026 Financial Results (publisher page printed to PDF)ADATA Technology, 2026
PrimaryADATA Announces Q4 2025 Financial ResultsADATA Technology, 2026
PrimaryADATA consolidated income statement, 2025 Q1 (TWSE MOPS, English)ADATA (TWSE MOPS filing), 2025
PrimaryADATA consolidated income statement, 2025 Q2 (TWSE MOPS, English)ADATA (TWSE MOPS filing), 2025
PrimaryADATA consolidated income statement, 2025 Q3 (TWSE MOPS, English)ADATA (TWSE MOPS filing), 2025
SecondaryAI Competition Turns into a Supply Chain Arms Race, Tightening Advanced Packaging and 3nm Capacity, Says TrendForceTrendForce
SecondaryAI Infrastructure Continues to Strengthen NAND Flash Demand; Kioxia Posts Highest QoQ Growth of 33.1% in 3Q25, Says TrendForce (publisher page printed to PDF)TrendForce, 2025
SecondaryAI Server Demand Continues to Support Memory Prices in 3Q26, but Gains Moderate as Consumer Demand Weakens and High Base Effects Take Hold, Says TrendForceTrendForce
SecondaryAI Server Demand Sustains Memory Contract Price Increases in 4Q26, While Consumer-Side Pressure Persists, Says TrendForceTrendForce
SecondaryAI Server Demand to Drive Memory Contract Price Increases in 2Q26 as CSPs Secure Supply via Long-Term AgreementsTrendForce
SecondaryAI Server Storage Demand Surges; Top Five NAND Flash Suppliers Post 23.8% QoQ Revenue Growth in 4Q25, Says TrendForceTrendForce
PrimaryAll about light and lasers in lithographyASML
PrimaryAMD Reports First Quarter 2025 Financial Resultssec.gov
PrimaryAMD Reports First Quarter 2026 Financial ResultsAMD
PrimaryAMD Reports Fourth Quarter and Full Year 2025 Financial ResultsAMD
PrimaryAMD Reports Second Quarter 2025 Financial Resultssec.gov
PrimaryAMD Reports Second Quarter 2026 Financial ResultsAMD
PrimaryAMD Reports Third Quarter 2025 Financial Resultssec.gov
PrimaryAMD Reports Third Quarter 2026 Financial Resultssec.gov
PrimaryAmkor Technology Form 10-K for fiscal year 2025U.S. SEC
PrimaryApplied Materials Expands Singapore Manufacturing for AIApplied Materials (via Singapore EDB)
PrimaryArm shareholder letter, Q1 FY2026sec.gov
PrimaryArm shareholder letter, Q1 FY2027Arm Holdings (SEC 6-K exhibit 99.2)
PrimaryArm shareholder letter, Q2 FY2026Arm Holdings (SEC 6-K exhibit 99.2)
PrimaryArm shareholder letter, Q2 FY2027Arm Holdings (SEC 6-K exhibit 99.2), 2026
PrimaryArm shareholder letter, Q3 FY2026Arm Holdings (SEC 6-K exhibit 99.2)
PrimaryArm shareholder letter, Q4 FY2025sec.gov
PrimaryArm shareholder letter, Q4 FY2026Arm Holdings (SEC 6-K exhibit 99.2)
PrimaryASE Technology Holding Co., Ltd.: Form 20-F for the fiscal year ended December 31, 2025U.S. SEC
PrimaryASML Form 20-F, fiscal year 2022U.S. SEC
PrimaryASML Form 20-F, fiscal year 2023U.S. SEC
PrimaryASML Form 20-F, fiscal year 2025U.S. SEC
PrimaryASML Integrated Report 2019 (Form 20-F)U.S. SEC, 2020
PrimaryASML press release: Q2 2026 financial resultsASML
SecondaryBernstein raises ASML stock price target on DRAM capacity growthInvesting.com (reporting a Bernstein note), 2026
PrimaryBiden-Harris Administration Announces CHIPS Incentives Award with Intel to Advance U.S. Leading-Edge Chip Capacity and Create Tens of Thousands of JobsNIST, 2024
PrimaryBiden-Harris Administration Announces CHIPS Incentives Awards with GlobalWafers to Support Domestic Production of Silicon WafersNIST, 2024
PrimaryBiwin 2025 annual report (佰维存储 2025年年度报告)Shanghai Stock Exchange filing (cninfo)
PrimaryBiwin 2025 half-year report (佰维存储 2025年半年度报告)static.cninfo.com.cn
PrimaryBiwin 2025 third-quarter report (佰维存储 2025年第三季度报告)static.cninfo.com.cn
PrimaryBiwin 2026 half-year report (佰维存储 2026年半年度报告)Shanghai Stock Exchange filing (cninfo)
PrimaryBiwin 2026 third-quarter report (佰维存储 2026年第三季度报告)Shanghai Stock Exchange filing (cninfo), 2026
PrimaryBiwin Q1 2025 report (佰维存储 2025年第一季度报告)static.cninfo.com.cn
PrimaryBiwin Q1 2026 report (佰维存储 2026年第一季度报告)Shanghai Stock Exchange filing (cninfo)
