{ "name": "Standards", "url": "https://eyesonflash.com/timelines/standards/", "creator": "Eyes on Flash", "rights": "All rights reserved. Copyright Sean Webster, Eyes on Flash (https://eyesonflash.com). You may read these files and link to them; do not copy, republish or redistribute them without written permission. Each figure comes from the source named on its row.", "dateModified": "2026-10-16", "about": "One row per sourced value. Each row names the source it was read from; a value no source publishes has no row. The date is where the timeline places the record: its earliest source, not the date of each value.", "columns": [ "record_type", "record_id", "label", "maker", "date", "measure", "value", "unit", "bound", "derived", "teardown", "source_id", "source_kind", "source_title", "source_publisher", "source_url", "source_page" ], "rows": [ { "record_type": "standard_nand", "record_id": "onfi-2-0-2008", "label": "ONFI 2.0", "maker": "ONFI", "date": "2008-02-27", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Revision 2.0", "unit": "", "source_id": "onfi20", "source_kind": "", "source_title": "Open NAND Flash Interface Specification, Revision 2.0", "source_publisher": "ONFI", "source_url": "https://www.onfi.org/files/onfi_2_0_gold.pdf" }, { "record_type": "standard_nand", "record_id": "onfi-3-0-2011", "label": "ONFI 3.0", "maker": "ONFI", "date": "2011-03", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Up to 400 MB/s", "unit": "", "source_id": "onfi", "source_kind": "", "source_title": "ONFI specifications", "source_publisher": "ONFI", "source_url": "https://onfi.org/specs.html" }, { "record_type": "standard_nand", "record_id": "onfi-4-0-2014", "label": "ONFI 4.0, with the NV-DDR3 interface at 1.2 V", "maker": "ONFI", "date": "2014-04", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "800 MT/s", "unit": "", "source_id": "onfi", "source_kind": "", "source_title": "ONFI specifications", "source_publisher": "ONFI", "source_url": "https://onfi.org/specs.html" }, { "record_type": "standard_nand", "record_id": "onfi-4-0-2014", "label": "ONFI 4.0, with the NV-DDR3 interface at 1.2 V", "maker": "ONFI", "date": "2014-04", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_ONFI", "value": 800, "unit": "MT/s", "source_id": "onfi", "source_kind": "", "source_title": "ONFI specifications", "source_publisher": "ONFI", "source_url": "https://onfi.org/specs.html" }, { "record_type": "standard_nand", "record_id": "onfi-4-2-2020", "label": "ONFI 4.2", "maker": "ONFI", "date": "2020-02", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "1,600 MT/s", "unit": "", "source_id": "onfi", "source_kind": "", "source_title": "ONFI specifications", "source_publisher": "ONFI", "source_url": "https://onfi.org/specs.html" }, { "record_type": "standard_nand", "record_id": "onfi-4-2-2020", "label": "ONFI 4.2", "maker": "ONFI", "date": "2020-02", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_ONFI", "value": 1600, "unit": "MT/s", "source_id": "onfi", "source_kind": "", "source_title": "ONFI specifications", "source_publisher": "ONFI", "source_url": "https://onfi.org/specs.html" }, { "record_type": "standard_nand", "record_id": "onfi-5-0-2021", "label": "ONFI 5.0, with the new NV-LPDDR4 interface", "maker": "ONFI", "date": "2021-05", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "2,400 MT/s", "unit": "", "source_id": "onfi", "source_kind": "", "source_title": "ONFI specifications", "source_publisher": "ONFI", "source_url": "https://onfi.org/specs.html" }, { "record_type": "standard_nand", "record_id": "onfi-5-0-2021", "label": "ONFI 5.0, with the new NV-LPDDR4 interface", "maker": "ONFI", "date": "2021-05", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_ONFI", "value": 2400, "unit": "MT/s", "source_id": "onfi", "source_kind": "", "source_title": "ONFI specifications", "source_publisher": "ONFI", "source_url": "https://onfi.org/specs.html" }, { "record_type": "standard_nand", "record_id": "onfi-5-1-2022", "label": "ONFI 5.1", "maker": "ONFI", "date": "2022-08", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "3,600 MT/s", "unit": "", "source_id": "onfi", "source_kind": "", "source_title": "ONFI