Samsung outlines CUBE, with HBM5, zHBM and zNAND-O, at a SEMICON Taiwan summit (opens in a new tab)
In a keynote before SEMICON Taiwan, a Samsung memory executive presented a 3D strategy covering HBM5, zHBM, which stacks memory directly on the processor, and zNAND-O, a stacked NAND product for large models. This is a press report; the company page was not found.
The Korea Herald ·
Reported by The Korea Herald; the company has not confirmed it yet.