PrimaryCanon delivers FPA -1200NZ2C nanoimprint lithography system for semiconductor manufacturing to the Texas Institute for ElectronicsCanon Global
PrimaryCanon provides nanoimprint lithography manufacturing equipment to Toshiba MemoryCanon Global
SecondaryCombined Revenue of Top Five Global NAND Flash Suppliers Rose by 83.7% QoQ for 1Q26 as Supply Shortages Drove Price HikesTrendForce
SecondaryCombined Revenue of Top Five NAND Flash Brands Rises 77% QoQ in 2Q26; Micron Moves Up to Third Place, Says TrendForceTrendForce
PrimaryComparison: Latest 3D NAND Products from YMTC, Samsung, SK hynix and MicronTechInsights
PrimaryComparison: Latest 3D NAND Products from YMTC, Samsung, SK hynix and Micron (TechInsights)
PrimaryCorporate profileMicron Technology
SecondaryCrucial P5 Plus SSD review (Tom's Hardware)Tom's Hardware, 2021
PrimaryCXMT 2026 half-year report (full)CXMT
PrimaryCXMT 2026 third-quarter report (长鑫科技 2026年第三季度报告)static.cninfo.com.cn
SecondaryCXMT close to matching MicronYahoo Finance
PrimaryCXMT STAR Market IPO prospectus (May 17, 2026 filing)CXMT
SecondaryDapuStor Roealsen6 R6101 review coverage (TechRadar)TechRadar, 2026
PrimaryDERA product and about pageDERA, 2026
PrimaryDERA TAI controller pageDERA, 2026
PrimaryDEXTAUS quarterly average, 2022Board of Governors of the Federal Reserve System (H.10), via FRED
SecondaryDiverging Memory Market Outlook in 2027 as DRAM Supply Remains Tight While NAND Flash Supply Conditions Ease, Says TrendForceTrendForce
SecondaryDownstream Inventory Reduction Eases DRAM Price Decline in 2Q25, Says TrendForceTrendForce
SecondaryDRAM Consolidation in 2012? (The Memory Guy)The Memory Guy Blog - Jim Handy, Objective Analysis, on Semiconductor Memories, 2011
SecondaryDRAM Industry Revenue Rises 59.5% QoQ in 2Q26 as Supply Expansion Continues to Lag Demand Growth, Says TrendForceTrendForce
SecondaryDRAM Prices to Continue Rising in 4Q25, Server Demand Surges Ahead While Legacy Process Products See Steeper Increases, Says TrendForceTrendForce
SecondaryDRAM Revenue Drops 5.5% in the First Quarter of 2025; SK hynix Overtakes Samsung for Top Spot, Says TrendForceTrendForce
SecondaryDylan Patel: Deep dive on the 3 big bottlenecks to scaling AI computeDwarkesh Podcast, 2026
PrimaryEarnings Presentation: 1Q 2025 Financial ResultsSamsung
PrimaryEarnings Presentation: 1Q 2026 Financial ResultsSamsung
PrimaryEarnings Presentation: 2Q 2025 Financial ResultsSamsung
PrimaryEarnings Presentation: 2Q 2026 Financial ResultsSamsung
PrimaryEarnings Presentation: 3Q 2026 Financial ResultsSamsung Electronics, 2026
PrimaryEarnings Presentation: 4Q 2025 Financial ResultsSamsung
PrimaryEmpowering Communities | SustainabilitySamsung Semiconductor Global, 2026
PrimaryExplainer: SK hynix’s Mid-to-Long-Term Investment StrategySK hynix Newsroom
PrimaryFADU 1Q 2025 resultsNewDaily, 2025
PrimaryFADU 2025 annual results, revenue 92.4 billion wonSidae Ilbo, 2026
PrimaryFADU 2Q 2025 resultsNewDaily, 2025
PrimaryFADU 3Q 2025 revenue 25.6 billion wonHerald Economy, 2025
PrimaryFADU powers record Q3 profit (Chosun Biz English, 3Q 2026 preliminary results)CHOSUNBIZ, 2026
PrimaryFADU: Fiscal 1Q26 Financial ResultsStorageNewsletter, 2026
PrimaryFADU: Fiscal 2Q26 Financial ResultsStorageNewsletter, 2026
PrimaryFirst Quarter of FY2026 Financial ResultsKIOXIA Holdings Corporation
PrimaryFiscal Q4 2026 Earnings Call Prepared RemarksMicron Technology (investor relations)
PrimaryForm 10-K for the fiscal year ended September 3, 2026Kioxia (investor relations)
PrimaryFY2024 Financial ResultsKIOXIA Holdings
PrimaryGIGAFAB® Facilities - Taiwan Semiconductor Manufacturing Company LimitedTSMC
SecondaryGlobal DRAM and HBM Market Share: QuarterlyCounterpoint Research, 2026
SecondaryGlobal DRAM Revenue Jumps 30.9% in 3Q25, Micron’s Market Share Climbs by 3.7 Percentage Points, Says TrendForce (publisher page printed to PDF)TrendForce, 2025
