<?xml version="1.0" encoding="UTF-8"?>
<rss version="2.0" xmlns:atom="http://www.w3.org/2005/Atom">
  <channel>
    <title>Eyes on Flash Weekly industry recap</title>
    <link>https://eyesonflash.com/news/</link>
    <description>A Friday recap of the week in NAND, DRAM, SSDs, standards and the market.</description>
    <language>en-us</language>
    <atom:link href="https://eyesonflash.com/news/weekly/rss.xml" rel="self" type="application/rss+xml" />
    <item>
      <title>Memory Moves Onto Logic, Kioxia Stays Out of HBF, and DRAM Costs Reach Hobby Boards</title>
      <link>https://eyesonflash.com/news/weekly/2026-w45/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w45/</guid>
      <pubDate>Fri, 06 Nov 2026 12:00:00 GMT</pubDate>
      <description>October 31 to November 6, 2026. The biggest technical thread this week was memory built directly on top of logic. Qualcomm says its first stacked memory silicon works in the lab, and new papers look at running AI work inside DRAM and on high bandwidth flash. On the NAND side, the two partners that share a fab are taking different paths on HBF, and a report says Solidigm is weighing new US fabs. Tight memory supply also showed up far from the data center, with Raspberry Pi raising prices on its largest memory boards. Industry sales data and a wafer supply deal for Micron round out the market news, and Eyes on Flash added several new guides and a hard drive timeline.</description>
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    <item>
      <title>Record Memory Earnings, Solidigm Weighs US Capacity, and Kioxia Folds In a Fab</title>
      <link>https://eyesonflash.com/news/weekly/2026-w44/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w44/</guid>
      <pubDate>Fri, 30 Oct 2026 12:00:00 GMT</pubDate>
      <description>October 24 to October 30, 2026. Earnings season set the tone. SK hynix reported record quarterly results and Seagate reported its fiscal first quarter, both leaning on AI demand. On the NAND side, SK hynix told investors that Solidigm is reviewing US capacity but has decided nothing, and Kioxia said it will fold its Iwate fab subsidiary into the parent company. On the technology side, Kioxia described stacking several NAND array wafers on one logic wafer, Micron and Lenovo showed LPCAMM2 in a mobile workstation, and NVM Express finished its live migration feature set. Eyes on Flash added a UFS guide that starts a new series and a hands-on guide to running language models locally.</description>
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    <item>
      <title>Solidigm Drops Its IPO, WD Posts a Strong Quarter, and SSD Wear Meets AI Caches</title>
      <link>https://eyesonflash.com/news/weekly/2026-w43/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w43/</guid>
      <pubDate>Fri, 23 Oct 2026 12:00:00 GMT</pubDate>
      <description>October 17 to October 23, 2026. The week&apos;s company news was about money and capacity. SK hynix said it has ended the review of a Solidigm IPO while still saying Solidigm needs more production space in the United States, and Western Digital reported a first quarter that its management called ahead of expectations. Micron used an investor webinar to describe its next NAND generation, and SK hynix set the date for its own results. The research list leaned toward how flash and DRAM serve AI. Several preprints look at keeping language model caches on SSDs without wearing them out, others put compute closer to DRAM, and a review surveys three dimensional DRAM. Eyes on Flash also put a DDR5 guide for builders live.</description>
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    <item>
      <title>CXL Memory and Liquid Cooled SSDs Lead the Week, with Flash Moving into Compute</title>
      <link>https://eyesonflash.com/news/weekly/2026-w42/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w42/</guid>
      <pubDate>Fri, 16 Oct 2026 12:00:00 GMT</pubDate>
      <description>October 10 to October 16, 2026. Open Compute week set the tone. SK hynix showed a second generation CXL memory module along with liquid cooled enterprise SSDs, Marvell introduced new CXL memory expanders, and Kioxia put out a liquid cooled E3.S line of its own. Cooling and memory expansion are now treated as part of the drive and module design, not as an afterthought. The other thread was putting work closer to the flash. FADU described an SSD that serves files itself, SK hynix described ferroelectric NAND for analog compute, and new papers look at ferroelectric crossbars and learned flow control for hybrid drives. Eyes on Flash published two memory guides.</description>
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    <item>
      <title>Samsung Signals a Strong Quarter While NAND Papers Look Past Today&apos;s Charge Trap Cells</title>
      <link>https://eyesonflash.com/news/weekly/2026-w41/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w41/</guid>
      <pubDate>Fri, 09 Oct 2026 12:00:00 GMT</pubDate>