specifications", "source_publisher": "ONFI", "source_url": "https://onfi.org/specs.html" }, { "record_type": "standard_nand", "record_id": "onfi-5-1-2022", "label": "ONFI 5.1", "maker": "ONFI", "date": "2022-08", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_ONFI", "value": 3600, "unit": "MT/s", "source_id": "onfi", "source_kind": "", "source_title": "ONFI specifications", "source_publisher": "ONFI", "source_url": "https://onfi.org/specs.html" }, { "record_type": "standard_nand", "record_id": "samsung-8th-vnand-2022", "label": "Samsung 8th-generation V-NAND, on Toggle DDR 5.0", "maker": "Samsung", "date": "2022-11-07", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "context", "value": "2.4 Gb/s", "unit": "", "source_id": "sam8", "source_kind": "", "source_title": "Samsung Electronics Begins Mass Production of 8th-Gen Vertical NAND with Industry’s Highest Bit Density", "source_publisher": "Samsung", "source_url": "https://news.samsung.com/global/samsung-electronics-begins-mass-production-of-8th-gen-vertical-nand-with-industrys-highest-bit-density" }, { "record_type": "standard_nand", "record_id": "samsung-8th-vnand-2022", "label": "Samsung 8th-generation V-NAND, on Toggle DDR 5.0", "maker": "Samsung", "date": "2022-11-07", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_Toggle", "value": 2400, "unit": "MT/s", "source_id": "sam8", "source_kind": "", "source_title": "Samsung Electronics Begins Mass Production of 8th-Gen Vertical NAND with Industry’s Highest Bit Density", "source_publisher": "Samsung", "source_url": "https://news.samsung.com/global/samsung-electronics-begins-mass-production-of-8th-gen-vertical-nand-with-industrys-highest-bit-density" }, { "record_type": "standard_nand", "record_id": "samsung-9th-vnand-2024", "label": "Samsung 9th-generation V-NAND, on Toggle 5.1", "maker": "Samsung", "date": "2024-04-23", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "shipping", "value": "3.2 Gb/s", "unit": "", "source_id": "sam9", "source_kind": "", "source_title": "Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND", "source_publisher": "Samsung", "source_url": "https://news.samsung.com/global/samsung-electronics-begins-industrys-first-mass-production-of-9th-gen-v-nand" }, { "record_type": "standard_nand", "record_id": "samsung-9th-vnand-2024", "label": "Samsung 9th-generation V-NAND, on Toggle 5.1", "maker": "Samsung", "date": "2024-04-23", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_Toggle", "value": 3200, "unit": "MT/s", "source_id": "sam9", "source_kind": "", "source_title": "Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND", "source_publisher": "Samsung", "source_url": "https://news.samsung.com/global/samsung-electronics-begins-industrys-first-mass-production-of-9th-gen-v-nand" }, { "record_type": "standard_nand", "record_id": "jesd230g-2024", "label": "JESD230G NAND interface standard", "maker": "JEDEC", "date": "2024-11-18", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "4,800 MT/s (first version: 400)", "unit": "", "source_id": "jesd230g", "source_kind": "", "source_title": "JEDEC Announces Enhanced NAND Flash Interface Standard with Increased Speeds", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec%C2%AE-announces-enhanced-nand-flash-interface-standard-increased-speeds-and" }, { "record_type": "standard_nand", "record_id": "jesd230g-2024", "label": "JESD230G NAND interface standard", "maker": "JEDEC", "date": "2024-11-18", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_JESD230", "value": 4800, "unit": "MT/s", "source_id": "jesd230g", "source_kind": "", "source_title": "JEDEC Announces Enhanced NAND Flash Interface Standard with Increased Speeds", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec%C2%AE-announces-enhanced-nand-flash-interface-standard-increased-speeds-and" }, { "record_type": "standard_nand", "record_id": "onfi-6-0-2026", "label": "ONFI 6.0, legacy interfaces dropped", "maker": "ONFI", "date": "2026-01", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "4,800 MT/s", "unit": "", "source_id": "onfi", "source_kind": "", "source_title": "ONFI specifications", "source_publisher": "ONFI", "source_url": "https://onfi.org/specs.html" }, { "record_type": "standard_nand", "record_id": "onfi-6-0-2026", "label": "ONFI 