ASML and TSMC have announced a collaborative initiative to lead the semiconductor industry’s transition to a larger-format Extreme Ultraviolet (EUV) lithography photomask, specifically moving to 12-inch formats for High-NA EUV systems. While High-NA EUV will be adopted for production using the current 6-inch masks, the transition to larger 12-inch masks is expected to further increase fab productivity, lower chipmaking costs, and remove stitching constraints, benefiting the entire semiconductor industry.
12-inch masks remove stitching constraints
The move to 12-inch masks addresses a critical bottleneck in advanced logic manufacturing. By increasing the mask size, the number of stitching steps required for complex patterns is reduced, which can improve yield and reduce defect rates in advanced nodes. This infrastructure change signals a shift in capital expenditure toward mask-making infrastructure and alignment with ASML’s High-NA roadmap, ensuring that mask suppliers and foundries align on the new physical requirements for next-generation logic chips.
Q2 DRAM contract prices up 59.5%
This development occurs against a backdrop of intense memory market volatility. TrendForce reported that Q2 DRAM contract prices rose 59.5% quarter-over-quarter, pushing DRAM quarterly revenue to nearly $154.73 billion. Suppliers are maintaining historic low inventories, prioritizing server allocations over consumer segments. In Q3, conventional DRAM contract price growth of 13-18% QoQ is expected, with consumer DRAM posting the strongest price growth as suppliers have significantly curtailed supply.
Kioxia CEO dismisses Hynix tie-up
Strategic realignment in the memory sector is also underway. Kioxia CEO Hiroo Ota dismissed reports of a joint production venture with SK hynix. Ota told Bloomberg TV, “We have no idea what prompted him to say what he did,” emphasizing that the companies are not in talks about joint production.
OpenAI expands Samsung joint R&D
The strategic landscape is further complicated by deepening ties between AI model developers and memory suppliers. OpenAI has expanded its cooperation with Samsung Electronics, moving beyond memory supply to joint R&D and production of next-generation chips. OpenAI Korea General Manager Harrison Kim stated that the two parties have “made the most significant progress” in next-generation chip development, though details remain undisclosed. This shift suggests that memory manufacturers are becoming more integrated into the AI hardware design process (TechNews).
SK hynix 2026 Future Forum direction
SK hynix continues to emphasize its role in the AI era, holding its 2026 Future Forum to define the direction of memory technology in response to AI-driven demand. The forum, themed “The Golden Time of the AI Era,” focused on examining what the company should do and defining the direction in which memory should advance. This strategic positioning highlights the dual pressure on the supply chain: advanced logic requires new mask standards, while memory requires capacity expansion and strategic alignment with AI demand.