SecondaryGlobal Foundry Revenue Approaches US$53.49 Billion in 2Q26 as SMIC Narrows Market Share Gap with Samsung, Says TrendForceTrendForce
SecondaryGlobal NAND Memory Market Share: QuarterlyCounterpoint Research, 2026
SecondaryGlobal Semiconductor Market records exceptional growth in Q2 2026WSTS
PrimaryGlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AIGlobalFoundries
PrimaryGlobalFoundries Officially Opens US$4 Billion Expansion Facility in Singapore, Creating 1,000 New JobsGlobalFoundries
PrimaryGlobalFoundries selected to operate two new semiconductor fabs in New York under landmark U.S.-Japan initiativeGlobalFoundries
PrimaryGlobalFoundries: Form 20-F for the fiscal year ended December 31, 2025U.S. SEC
PrimaryGlobalWafers (Texas)NIST, 2024
PrimaryGoke Microelectronics 2026 half-year report summaryGoke Microelectronics (9fzt.com), 2026
PrimaryGoke Microelectronics reply to Shenzhen Stock Exchange inquiry (cninfo)Goke Microelectronics (cninfo), 2020
PrimaryH.10 exchange rates: Chinese yuan per US dollar, quarterly averages (DEXCHUS)Board of Governors of the Federal Reserve System (H.10), via FRED
PrimaryH.10 exchange rates: Japanese yen per US dollar, quarterly averages (DEXJPUS)Board of Governors of the Federal Reserve System (H.10), via FRED
PrimaryH.10 exchange rates: Korean won per US dollar, quarterly averages (DEXKOUS)Board of Governors of the Federal Reserve System (H.10), via FRED
PrimaryH.10 exchange rates: New Taiwan dollar per US dollar, quarterly averages (DEXTAUS)Board of Governors of the Federal Reserve System (H.10), via FRED
PrimaryHigh NA EUV reaches new readiness milestone with first high-volume Logic productASML, 2026
PrimaryHistory | Semiconductor Lithography Systemsnikon.com
PrimaryHistory of Yokkaichi PlantKIOXIA Corporation
PrimaryHosin Global at ELEXCON 2025Hosin Global, 2025
SecondaryHow to Build a $20 Billion Semiconductor FabConstruction Physics
PrimaryHua Hong Semiconductor fourth quarter and full year 2025 results announcementHua Hong Semiconductor (HKEX filing)
PrimaryHyperstone S9 SD flash memory controller datasheetCML Microsystems (Mouser datasheet), 2022
PrimaryHyperstone U9 USB evaluation module datasheetHyperstone (Mouser datasheet), 2022
PrimaryHyperstone X1 SATA SSD controller datasheetHyperstone (X-ON datasheet), 2022
PrimaryIndustry-Leading 245TB Micron 6600 ION Data Center SSD Now ShippingMicron Technology
SecondaryInside NVIDIA Rubin GPU ArchitectureNVIDIA, 2026
PrimaryIntel 2025-26 Corporate Responsibility ReportIntel
PrimaryIntel Corporation: Form 10-K for the fiscal year ended December 27, 2025U.S. SEC
PrimaryIntel Reports First-Quarter 2025 Financial Resultssec.gov
PrimaryIntel Reports First-Quarter 2026 Financial ResultsIntel
PrimaryIntel Reports Fourth-Quarter and Full-Year 2025 Financial ResultsIntel
PrimaryIntel Reports Second-Quarter 2025 Financial Resultssec.gov
PrimaryIntel Reports Second-Quarter 2026 Financial ResultsIntel
PrimaryIntel Reports Third-Quarter 2025 Financial ResultsIntel
PrimaryIntel Reports Third-Quarter 2026 Financial ResultsIntel Corporation
PrimaryIntel Unveils Panther Lake Architecture: First AI PC Platform Built on 18AIntel
PrimaryIntel’s New Fab in Ireland Begins High-Volume Production of Intel 4...Intel
PrimaryJCET Group —— Worldwide LocatIonsJCET
PrimaryJCET press release: JCET Reports 79.4% YoY Growth in H1 2026 Net Profit Attributable to Shareholders, Accelerates Advanced Packaging ExpansionJCET
PrimaryJCET press release: JCET to Build an Automotive Chip Advanced Packaging Flagship Factory in ChinaJCET
PrimaryJCET Reports 42.7% YoY Surge in Q1 2026 Net Profit Attributable to ShareholdersJCET Group
PrimaryJEDEC and industry leaders release JESD270-4 HBM4 standardJEDEC, 2025
PrimaryJMicron at Computex 2014 (press release)JMicron, 2014
PrimaryJune 2025 Revenue AnnouncementPhison
PrimaryKioxia and Sandisk Announce Beginning of Operation of Fab2 at Kitakami Plant, Japan to Meet the Market Demand Driven by AIKioxia Singapore Pte. Ltd.
PrimaryKioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products at Kitakami Plant Fab2KIOXIA Corporation
PrimaryKioxia and Sandisk to Invest Over $31 Billion in Japan, Extending Leadership in Memory IndustryKIOXIA Corporation
PrimaryKIOXIA Announces Industry’s First 245.76 TB NVMe SSD Built for the Demands of Generative AI EnvironmentsKIOXIA America, Inc.
PrimaryKioxia client SSD briefKioxia, 2025
PrimaryKioxia CM7 and CD8P SSD news releaseKioxia, 2023
PrimaryKioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power ConsumptionKioxia
PrimaryKioxia Corporation Unveils 5th-Generation BiCS FLASH™Kioxia
PrimaryKioxia Holdings: Consolidated Financial Results for the Six Months Ended September 30, 2026Kioxia Holdings, 2026
PrimaryKioxia Holdings: First Quarter of FY2025 Financial Resultsssl4.eir-parts.net
PrimaryKioxia Holdings: First Quarter of FY2026 Financial ResultsKIOXIA Holdings Corporation
PrimaryKioxia Holdings: FY2025 Financial Resultsssl4.eir-parts.net
PrimaryKioxia Holdings: Second Quarter of FY2025 Financial Resultsssl4.eir-parts.net
PrimaryKioxia Holdings: Third Quarter of FY2025 Financial Results (presentation)KIOXIA Holdings
PrimaryKitakami Plant (KIOXIA Iwate Corporation)Kioxia
PrimaryKLA Invests in Operations in Wales with the Opening of a $138 Million R&D and Manufacturing FacilityKLA Corporation
PrimaryLam Manufacturing Malaysia (careers page)Lam Research
PrimaryLam Research to Expand Global FootprintLam Research Newsroom
PrimaryLocationsPowertech Technology Inc.
PrimaryLongsys 2025 annual report (江波龙 2025年年度报告)Shenzhen Stock Exchange filing (cninfo)
PrimaryLongsys 2025 half-year report (江波龙 2025年半年度报告)static.cninfo.com.cn
PrimaryLongsys 2025 third-quarter report (江波龙 2025年第三季度报告)static.cninfo.com.cn
PrimaryLongsys 2026 half-year report (江波龙 2026年半年度报告)Shenzhen Stock Exchange filing (cninfo)
PrimaryLongsys 2026 third-quarter report (江波龙 2026年三季度报告)Shenzhen Stock Exchange filing (cninfo), 2026
PrimaryLongsys Q1 2025 report (江波龙 2025年第一季度报告)static.cninfo.com.cn
PrimaryLongsys Q1 2026 report (江波龙 2026年一季度报告)Shenzhen Stock Exchange filing (cninfo)
PrimaryMacronix Announces 1Q 2025 ResultsMacronix International
PrimaryMacronix Announces 1Q 2026 ResultsMacronix International
PrimaryMacronix Announces 2Q 2025 ResultsMacronix International
PrimaryMacronix Announces 2Q 2026 ResultsMacronix International
PrimaryMacronix Announces 3Q 2025 ResultsMacronix International
PrimaryMacronix Announces 4Q 2025 ResultsMacronix International
PrimaryMacronix International Third Quarter 2026 ResultsMacronix International (TWSE MOPS), 2026
PrimaryManufacturing sites | ManufacturingSamsung Semiconductor Global, 2025
PrimaryMarvell Technology, Inc. Reports First Quarter of Fiscal Year 2026 Financial Resultssec.gov
PrimaryMarvell Technology, Inc. Reports First Quarter of Fiscal Year 2027 Financial ResultsMarvell Technology
PrimaryMarvell Technology, Inc. Reports Fourth Quarter and Fiscal Year 2026 Financial ResultsMarvell Technology
PrimaryMarvell Technology, Inc. Reports Second Quarter of Fiscal Year 2026 Financial Resultssec.gov
PrimaryMarvell Technology, Inc. Reports Second Quarter of Fiscal Year 2027 Financial ResultsMarvell Technology
PrimaryMaxio Technology 2025 annual report (2025年年度报告)Shanghai Stock Exchange filing (cninfo)
PrimaryMaxio Technology 2025 half-year report (联芸科技 2025年半年度报告)static.cninfo.com.cn
PrimaryMaxio Technology 2025 third-quarter report (联芸科技 2025年第三季度报告)static.cninfo.com.cn
PrimaryMaxio Technology 2026 half-year report (2026年半年度报告)Shanghai Stock Exchange filing (cninfo)
PrimaryMaxio Technology 2026 third-quarter report (2026年第三季度报告)static.cninfo.com.cn, 2026
PrimaryMaxio Technology Q1 2025 report (联芸科技 2025年第一季度报告)static.cninfo.com.cn
PrimaryMaxio Technology Q1 2026 report (2026年第一季度报告)Shanghai Stock Exchange filing (cninfo)
SecondaryMemory Makers Prioritize Server Applications, Driving Across-the-Board Price Increases in 1Q26, Says TrendForceTrendForce
SecondaryMemory Price Outlook for 1Q26 Sharply Upgraded; QoQ Increases of All Product Categories to Hit Record Highs, Says TrendForceTrendForce