6.0, legacy interfaces dropped", "maker": "ONFI", "date": "2026-01", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_ONFI", "value": 4800, "unit": "MT/s", "source_id": "onfi", "source_kind": "", "source_title": "ONFI specifications", "source_publisher": "ONFI", "source_url": "https://onfi.org/specs.html" }, { "record_type": "standard_nand", "record_id": "jesd230g-02-nand-flash-interface-interoperability", "label": "JESD230G.02 NAND flash interface interoperability (with ONFI)", "maker": "JEDEC", "date": "2026-09", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "NAND interface standard developed by JEDEC and ONFI. JEDEC's catalog page does not say what changed from JESD230G, so no speed is shown.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "JESD230G.02 NAND flash interface interoperability (with ONFI)", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/standards-documents/docs/jesd230c" }, { "record_type": "standard_dram", "record_id": "jedec-ddr-2000", "label": "DDR SDRAM standard, JESD79", "maker": "JEDEC", "date": "2000", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "JESD79", "unit": "", "source_id": "jedechist", "source_kind": "", "source_title": "JEDEC history, the 2000s", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/about-jedec/jedec-history/2000s" }, { "record_type": "standard_dram", "record_id": "jedec-ddr3-2007", "label": "DDR3", "maker": "JEDEC", "date": "2007-06-26", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "800 to 1,600 MT/s", "unit": "", "source_id": "ddr3", "source_kind": "", "source_title": "Publication of the JEDEC DDR3 SDRAM Standard", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/publication-jedec-ddr3-sdram-standard" }, { "record_type": "standard_dram", "record_id": "jedec-ddr3-2007", "label": "DDR3", "maker": "JEDEC", "date": "2007-06-26", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_DDR", "value": 1.6, "unit": "Gb/s per pin", "source_id": "ddr3", "source_kind": "", "source_title": "Publication of the JEDEC DDR3 SDRAM Standard", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/publication-jedec-ddr3-sdram-standard" }, { "record_type": "standard_dram", "record_id": "jedec-ddr2-jesd79-2f-2009", "label": "DDR2 SDRAM, JESD79-2F", "maker": "JEDEC", "date": "2009-11", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "context", "value": "DDR2-400 to DDR2-800", "unit": "", "source_id": "jesd792f", "source_kind": "", "source_title": "JESD79-2F DDR2 SDRAM Specification", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/standards-documents/docs/jesd-79-2e" }, { "record_type": "standard_dram", "record_id": "jedec-ddr2-jesd79-2e-2008", "label": "DDR2 SDRAM, JESD79-2E", "maker": "JEDEC", "date": "2008-04", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "context", "value": "", "unit": "", "source_id": "jesd792f", "source_kind": "", "source_title": "JESD79-2F DDR2 SDRAM Specification", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/standards-documents/docs/jesd-79-2e" }, { "record_type": "standard_dram", "record_id": "jedec-ddr2-jesd79-2d-2007", "label": "DDR2 SDRAM, JESD79-2D", "maker": "JEDEC", "date": "2007-01", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "context", "value": "", "unit": "", "source_id": "jesd792f", "source_kind": "", "source_title": "JESD79-2F DDR2 SDRAM Specification", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/standards-documents/docs/jesd-79-2e" }, { "record_type": "standard_dram", "record_id": "jedec-ddr2-jesd79-2c-2006", "label": "DDR2 SDRAM, JESD79-2C", "maker": "JEDEC", "date": "2006-01", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "context", "value": "", "unit": "", "source_id": "jesd792f", "source_kind": "", "source_title": "JESD79-2F DDR2 SDRAM Specification", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/standards-documents/docs/jesd-79-2e" }, { "record_type": "standard_dram", "record_id": "jedec-ddr2-jesd79-2b-2005", "label": "DDR2 SDRAM, JESD79-2B", "maker": "JEDEC", "date": "2005-01", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "context", "value": "", "unit": "", "source_id": "jesd792f", "source_kind": "", "source_title": "JESD79-2F