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Samsung HBM share projected to hit 40% as 2nm yields surpass 70%
KB Securities forecasts Samsung's HBM market share will rise from 33% to 40% by Q4 2026, driven by stabilized 2nm foundry yields and HBM4 revenue tripling.
The storage beat
News
Sourced reporting on NAND, SSD, DRAM, and the controllers that make them behave — rewritten for engineers, not press-release readers.
18 stories from the desk Published feed. Primary sources first, then a sourced rewrite for readers. Last update .
Latest on the wire
Lead story.
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Earlier coverage.
Newest first after the lead.
- NewsCXMT LPDDR5X Enters Nubia NaviX Ultra Supply Chain at 10.667GbpsChangXin Memory Technologies is supplying LPDDR5X for the ZTE and ByteDance joint venture flagship, marking a shift in high-end Chinese smartphone memory sourcing. · TrendForce
- NewsCXMT and YMTC Form HBM United Front to Bypass US Export ControlsChina's top DRAM and NAND makers are collaborating on high-bandwidth memory to secure AI infrastructure supply amid tight global constraints. · mk.co.kr
- NewsSanDisk pitches High Bandwidth Flash as HBM alternative, claiming 4TB per GPU in AI inference testsSanDisk presented High Bandwidth Flash (HBF) at FMS 2026, proposing NAND stacking to deliver 10 to 100 times the capacity of DRAM-based HBM for large-scale AI inference. · PC Watch
- NewsCXMT HBM3E Yields Reportedly Stuck at 25% Due to TSV ImmaturitySouth Korean media reports indicate CXMT's risk production of HBM3E is facing significant technical hurdles, with three out of four stacks reportedly defective. · TechPowerUp
- NewsKepler Computing Emerges to Build HBM Alternative Using FeRAM, Targeting Mature Semiconductor NodesAfter seven years in stealth, the startup claims to convert 28 nm fabs into memory production lines in eight months, bypassing EUV lithography. · TechPowerUp
- NewsSamsung Targets 2028 for High NA EUV DRAM Adoption, Backed by Industry Shift to 12-Inch PhotomasksSamsung Electronics announced a major technological roadmap update, detailing plans to integrate ASML’s High NA extreme ultraviolet (EUV) lithography into High-Volume. · Storage Review
- NewsChinese Quartz Supplier Achieves DRAM Qualification - But Foundational Material Monopolies PersistThe domestic supply chain for process consumables is maturing, yet the global control over ultra-high-purity fused quartz remains intact. · Tom's Hardware
- NewsTLB Debuts 8,600 MT/s PCBs for SOCAMM and CXL at KPCA Show 2026TLB expands its memory module portfolio with high-speed PCBs for AI servers and EDSFF SSDs, marking its first independent booth at the Incheon exhibition. · thelec.net
- MarketHuawei Ascend 950DT Price Jumps 50% as HBM Shortage Bites Chinese AI ChipmakersGray market HBM costs are driving a 20-50% price surge for Huawei and Cambricon accelerators, exposing a critical supply chain bottleneck. · TechNews
- NewsMicron Eyes JDI's Mobara Fab for Back-End Packaging Amid HBM Capacity CrunchThe reported KRW 500 billion acquisition target offers a shortcut to assembly capacity as AI memory demand outpaces new construction timelines. · TrendForce
- NewsIDC survey: 94.7% of firms stored more data in 12 months as AI drives 'compound cycle'A WD-sponsored IDC white paper finds that 75.9% of companies are now re-using archived cold data for AI workloads, collapsing the traditional active/archive boundary. · TechNews
- MarketDDR4 Spot Prices Rise Amid Commodity Weakness - AI Infrastructure Drives Specialized Storage GrowthMarket activity shows a clear bifurcation: general consumer demand struggles, while high-performance, AI-optimized components maintain strong pricing power. · TrendForce
- MarketKioxia Denies SK hynix Joint Production Talks, Citing Antitrust Hurdles Amid AI-Driven NAND Price Stability PushKioxia CEO Hiroo Ota stated that closer cooperation with SK hynix would face antitrust hurdles, prioritizing price stability over shared manufacturing risk. · TrendForce
- MarketSK hynix CEO Kwak Noh-Jung: Memory market has shifted from 'straight road' to 'winding road'At the 2026 Future Forum, SK hynix framed its AI strategy around reading external change, a pivot corroborated by record controller revenues and GPU-optimized SSD awards. · SK hynix
- NewsSamsung and ASML to Integrate High-NA EUV into DRAM Manufacturing by 2028The partnership aims to eliminate lithography stitching constraints and extend the DRAM scaling roadmap for AI-driven memory demand. · thelec.net
- NewsMeta and Panmnesia Propose CXL-Based Architecture to Make Data Centers Function as Single ChipsA new Nature Reviews paper details a CXL fabric that reduces inter-rack latency by up to 90% and scales a single CPU's accelerator management from two to 16. · thelec.net
- NewsPhison posts record August revenue with 377% YoY jump on AI storage demandNAND controller maker Phison reports its highest-ever monthly and cumulative revenue, driven by surging PCIe SSD shipments for AI infrastructure. · TechNews
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