SecondaryMemory Prices Soar; DRAM and NAND Flash to Account for 68% of Major CSP CapEx in 2027, Says TrendForceTrendForce
PrimaryMeta’s Infrastructure Evolution and the Advent of AIMeta, 2025
PrimaryMicrochip introduces Flashtec NVMe 5016 PCIe Gen 5 SSD controller family (press release)Microchip Technology, 2024
SecondaryMicron 4600 SSD review (Tom's Hardware)Tom's Hardware, 2025
PrimaryMicron 9550 SSD product flyerMicron, 2024
PrimaryMicron Announces Shipment of 1γ (1-gamma) DRAM: Pioneering Memory Technology Advancements for Future Compute NeedsMicron Technology
PrimaryMicron Form 10-K, fiscal year ended September 3, 2026U.S. SEC
SecondaryMicron says high bandwidth memory is sold out for 2024 and most of 2025: intense demand portends potential AI GPU production bottleneckTom's Hardware, 2024
PrimaryMicron Ships World’s First 232-Layer NAND, Extends Technology LeadershipMicron
PrimaryMicron Technology Form 10-K for fiscal 2000Micron Technology (SEC EDGAR), 2000
PrimaryMicron Technology Form 10-K for fiscal 2005Micron Technology (SEC EDGAR), 2005
PrimaryMicron Technology Form 10-K for fiscal 2010Micron Technology (SEC EDGAR), 2010
PrimaryMicron Technology Form 10-K for fiscal 2015Micron Technology (SEC EDGAR), 2015
PrimaryMicron Technology Form 10-K for fiscal 2020Micron Technology (SEC EDGAR), 2020
PrimaryMicron Technology Form 10-K for fiscal 2023Micron Technology (SEC EDGAR), 2023
PrimaryMicron Technology, Inc. Reports Record Fiscal Fourth-Quarter and Full-Year 2026 ResultsMicron Technology
PrimaryMicron Technology, Inc. Reports Results for the First Quarter of Fiscal 2026U.S. SEC
PrimaryMicron Technology, Inc. Reports Results for the Fourth Quarter and Full Year of Fiscal 2025sec.gov
PrimaryMicron Technology, Inc. Reports Results for the Second Quarter of Fiscal 2025U.S. SEC
PrimaryMicron Technology, Inc. Reports Results for the Second Quarter of Fiscal 2026U.S. SEC
PrimaryMicron Technology, Inc. Reports Results for the Third Quarter of Fiscal 2025U.S. SEC
PrimaryMicron Technology, Inc. Reports Results for the Third Quarter of Fiscal 2026sec.gov
PrimaryMicron to Bring EUV Technology to Japan, Advancing Next-Generation Memory ManufacturingMicron, 2023
SecondaryNAND Flash Prices to Rise 5–10% in 4Q25, Driven by Spillover Demand for QLC Products, Says TrendForceTrendForce
SecondaryNAND Flash Revenue Surged Over 20% in 2Q25, SK Group Market Share Jumped to 21%, Says TrendForceTrendForce
SecondaryNAND Flash Supply Growth to Outpace Demand in 2027, Easing Supply Constraints in 2H27, Says TrendForceTrendForce
PrimaryNanoimprint lithography semiconductor manufacturing system that covers diverse applications with simple patterning mechanismCanon Global
PrimaryNanya consolidated income statement, 2025 Q1 (TWSE MOPS, English)Nanya (TWSE MOPS filing), 2025
PrimaryNanya consolidated income statement, 2025 Q2 (TWSE MOPS, English)Nanya (TWSE MOPS filing), 2025
PrimaryNanya consolidated income statement, 2025 Q3 (TWSE MOPS, English)Nanya (TWSE MOPS filing), 2025
PrimaryNanya Technology New Fab Groundbreaking CeremonyNanya Technology
PrimaryNanya Technology Reports Results for 1Q26Nanya Technology
PrimaryNanya Technology Reports Results for 2Q26Nanya Technology
PrimaryNanya Technology Reports Results for 4Q25Nanya Technology
PrimaryNanya Technology Third Quarter 2026 ResultsNanya Technology (TWSE MOPS), 2026
SecondaryNavigating the Costly Economics of Chip MakingBCG Global, 2023
PrimaryNew Facility Investment for Yongin Semiconductor ClusterSK hynix Newsroom
PrimaryNews - Winbond Announced Q1 2025 Business Results - WinbondWinbond Electronics
PrimaryNews - Winbond Announced Q2 2025 Business Results - WinbondWinbond Electronics
PrimaryNews - Winbond Announces 2025 Full Year Business Results - WinbondWinbond Electronics
PrimaryNews - Winbond Announces Q1 2026 Business Results - WinbondWinbond Electronics
PrimaryNews - Winbond Announces Q2 2026 Business Results - WinbondWinbond Electronics
PrimaryNews - Winbond Announces Q3 2025 Business Results - WinbondWinbond Electronics