      <description>October 3 to October 9, 2026. Samsung published preliminary third quarter guidance on Thursday, and it points to profit far above a year earlier. It is the week&apos;s main company news for memory, and the final results are still to come. The rest of the week was mostly research. A perspective paper argues that future NAND scaling will need several kinds of cell, another shows ferroelectric NAND used for database search, and further papers cover RowHammer mitigation, zoned SSD placement and CXL memory. Eyes on Flash added a run of Beyond NAND guides, two myth guides and a DRAM die timeline.</description>
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    <item>
      <title>Micron Closes a Record Year, SK hynix Answers on Solidigm, JEDEC Adds a Standard</title>
      <link>https://eyesonflash.com/news/weekly/2026-w40/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w40/</guid>
      <pubDate>Fri, 02 Oct 2026 12:00:00 GMT</pubDate>
      <description>September 26 to October 2, 2026. Micron reported record results for its fiscal fourth quarter and full year and pointed to tight memory supply ahead, with new LPDDR6 samples and a ramp of its data center SSDs. TrendForce raised its HBM price outlook for next year and said contract prices keep climbing. SK hynix told shareholders that nothing has been decided on Solidigm after press reports about a listing, and showed its HBM and SSD lineup at TSMC&apos;s partner event. On the technology side, Everspin demonstrated MRAM behind a CXL interface at the SNIA Developer Conference, JEDEC released its first reliability standard for silicon photonics, and three preprints looked at flash for LLM serving and NVMe data placement. Eyes on Flash added several labs and a set of new articles.</description>
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    <item>
      <title>CXMT Starts a New DRAM Platform, Samsung Validates LPDDR6, and Flash Gets Papers</title>
      <link>https://eyesonflash.com/news/weekly/2026-w39/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w39/</guid>
      <pubDate>Fri, 25 Sep 2026 12:00:00 GMT</pubDate>
      <description>September 19 to September 25, 2026. A quiet week for flash and a busy one for DRAM. CXMT said its newest DRAM platform is in mass production and showed phone memory built on it, Samsung said its LPDDR6 passed validation on Qualcomm&apos;s next flagship phone platform, and SK hynix used its annual forum to lay out its AI strategy. Samsung&apos;s HBM4 plans drew a report from Korea, and Cloudian qualified a Samsung enterprise SSD family. The research side leaned toward high bandwidth flash. Three new preprints model it, simulate it, or use it, and one ties CXL attached flash to LLM serving.</description>
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    <item>
      <title>SK hynix and Intel Talks, Solidigm Eyes a US NAND Fab, and CXMT Looks at Flash</title>
      <link>https://eyesonflash.com/news/weekly/2026-w38/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w38/</guid>
      <pubDate>Fri, 18 Sep 2026 12:00:00 GMT</pubDate>
      <description>September 12 to September 18, 2026. Fab geography dominated the week. Reuters reported that SK hynix is talking with Intel about making memory in the United States and that its Solidigm unit is weighing a US NAND plant; SK hynix said nothing has been decided on the Intel talks. Reuters also reported that CXMT plans a NAND research line, which would move the DRAM maker toward YMTC&apos;s turf. Micron showed a very dense server DDR5 module, PCI-SIG posted new base specification revisions, and Kioxia said it is preparing a US share listing after a Bloomberg report. Research this week kept returning to high bandwidth flash and SSD backed local inference.</description>
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    <item>
      <title>CXMT Ships LPDDR6, SK hynix Charts Its Memory Path, and HBF Research Piles Up</title>
      <link>https://eyesonflash.com/news/weekly/2026-w37/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w37/</guid>
      <pubDate>Fri, 11 Sep 2026 12:00:00 GMT</pubDate>
      <description>September 5 to September 11, 2026. CXMT published details of its LPDDR6 in mass production, the first appearance of the new low power DRAM standard in a flagship phone. SK hynix used its internal Future Forum to describe a stack of memory tiers, from 3D DRAM and HBM to high bandwidth flash, matched to each AI workload. Phison reported controller demand tied to AI storage, Marvell lined up its PCIe 6.0 SSD controller and CXL memory products for an infrastructure show, and Kioxia took its gaming SSDs to Tokyo Game Show. Papers this week looked at high bandwidth flash, SSD firmware verification and HBM error correction, and Eyes on Flash refreshed two Flash Foundations parts and the Atlas.</description>
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    <item>
      <title>Samsung Sketches HBM5 and zHBM, and Micron Frames the Agentic Memory Wall</title>
      <link>https://eyesonflash.com/news/weekly/2026-w36/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w36/</guid>
      <pubDate>Fri, 04 Sep 2026 12:00:00 GMT</pubDate>