DDR2 SDRAM Specification", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/standards-documents/docs/jesd-79-2e" }, { "record_type": "standard_dram", "record_id": "jedec-ddr4-2012", "label": "DDR4", "maker": "JEDEC", "date": "2012-09-25", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "1.6 to 3.2 GT/s per pin", "unit": "", "source_id": "ddr4", "source_kind": "", "source_title": "JEDEC Announces Publication of DDR4 Standard", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec-announces-publication-ddr4-standard" }, { "record_type": "standard_dram", "record_id": "jedec-ddr4-2012", "label": "DDR4", "maker": "JEDEC", "date": "2012-09-25", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_DDR", "value": 3.2, "unit": "Gb/s per pin", "source_id": "ddr4", "source_kind": "", "source_title": "JEDEC Announces Publication of DDR4 Standard", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec-announces-publication-ddr4-standard" }, { "record_type": "standard_dram", "record_id": "jedec-hbm-2013", "label": "HBM (JESD235)", "maker": "JEDEC", "date": "2013-10", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "JESD235, the first HBM standard", "unit": "", "source_id": "hbm1-cadence", "source_kind": "", "source_title": "High-Bandwidth Memory Evolution from First-Generation HBM to the Latest HBM4", "source_publisher": "Cadence", "source_url": "https://community.cadence.com/cadence_blogs_8/b/fv/posts/high-bandwidth-memory-evolution-from-first-generation-hbm-to-the-latest-hbm4" }, { "record_type": "standard_dram", "record_id": "jedec-hbm2-2016", "label": "HBM2 (JESD235A)", "maker": "JEDEC", "date": "2016-01-12", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "256 GB/s per device, 1,024-bit", "unit": "", "source_id": "hbm2", "source_kind": "", "source_title": "JEDEC Updates Groundbreaking High Bandwidth Memory (HBM) Standard", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec-updates-groundbreaking-high-bandwidth-memory-hbm-standard" }, { "record_type": "standard_dram", "record_id": "samsung-hbm2-2016", "label": "Samsung, the first 4 GB HBM2 package, in mass production", "maker": "Samsung", "date": "2016-01-19", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "shipping", "value": "4 GB package", "unit": "", "source_id": "samsunghbm2", "source_kind": "", "source_title": "Samsung Begins Mass Producing World’s Fastest DRAM, Based on Newest High Bandwidth Memory (HBM) Interface", "source_publisher": "Samsung", "source_url": "https://news.samsung.com/global/samsung-begins-mass-producing-worlds-fastest-dram-based-on-newest-high-bandwidth-memory-hbm-interface" }, { "record_type": "standard_dram", "record_id": "jedec-lpddr5-2019", "label": "LPDDR5", "maker": "JEDEC", "date": "2019-02-19", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "6,400 MT/s", "unit": "", "source_id": "lpddr5", "source_kind": "", "source_title": "JEDEC Updates Standard for Low Power Memory Devices: LPDDR5", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec-updates-standard-low-power-memory-devices-lpddr5" }, { "record_type": "standard_dram", "record_id": "jedec-lpddr5-2019", "label": "LPDDR5", "maker": "JEDEC", "date": "2019-02-19", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_LPDDR", "value": 6.4, "unit": "Gb/s per pin", "source_id": "lpddr5", "source_kind": "", "source_title": "JEDEC Updates Standard for Low Power Memory Devices: LPDDR5", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec-updates-standard-low-power-memory-devices-lpddr5" }, { "record_type": "standard_dram", "record_id": "jedec-ddr5-2020", "label": "DDR5", "maker": "JEDEC", "date": "2020-07-14", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Launch at 4.8 Gb/s", "unit": "", "source_id": "ddr5", "source_kind": "", "source_title": "JEDEC Publishes New DDR5 Standard for Advancing Next-Generation High Performance Computing Systems", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec-publishes-new-ddr5-standard-advancing-next-generation-high-performance" }, { "record_type": "standard_dram", "record_id": "jedec-ddr5-2020", "label": "DDR5", "maker": "JEDEC", "date": "2020-07-14", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_DDR", "value": 