Intel Foundry and ASML announced that Intel has processed more than one million 300mm wafers on High-NA EUV scanners. This milestone was disclosed at the SPIE Photomask Technology and EUV Lithography conference in Monterey. The figure represents a significant share of the global total, as ASML reported that its High-NA systems have collectively exposed only 1.35 million wafers to date. This places Intel at approximately 74% of the total High-NA wafer exposure across the industry, surpassing the combined output of competitors including TSMC, Samsung, and SK Hynix.
Panther Lake on Intel 18A
The one million wafer count includes a mix of tool certification runs, research and development projects, and volume production. Specifically, the production component involves Intel’s Core Ultra Series 3 CPUs, known as Panther Lake. The joint press release clarifies that this is not a count of one million commercial-grade Panther Lake wafers, but rather a cumulative total of all wafers processed on the new lithography equipment. ASML noted that ten High-NA systems are currently running at four customers, with three more units in the process of being shipped or installed (TrendForce).
74% of global High-NA exposure
Intel’s claim of processing one million High-NA EUV wafers signals a major shift in the advanced lithography landscape. By accounting for roughly three-quarters of the total High-NA wafers exposed by ASML, Intel has established a significant lead in the adoption of this next-generation technology. This is particularly notable given that High-NA EUV is critical for manufacturing leading-edge logic chips, including Intel’s Panther Lake processors. The high volume of wafers processed, even when including R&D and certification, suggests that Intel has moved beyond initial pilot phases into a more mature stage of High-NA integration.
Intel stock up 155% year-to-date
This achievement occurs against a backdrop of renewed investor confidence in Intel’s foundry ambitions. Intel’s stock price has risen nearly 155% year-to-date, supported by new collaborations and equity stakes from Nvidia and the US government. The company is positioning itself as a key player in the AI chip race, leveraging its early adoption of High-NA EUV technology to differentiate its manufacturing capabilities from other leading foundries. This could impact the competitive dynamics in the foundry market, as Intel may now have a more robust track record with High-NA EUV than its peers, potentially attracting more external customers seeking cutting-edge manufacturing capabilities.
Competing with TSMC and Samsung
The significance of this milestone lies in its potential to validate Intel’s foundry strategy and its ability to compete with TSMC and Samsung in the most advanced segments of the semiconductor industry. While Samsung’s 2nm yields have recently improved to above 70%, Intel’s early volume production with High-NA EUV provides a distinct advantage in process maturity. For storage and semiconductor readers, this development highlights the increasing importance of advanced lithography in enabling the next generation of AI accelerators and high-performance computing platforms, where manufacturing capability is a key differentiator.