PrimaryNews - Winbond Announces Q3 2026 Business Results - Winbondwinbond.com
PrimaryNikon Annual Report 2006nikon.com
PrimaryNIST CAVP certificate A4449, SK hynix Atomos-Prime ACNT081MNIST CAVP, 2023
PrimaryNVIDIA Announces Financial Results for First Quarter Fiscal 2026sec.gov
PrimaryNVIDIA Announces Financial Results for First Quarter Fiscal 2027NVIDIA
PrimaryNVIDIA Announces Financial Results for Fourth Quarter and Fiscal 2026NVIDIA
PrimaryNVIDIA Announces Financial Results for Second Quarter Fiscal 2026sec.gov
PrimaryNVIDIA Announces Financial Results for Second Quarter Fiscal 2027NVIDIA
PrimaryNVIDIA Announces Financial Results for Third Quarter Fiscal 2026sec.gov
PrimaryNVIDIA Form 10-K, fiscal year ended January 25, 2026NVIDIA (SEC EDGAR)
SecondaryOff-Season Slowdown and Inventory Pressure Drive Over 20% QoQ Revenue Drop for Top Five NAND Flash Brands in 1Q25, Says TrendForce (publisher page printed to PDF)TrendForce, 2025
PrimaryOur history - Supplying the semiconductor industryASML
PrimaryPhison consolidated income statement, 2025 Q2 (TWSE MOPS, English)Phison (TWSE MOPS filing), 2025
PrimaryPhison consolidated income statement, 2026 Q1 (TWSE MOPS, English)Phison (TWSE MOPS filing), 2026
PrimaryPhison Electronics consolidated income statement, 2026 Q3 (TWSE MOPS, English)Phison Electronics (TPEx, TWSE MOPS filing), 2026
PrimaryPhison PS5021-E21T in the Micron 2550 (Phison news)Phison, 2024
PrimaryPowerchip Semiconductor Manufacturing Corp.: manufacturing servicesPowerchip (PSMC)
SecondaryPrice Rally Drives 4Q25 DRAM Revenue Up 29.4%; Samsung Regains No. 1 Market Share, Says TrendForceTrendForce
PrimaryPSMC contact information (Japan)Powerchip (PSMC)
PrimaryPSMC press release: PSMC Completes P5 Plant Transaction; 3D AI Foundry Set to SoarPowerchip (PSMC)
PrimaryPSMC press release: PSMC's Tongluo New Fab Inauguration Attracts Attention from Domestic and Foreign LeadersPowerchip (PSMC)
PrimaryPSMC press release: Strong DRAM Demand Drives PSMC to Accelerate Advancement in Foundry ProcessesPowerchip (PSMC)
SecondaryRapid Contract Price Surge Drives 1Q26 DRAM Industry Up 81% QoQ, Says TrendForceTrendForce
PrimaryRapidus CorporationRapidus Corporation
PrimaryRealtek investor relations contact pageRealtek, 2026
PrimaryRealtek Investor Relations FAQsRealtek, 2026
SecondaryRealtek SSD controller roadmap (Tom's Hardware)Tom's Hardware, 2024
SecondaryRecent News ReleaseWSTS
SecondarySamsung 9100 Pro SSD review (PC Gamer)PC Gamer, 2025
SecondarySamsung 990 EVO SSD review (Tom's Hardware)Tom's Hardware, 2024
SecondarySamsung 990 Pro SSD review (Tom's Hardware)Tom's Hardware, 2022
PrimarySamsung Announces Industry’s First EUV DRAM with Shipment of First Million ModulesSamsung, 2020
PrimarySamsung Announces Operation of its Memory Facility in Xi'an, ChinaSamsung Electronics, 2014
PrimarySamsung Electronics (Texas)NIST, 2024
PrimarySamsung Electronics Begins Mass Production at New EUV Manufacturing Line (publisher page printed to PDF)Samsung, 2020
PrimarySamsung Electronics Begins Mass Production at New Semiconductor Plant in Pyeongtaek, South KoreaSamsung Electronics, 2017
PrimarySamsung Electronics Earnings Presentation: 3Q 2025 Financial ResultsSamsung Electronics
PrimarySamsung Electronics Expands its Foundry Capacity with A New Production Line in Pyeongtaek, KoreaSamsung Newsroom
PrimarySamsung Electronics interim consolidated financial statements, 2Q 2026images.samsung.com
PrimarySamsung Electronics interim consolidated financial statements, 3Q 2025images.samsung.com
PrimarySamsung Now Mass Producing Industry’s Most Advanced 4Gb DDR3, Using 20 Nanometer Process TechnologySamsung, 2014
PrimarySamsung Starts Mass Producing Industry’s First 10-Nanometer Class DRAMSamsung, 2016
PrimarySamsung Starts Mass Production of Most Advanced 14nm EUV DDR5 DRAMSamsung, 2021
PrimarySamsung Unveils Next-Gen 3D-Memory Vision at FMS 2026, Charting the Future of AI InfrastructureSamsung Semiconductor, 2026
PrimarySamsung Unveils Next-Gen 3D-Memory Vision at FMS 2026, Charting the Future of AI Infrastructure (Samsung page printed to PDF)Samsung Semiconductor, 2026