4.8, "unit": "Gb/s per pin", "source_id": "ddr5", "source_kind": "", "source_title": "JEDEC Publishes New DDR5 Standard for Advancing Next-Generation High Performance Computing Systems", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec-publishes-new-ddr5-standard-advancing-next-generation-high-performance" }, { "record_type": "standard_dram", "record_id": "jedec-hbm3-2022", "label": "HBM3", "maker": "JEDEC", "date": "2022-01-27", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "6.4 Gb/s per pin, 819 GB/s per device", "unit": "", "source_id": "hbm3", "source_kind": "", "source_title": "JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec-publishes-hbm3-update-high-bandwidth-memory-hbm-standard" }, { "record_type": "standard_dram", "record_id": "jedec-hbm3-2022", "label": "HBM3", "maker": "JEDEC", "date": "2022-01-27", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_HBM", "value": 6.4, "unit": "Gb/s per pin", "source_id": "hbm3", "source_kind": "", "source_title": "JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec-publishes-hbm3-update-high-bandwidth-memory-hbm-standard" }, { "record_type": "standard_dram", "record_id": "jedec-gddr7-2024", "label": "GDDR7, the first JEDEC DRAM standard with PAM signaling", "maker": "JEDEC", "date": "2024-03-05", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "PAM3 signaling", "unit": "", "source_id": "gddr7", "source_kind": "", "source_title": "JEDEC Publishes GDDR7 Graphics Memory Standard", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec-publishes-gddr7-graphics-memory-standard" }, { "record_type": "standard_dram", "record_id": "jedec-hbm4-2025", "label": "HBM4 (JESD270-4)", "maker": "JEDEC", "date": "2025-04-16", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "8 Gb/s, 2,048-bit, up to 2 TB/s", "unit": "", "source_id": "hbm4", "source_kind": "", "source_title": "JEDEC and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec%C2%AE-and-industry-leaders-collaborate-release-jesd270-4-hbm4-standard-advancing" }, { "record_type": "standard_dram", "record_id": "jedec-hbm4-2025", "label": "HBM4 (JESD270-4)", "maker": "JEDEC", "date": "2025-04-16", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_HBM", "value": 8, "unit": "Gb/s per pin", "source_id": "hbm4", "source_kind": "", "source_title": "JEDEC and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec%C2%AE-and-industry-leaders-collaborate-release-jesd270-4-hbm4-standard-advancing" }, { "record_type": "standard_dram", "record_id": "jedec-lpddr6-2025", "label": "LPDDR6", "maker": "JEDEC", "date": "2025-07-09", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "2 sub-channels of 12 data lines", "unit": "", "source_id": "lpddr6", "source_kind": "", "source_title": "JEDEC Releases New LPDDR6 Standard to Enhance Mobile and AI Memory Performance", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec%C2%AE-releases-new-lpddr6-standard-enhance-mobile-and-ai-memory-performance" }, { "record_type": "standard_dram", "record_id": "jesd301-5-pmic5030-ddr5-module-power-management-chip-v1-00", "label": "JESD301-5 PMIC5030 (DDR5 module power-management chip), v1.00", "maker": "JEDEC", "date": "2026-01", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "Power-management chip spec for DDR5 modules.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "JESD301-5 PMIC5030 (DDR5 module power-management chip), v1.00", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/standards-documents/docs/jesd301-5" }, { "record_type": "standard_dram", "record_id": "jesd406-5d-lpddr5-5x-spd-contents", "label": "JESD406-5D LPDDR5/5X SPD contents", "maker": "JEDEC", "date": "2026-03-24", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "Updated LPDDR5 and LPDDR5X SPD contents, with enhanced mode-switching support.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "JESD406-5D LPDDR5/5X SPD contents", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec%C2%AE-releases-updated-lpddr55x-spd-standard-enhanced-mode-switching-support" }, { "record_type": "standard_dram", "record_id": "jesd82-552-ddr5mdb02-multiplexed-rank-data-buffer", "label": "JESD82-552 DDR5MDB02 multiplexed rank data buffer", "maker": "JEDEC", "date": "2026-04-30", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "DDR5 multiplexed rank data buffer, announced with other parts of the DDR5 MRDIMM ecosystem.