      <description>August 29 to September 4, 2026. A quieter week for filings, with the conversation about where memory sits relative to compute carrying on from Hot Chips. Samsung laid out its CUBE strategy at the SEMICON Taiwan summit, covering HBM5, a design that stacks HBM on the processor, and a NAND product for large models. Micron and SK hynix each published essays arguing that agentic AI turns memory into a system level limit. Researchers posted work on DRAM RowHammer defenses in real time systems, disaggregated memory over CXL and SSD resident vector search. Eyes on Flash moved the Flash Foundations series, its software pages and its blog archive onto the rebuilt site.</description>
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    <item>
      <title>Hot Chips Turns to HBM Base Dies, Nvidia Adds NVHBM, and Kioxia and Sandisk Plan More Fabs</title>
      <link>https://eyesonflash.com/news/weekly/2026-w35/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w35/</guid>
      <pubDate>Fri, 28 Aug 2026 12:00:00 GMT</pubDate>
      <description>August 22 to August 28, 2026. Hot Chips put memory on the main stage. The Sunday tutorial lined up Micron, Samsung and SK hynix on HBM base dies and packaging, with talks on 3D DRAM accelerators and high bandwidth flash alongside, and Samsung brought processing in memory to LPDDR. Nvidia then said it will put the memory controller inside the HBM stack with NVHBM, and SK hynix explained why hybrid bonding matters. On the supply side, Kioxia and Sandisk said they plan a large Japan expansion, and SK hynix broke ground on its Indiana HBM packaging site. Marvell reported results, Micron reshuffled its top technical and operating roles, and three new papers looked at flash as an HBM tier, a software defined SSD and near memory compute.</description>
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    <item>
      <title>SK hynix Returns Cash to Holders, Micron Opens a Research Hub, and Sandisk Adds NAS SSDs</title>
      <link>https://eyesonflash.com/news/weekly/2026-w34/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w34/</guid>
      <pubDate>Fri, 21 Aug 2026 12:00:00 GMT</pubDate>
      <description>August 15 to August 21, 2026. The week had few product launches and several corporate moves. SK hynix announced a large share repurchase and cancellation program and a wider shareholder return policy, Micron unveiled Micron Research Labs, a long horizon research hub in Boise, and Sandisk introduced a line of high endurance SSDs for network attached storage. On the technical side, SK hynix published a co packaged optics roadmap with university partners in Nature Electronics, positioning optical links as the next step beyond HBM for AI systems. JEDEC announced its automotive electronics forum for September, and a new paper analyzed reliability for HBM systems with partial service.</description>
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      <title>Kioxia and Sandisk Show a New QLC Generation, and Sandisk Sets Its Long Term Plan</title>
      <link>https://eyesonflash.com/news/weekly/2026-w33/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w33/</guid>
      <pubDate>Fri, 14 Aug 2026 12:00:00 GMT</pubDate>
      <description>August 8 to August 14, 2026. A quiet week after the Future of Memory and Storage show, with the company news dominated by Sandisk. Sandisk and Kioxia unveiled a ninth generation QLC flash technology built for AI storage, and a day later Sandisk used its investor day to lay out strategy and a multi year financial model through fiscal 2030. Phison published its second quarter results and Micron launched a new venture fund aimed at AI companies. On the research side, high bandwidth flash drew the most attention, with several papers testing how it would work for language model serving. Another paper measured how read disturbance hurts SSD performance across drives from ten makers. Silicon Motion also introduced a reference design kit for enterprise SSDs aimed at AI agent workloads.</description>
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      <title>FMS 2026 Brings High Bandwidth Flash Specs, PCIe 6.0 Controllers and New QLC NAND</title>
      <link>https://eyesonflash.com/news/weekly/2026-w32/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w32/</guid>
      <pubDate>Fri, 07 Aug 2026 12:00:00 GMT</pubDate>
      <description>August 1 to August 7, 2026. The Future of Memory and Storage conference in Santa Clara set the week. Sandisk and SK hynix released the first High Bandwidth Flash specification through the Open Compute Project, Kioxia and Sandisk unveiled a new QLC 3D flash technology, and Samsung showed concept models of zHBM and zNAND-O along with a wafer bonded V10 V-NAND. Controller makers also showed PCIe 6.0 silicon, with Marvell announcing its Bravera SC6 and Silicon Motion showcasing its enterprise and client controllers. On the business side, WD reported fiscal fourth quarter results and CoreWeave signed a multi-year priority supply agreement with Solidigm.</description>