SecondarySanDisk Investor Day: Caching Out the NAND Cycle with ContractsCounterpoint Research, 2026
PrimarySandisk Reports Fiscal First Quarter 2026 Financial ResultsU.S. SEC
PrimarySandisk Reports Fiscal First Quarter 2027 Financial Resultssec.gov
PrimarySandisk Reports Fiscal Fourth Quarter 2025 Financial Resultssec.gov
PrimarySandisk Reports Fiscal Fourth Quarter 2026 Financial ResultsU.S. SEC
PrimarySandisk Reports Fiscal Second Quarter 2026 Financial ResultsU.S. SEC
PrimarySandisk Reports Fiscal Third Quarter 2025 Financial ResultsU.S. SEC
PrimarySandisk Reports Fiscal Third Quarter 2026 Financial ResultsSandisk, 2026
PrimaryScaleFlux SFX 5016 first look (press release)ScaleFlux, 2024
PrimarySeagate Delivers Industry’s Highest Capacity Hard Drives with Next-Generation Mozaic 4+Seagate Technology, 2026
PrimarySeagate Form 10-K, fiscal year ended July 3, 2026Seagate Technology (SEC EDGAR)
PrimarySeagate Introduces Hard Drive Capacities of Up to 36TB, Extending Its HAMR-Based Mozaic 3+ Technology PlatformSeagate Technology, 2025
PrimarySeagate supplemental financial information, FQ1 FY2026s24.q4cdn.com
PrimarySeagate supplemental financial information, FQ2 FY2026s24.q4cdn.com
PrimarySeagate supplemental financial information, FQ3 FY2025s24.q4cdn.com
PrimarySeagate supplemental financial information, FQ3 FY2026Seagate Technology
PrimarySeagate supplemental financial information, FQ4 FY2025Seagate Technology
PrimarySeagate supplemental financial information, FQ4 FY2026Seagate Technology
PrimarySeagate Technology Reports Fiscal First Quarter 2026 Financial ResultsU.S. SEC
PrimarySeagate Technology Reports Fiscal First Quarter 2027 Financial Results (8-K Exhibit 99.1)Seagate Technology (SEC EDGAR), 2026
PrimarySeagate Technology Reports Fiscal Fourth Quarter and Fiscal Year 2025 Financial Resultssec.gov
PrimarySeagate Technology Reports Fiscal Fourth Quarter and Fiscal Year 2026 Financial ResultsU.S. SEC
PrimarySeagate Technology Reports Fiscal Second Quarter 2026 Financial ResultsU.S. SEC
PrimarySeagate Technology Reports Fiscal Third Quarter 2025 Financial ResultsU.S. SEC
PrimarySeagate Technology Reports Fiscal Third Quarter 2026 Financial ResultsU.S. SEC
PrimarySeagate’s Breakthrough 30TB+ Hard Drives Ramp Volume, Marking an Inflection Point in the Storage IndustrySeagate Technology, 2024
SecondarySEMI Projects 300mm Memory Equipment Investment to Surpass $50 Billion in 2026SEMI
SecondarySEMI Projects Double-Digit Growth in Global 300mm Fab Equipment Spending for 2026 and 2027SEMI
SecondaryServer-Led eSSDs Hit 48% of NAND Shipments; YMTC Enters Global Top ThreeCounterpoint Research, 2026
PrimaryShin-Etsu Chemical: global network, plantsShin-Etsu Chemical Co., Ltd.
PrimarySilicon Motion Announces Results for the Fourth Quarter and Year Ended December 31, 2025U.S. SEC
PrimarySilicon Motion Announces Results for the Period Ended June 30, 2025sec.gov
PrimarySilicon Motion Announces Results for the Period Ended March 31, 2025U.S. SEC
PrimarySilicon Motion Announces Results for the Period Ended September 30, 2025U.S. SEC
PrimarySilicon Motion Announces Results for the Quarterly Period Ended June 30, 2026U.S. SEC
PrimarySilicon Motion Announces Results for the Quarterly Period Ended March 31, 2026U.S. SEC
PrimarySilicon Motion Announces Results for the Quarterly Period Ended September 30, 2026GlobeNewswire News Room, 2026
PrimarySite Data│Sustainability│SUMCO CORPORATIONSUMCO
PrimarySK hynix Announces 1Q25 Financial ResultsSK hynix Newsroom
PrimarySK hynix Announces 1Q26 Financial ResultsSK hynix Newsroom
PrimarySK hynix Announces 2Q25 Financial ResultsSK hynix Newsroom
PrimarySK hynix Announces 2Q26 Financial ResultsSK hynix Newsroom
PrimarySK hynix Announces 3Q25 Financial ResultsSK hynix Newsroom
PrimarySK hynix Announces 3Q26 Financial ResultsSK hynix Newsroom
PrimarySK hynix Announces FY25 Financial ResultsSK hynix Newsroom
PrimarySK hynix Announces the Completion of M16 Plant ConstructionSK hynix
PrimarySK hynix company historySK hynix
PrimarySK hynix completes the First Phase of Intel NAND and SSD Business AcquisitionSK hynix Newsroom