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "JESD82-552 DDR5MDB02 multiplexed rank data buffer", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec%C2%AE-advances-ddr5-mrdimm-ecosystem-new-memory-interface-logic-and-expanded" }, { "record_type": "standard_dram", "record_id": "jesd82-543-ddr5mrcd03-multiplexed-rank-registering-clock-driver", "label": "JESD82-543 DDR5MRCD03 multiplexed rank registering clock driver", "maker": "JEDEC", "date": "2026-09", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "A DDR5 registering clock driver with parity and CRC that drives the address and control nets on MRDIMMs.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "JESD82-543 DDR5MRCD03 multiplexed rank registering clock driver", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/standards-documents/docs/jesd82-543" }, { "record_type": "standard_dram", "record_id": "camm2-raw-card-e-annex-jesd318-f0-rce-v2-00", "label": "CAMM2 Raw Card E annex (JESD318 F0 RCE), v2.00", "maker": "JEDEC", "date": "2026-05", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "Annex to the CAMM2 module standard.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "CAMM2 Raw Card E annex (JESD318 F0 RCE), v2.00", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/standards-documents/docs/jesd318-f0-rce" }, { "record_type": "standard_dram", "record_id": "jesd328-socamm2-common-standard-lpddr5-5x-v1-00", "label": "JESD328 SOCAMM2 common standard (LPDDR5/5X), v1.00", "maker": "JEDEC", "date": "2026-06", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "Module standard built on LPDDR5 and LPDDR5X.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "JESD328 SOCAMM2 common standard (LPDDR5/5X), v1.00", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/standards-documents/docs/jesd328" }, { "record_type": "standard_dram", "record_id": "jedec-sphbm4-2026", "label": "SPHBM4: HBM4-class bandwidth on organic substrates", "maker": "JEDEC", "date": "2026-07-13", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "JESD330-4", "unit": "", "source_id": "sphbm4", "source_kind": "", "source_title": "New JEDEC SPHBM4 Standard Enables HBM4-Class Bandwidth on Organic Substrates", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/new-jedec%C2%AE-sphbm4-standard-enables-hbm4-class-bandwidth-organic-substrates" }, { "record_type": "standard_dram", "record_id": "jesd239f-gddr7", "label": "JESD239F GDDR7", "maker": "JEDEC", "date": "2026-08", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "GDDR7 graphics memory.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "JESD239F GDDR7", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/standards-documents/docs/jesd239" }, { "record_type": "standard_dram", "record_id": "jesd235d", "label": "JESD235D (HBM and HBM2)", "maker": "JEDEC", "date": "2021-03", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "Catalog page for the first two HBM generations.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "JESD235D (HBM and HBM2)", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/standards-documents/docs/jesd235a" }, { "record_type": "standard_dram", "record_id": "jesd209-5c", "label": "JESD209-5C (LPDDR5 and LPDDR5X)", "maker": "JEDEC", "date": "2023-07", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "Current LPDDR5 and LPDDR5X edition on the catalog page.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "JESD209-5C (LPDDR5 and LPDDR5X)", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/standards-documents/docs/jesd209-5c" }, { "record_type": "standard_dram", "record_id": "jesd238b-01", "label": "JESD238B.01 (HBM3)", "maker": "JEDEC", "date": "2025-04", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "HBM3 DRAM.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "JESD238B.01 (HBM3)", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/standards-documents/docs/jesd238" }, { "record_type": "standard_dram", "record_id": "jesd209-6", "label": "JESD209-6 (LPDDR6)", "maker": "JEDEC", "date": "2025-07", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "JEDEC’s LPDDR page says LPDDR6 was published in July 2025.