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      <title>Record Memory Results from Samsung, SK hynix and Kioxia, and NVMe Ships a Spec Wave</title>
      <link>https://eyesonflash.com/news/weekly/2026-w31/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w31/</guid>
      <pubDate>Fri, 31 Jul 2026 12:00:00 GMT</pubDate>
      <description>July 25 to July 31, 2026. Second quarter earnings dominated the week. Samsung and SK hynix both reported record memory results on AI server demand, Seagate closed its fiscal year, and Kioxia reported a record first quarter led by data center SSDs. Samsung also signed a memorandum with Broadcom, and SK Group and NVIDIA announced a partnership that includes HBM4 supply. On the technology side, Kioxia began sampling a ninth generation BiCS FLASH part, introduced its first PCIe 6.0 enterprise SSD on its tenth generation flash, and announced UFS 5.0 devices. NVM Express ratified a large set of specification revisions, headed by Base Specification 2.4.</description>
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      <title>AMD Launches HBM4 Accelerators, TrendForce Sees NAND Easing, and Korea Teases Memory Deals</title>
      <link>https://eyesonflash.com/news/weekly/2026-w30/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w30/</guid>
      <pubDate>Fri, 24 Jul 2026 12:00:00 GMT</pubDate>
      <description>July 18 to July 24, 2026. HBM4 moved from announcement to product this week. AMD launched its Instinct MI400 series with HBM4 and put its Helios rack into production, with Samsung reported as a key memory supplier, and Nvidia described how Rubin&apos;s HBM4 is meant to keep more of a model resident on the GPU. On the market side, TrendForce said NAND should rebalance in the second half of next year, Samsung disputed a report about V10 NAND shipments to Nvidia, and South Korea&apos;s presidential office said Samsung and SK hynix will announce large deals with US firms. Three papers looked at CXL memory racks, in-NAND vector search and 3D memory for mixture of experts models.</description>
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      <title>JEDEC Publishes SPHBM4, Micron Locks In Car Supply, and Silicon Motion Eyes PCIe Gen7</title>
      <link>https://eyesonflash.com/news/weekly/2026-w29/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w29/</guid>
      <pubDate>Fri, 17 Jul 2026 12:00:00 GMT</pubDate>
      <description>July 11 to July 17, 2026. A quiet week for product launches, with the news coming mostly from standards and supply deals. JEDEC published SPHBM4, a version of HBM4 built to sit on ordinary organic substrates, and Micron said it has finished long-term supply agreements with a group of automotive suppliers. On the controller side, Silicon Motion&apos;s enterprise chief said development of PCIe Gen7 controllers has already started, and a trade report said SK hynix began HBM4 shipments to Nvidia. Research this week leaned on AI serving, with papers on high bandwidth flash, CXL shared memory and Rowhammer defenses.</description>
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      <title>Samsung Ships a PCIe 6.0 SSD, SK hynix Lists in New York, Micron Widens US Plans</title>
      <link>https://eyesonflash.com/news/weekly/2026-w28/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w28/</guid>
      <pubDate>Fri, 10 Jul 2026 12:00:00 GMT</pubDate>
      <description>July 4 to July 10, 2026. Money and capacity led the week. Samsung gave record preliminary second quarter results, SK hynix began trading in the United States, and Micron said it is raising its planned US investment, with a New York construction milestone and a wafer supply deal with GlobalWafers. On the product side Samsung said its PCIe 6.0 enterprise SSD, the PM1763, is in mass production. Three preprints tied memory design to AI serving, covering dequantization inside HBM, high bandwidth flash with a tile friendly layout, and SSD backed memory tables for language models.</description>
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      <title>Kioxia and Sandisk Start 10th Generation Flash, and SK hynix Maps Its Next Fabs</title>
      <link>https://eyesonflash.com/news/weekly/2026-w27/</link>
      <guid isPermaLink="true">https://eyesonflash.com/news/weekly/2026-w27/</guid>
      <pubDate>Fri, 03 Jul 2026 12:00:00 GMT</pubDate>
      <description>June 27 to July 3, 2026. The week belonged to NAND. Kioxia and Sandisk each announced samples of their 10th generation BiCS flash, and the two companies said production has begun at the second fab at Kitakami. Both releases lean on the bonded array and logic wafer approach, now carried into a new generation aimed at data center SSDs. Capacity and supply news ran alongside it. SK hynix laid out plans for a new NAND fab and packaging site in Cheongju and a separate Southwestern cluster, and Micron signed another long term supply agreement, this time with an automaker. Two papers looked at running memory work closer to the DRAM and at trimming storage I/O overhead in virtualized servers.</description>
    </item>
  </channel>
</rss>