PrimarySK hynix Global NetworkSK hynix
PrimarySK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI”SK hynix Newsroom
PrimarySK hynix Introduces Industry’s First Commercial High NA EUVSK hynix Newsroom
PrimarySK hynix Introduces Industry's First Commercial High NA EUV (publisher page printed to PDF)SK hynix, 2025
PrimarySK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory DemandSK hynix Newsroom
SecondarySK hynix Platinum P41 SSD review (Tom's Hardware)Tom's Hardware, 2022
SecondarySK hynix Platinum P51 SSD review (StorageReview)StorageReview, 2025
PrimarySK hynix Starts Mass Production of 1anm DRAM Using EUV EquipmentSK hynix
PrimarySK hynix’s Global CSR Initiatives: Creating Happiness by Connecting People & TechnologySK hynix Newsroom
PrimarySMIC 2025 Annual ReportHKEX filing
PrimarySMIC Shanghai Starts Construction of a New 12-Inch Wafer FabSMIC
PrimarySolidigm D7-P5520 FIPS 140-3 Security Policy (CMVP 4866)Solidigm, NIST CMVP, 2024
PrimarySolidigm Extends AI Portfolio Leadership with the Introduction of 122TB Drive, the World’s Highest Capacity PCIe SSDSolidigm newsroom, 2024
PrimarySolidigm Honored as Stevie® Award Winner in 2025 for the Solidigm 122TB D5-P5336 SSDSolidigm newsroom, 2025
PrimarySolidigm Introduces the World’s Highest Capacity PCIe SSD for Massive Data Storage From Core to Edge - Interfax NewswireBusiness Wire
PrimarySSX600 series lithography systems (product page)smee.com.cn
PrimaryStarblaze SSD controller product listStarblaze, 2026
PrimaryStarblaze STAR1000P product pageStarblaze, 2026
PrimarySwissbit strengthens growth strategy with the acquisition of Hyperstone (press release)Swissbit, 2020
PrimaryTaylor | US FabSamsung Semiconductor Global, 2025
PrimaryTenaFe TC2201 product pageTenaFe, 2026
SecondaryThe Cost Per Gigabyte of Hard Drives Over TimeBackblaze, 2022
PrimaryThe First 12-inch Wafer Fab in China Mainland Starts Production SuccessfullySMIC
SecondaryThree companies held 94% of the 2021 DRAM marketEvertiq
PrimaryThree decades of PAS 5500ASML, 2021
SecondaryTight DRAM Supply Gives Suppliers Greater Pricing Power in HBM, with HBM Contract Prices Expected to Surge Multiples Higher in 2027, Says TrendForceTrendForce
PrimaryTokyo Electron Corporate Profile (April 2026)Tokyo Electron
PrimaryToshiba Memory and Western Digital Celebrate the Opening of Fab 6 and Memory R&D Center at Yokkaichi, JapanToshiba Memory and Western Digital
PrimaryTower Semiconductor: manufacturing overviewTower Semiconductor, 2018
PrimaryTranscend Information consolidated income statement, 2025 Q1 (TWSE MOPS, English)Transcend Information (TWSE MOPS filing), 2025
PrimaryTranscend Information consolidated income statement, 2025 Q2 (TWSE MOPS, English)Transcend Information (TWSE MOPS filing), 2025
PrimaryTranscend Information consolidated income statement, 2025 Q3 (TWSE MOPS, English)Transcend Information (TWSE MOPS filing), 2025
PrimaryTranscend Information consolidated income statement, 2025 Q4 (TWSE MOPS, English)Transcend Information (TWSE MOPS filing), 2025
PrimaryTranscend Information consolidated income statement, 2026 Q1 (TWSE MOPS, English)Transcend Information (TWSE MOPS filing), 2026
PrimaryTranscend Information consolidated income statement, 2026 Q2 (TWSE MOPS, English)Transcend Information (TWSE MOPS filing), 2026
PrimaryTranscend Information consolidated income statement, 2026 Q3 (TWSE MOPS, English)Transcend Information (TWSE MOPS filing), 2026
SecondaryTransition between DRAM Generations Drives Diverging 3Q25 Price Trends; Consumer DDR4 Prices Expected to Surge Over 40%, Says TrendForceTrendForce
PrimaryTSMC 1Q25 earnings releaseTSMC
PrimaryTSMC 1Q26 earnings releaseTSMC
PrimaryTSMC 2025 Annual ReportTSMC, 2026
PrimaryTSMC 2Q25 earnings releaseTSMC
PrimaryTSMC 2Q26 earnings releaseTSMC
PrimaryTSMC 3Q25 earnings releaseTSMC
PrimaryTSMC 3Q26 Earnings ReleaseTSMC, 2026
PrimaryTSMC 4Q25 earnings releaseTSMC
PrimaryTSMC ArizonaNIST, 2024
PrimaryTSMC Fabs - Taiwan Semiconductor Manufacturing Company LimitedTSMC
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