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "JESD209-6 (LPDDR6)", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/category/technology-focus-area/mobile-memory-lpddr-wide-io-memory-mcp" }, { "record_type": "standard_dram", "record_id": "jesd79-5d", "label": "JESD79-5D (DDR5)", "maker": "JEDEC", "date": "2025-11", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "Version 1.41, the current DDR5 edition on the catalog page.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "JESD79-5D (DDR5)", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/standards-documents/docs/jesd79-5d" }, { "record_type": "standard_dram", "record_id": "jesd270-4a", "label": "JESD270-4A (HBM4)", "maker": "JEDEC", "date": "2025-12", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "Version 1.1 on the catalog page.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "JESD270-4A (HBM4)", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/standards-documents/docs/jesd270-4a" }, { "record_type": "standard_links", "record_id": "pcie-1-1", "label": "PCI Express Base 1.1, the oldest base revision on PCI-SIG’s list", "maker": "PCI-SIG", "date": "2005-03-08", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Base 1.1", "unit": "", "source_id": "pcisig", "source_kind": "", "source_title": "PCI-SIG Specifications list", "source_publisher": "PCI-SIG", "source_url": "https://pcisig.com/specifications" }, { "record_type": "standard_links", "record_id": "pcie-1-1", "label": "PCI Express Base 1.1, the oldest base revision on PCI-SIG’s list", "maker": "PCI-SIG", "date": "2005-03-08", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_PCIe", "value": 2.5, "unit": "GT/s per lane", "source_id": "pcie11", "source_kind": "", "source_title": "What prompted the need for another generation of PCI Express? (PCI-SIG FAQ)", "source_publisher": "PCI-SIG", "source_url": "https://pcisig.com/what-prompted-need-another-generation-pci-express-pcie" }, { "record_type": "standard_links", "record_id": "pcie-2-0", "label": "PCI Express Base 2.0 doubles the rate to 5.0 GT/s", "maker": "PCI-SIG", "date": "2006-12-20", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Base 2.0", "unit": "", "source_id": "pcisig", "source_kind": "", "source_title": "PCI-SIG Specifications list", "source_publisher": "PCI-SIG", "source_url": "https://pcisig.com/specifications" }, { "record_type": "standard_links", "record_id": "pcie-2-0", "label": "PCI Express Base 2.0 doubles the rate to 5.0 GT/s", "maker": "PCI-SIG", "date": "2006-12-20", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_PCIe", "value": 5, "unit": "GT/s per lane", "source_id": "pcie5faq", "source_kind": "", "source_title": "PCI Express 5.0 FAQ (PCI-SIG)", "source_publisher": "PCI-SIG", "source_url": "https://pcisig.com/faq?field_category_value%5B%5D=pci_express_5.0" }, { "record_type": "standard_links", "record_id": "pcie-3-0", "label": "PCI Express Base 3.0 reaches 8 GT/s with 128b/130b encoding", "maker": "PCI-SIG", "date": "2010-11-10", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Base 3.0", "unit": "", "source_id": "pcisig", "source_kind": "", "source_title": "PCI-SIG Specifications list", "source_publisher": "PCI-SIG", "source_url": "https://pcisig.com/specifications" }, { "record_type": "standard_links", "record_id": "pcie-3-0", "label": "PCI Express Base 3.0 reaches 8 GT/s with 128b/130b encoding", "maker": "PCI-SIG", "date": "2010-11-10", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_PCIe", "value": 8, "unit": "GT/s per lane", "source_id": "pcie5faq", "source_kind": "", "source_title": "PCI Express 5.0 FAQ (PCI-SIG)", "source_publisher": "PCI-SIG", "source_url": "https://pcisig.com/faq?field_category_value%5B%5D=pci_express_5.0" }, { "record_type": "standard_links", "record_id": "samsung-sm951-2015", "label": "SM951, the first M.2 NVMe PCIe SSD for PCs, in mass production", "maker": "Samsung", "date": "2015-04-15", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "shipping", "value": "Gen3 x4; 2,260 MB/s read", "unit": "", "source_id": "sm951", "source_kind": "", "source_title": "Samsung Electronics Now Producing Industry’s First M.2 NVMe PCIe SSD for the PC Market", "source_publisher": "Samsung", "source_url": "https://news.samsung.com/global/samsung-electronics-now-producing-industrys-first-m-2-nvme-pcie-ssd-for-the-pc-market" }, { "record_type": "standard_links", "record_id": "pcie-4-0", "label": "PCI Express Base 4.0 doubles the rate to 16 GT/s", "maker": "PCI-SIG", "date": "2017-10-05", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Base 4.0", "unit": "", "source_id": "pcisig", "source_kind": "", "source_title": "PCI-SIG Specifications list", "source_publisher": "PCI-SIG", "source_url": "https://pcisig.com/specifications" }, { "record_type": "standard_links", "record_id": "pcie-4-0", "label": "PCI Express Base 4.0 doubles the rate to 16 GT/s", "maker": "PCI-SIG", "date": "2017-10-05", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_PCIe", "value": 16, "unit": "GT/s per lane", "source_id": "pcie5faq", "source_kind": "", "source_title": "PCI Express 5.0 FAQ (PCI-SIG)", "source_publisher": "PCI-SIG", "source_url": "https://pcisig.com/faq?field_category_value%5B%5D=pci_express_5.0" }, { "record_type": "standard_links", "record_id": "cxl-1-0", "label": "CXL 1.0 ratified", "maker": "CXL Consortium", "date": "2019-03-11", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Revision 1.0", "unit": "", "source_id": "cxl10pr", "source_kind": "", "source_title": "CXL Consortium press release: CXL Specification 1.0 ratified (11 Mar 2019)", "source_publisher": "CXL Consortium", "source_url": "https://computeexpresslink.org/wp-content/uploads/2024/01/CXL_Launch-Press-Release_031119_FINAL3.pdf" }, { "record_type": "standard_links", "record_id": "cxl-1-0", "label": "CXL 1.0 ratified", "maker": "CXL Consortium", "date": "2019-03-11", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_CXL", "value": 32, "unit": "GT/s per lane", "source_id": "cxldeck", "source_kind": "", "source_title": "Compute Express Link (CXL): Enabling an Interoperable Ecosystem", "source_publisher": "CXL Consortium", "source_url": "https://www.snia.org/sites/default/files/2025-05/SNIA-SDC23-CXL-Enabling-an-interoperable-ecosystem.pdf" }, { "record_type": "standard_links", "record_id": "pcie-5-0", "label": "PCI Express Base 5.0 doubles the rate to 32 GT/s", "maker": "PCI-SIG", "date": "2019-05-22", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Base 5.0", "unit": "", "source_id": "pcie5faq", "source_kind": "", "source_title": "PCI Express 5.0 FAQ (PCI-SIG)", "source_publisher": "PCI-SIG", "source_url": "https://pcisig.com/faq?field_category_value%5B%5D=pci_express_5.0" }, { "record_type": "standard_links", "record_id": "pcie-5-0", "label": "PCI Express Base 5.0 doubles the rate to 32 GT/s", "maker": "PCI-SIG", "date": "2019-05-22", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_PCIe", "value": 32, "unit": "GT/s per lane", "source_id": "pcie5faq", "source_kind": "", "source_title": "PCI Express 5.0 FAQ (PCI-SIG)", "source_publisher": "PCI-SIG", "source_url": "https://pcisig.com/faq?field_category_value%5B%5D=pci_express_5.0" }, { "record_type": "standard_links", "record_id": "phison-gen4-2019", "label": "Phison calls itself “the first and only company shipping PCIe Gen4x4 NVMe SSD solutions”", "maker": "Phison", "date": "2019-08-05", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "shipping", "value": "Gen4 x4", "unit": "", "source_id": "phison", "source_kind": "", "source_title": "Phison at the forefront of the PCIe Gen4 storage market with a portfolio of products", "source_publisher": "Phison", "source_url": "https://www.phison.com/phison-at-the-forefront-of-pcie-gen4-storage-market-with-a-portfolio-of-products/" }, { "record_type": "standard_links", "record_id": "cxl-2-0", "label": "CXL 2.0: switching and memory pooling", "maker": "CXL Consortium", "date": "2020-11-10", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Revision 2.0", "unit": "", "source_id": "cxl20pr", "source_kind": "", "source_title": "CXL Consortium Releases Compute Express Link 2.0 Specification (10 Nov 2020)", "source_publisher": "CXL Consortium", "source_url": "https://computeexpresslink.org/wp-content/uploads/2024/01/CXL_2.0-Press-Release_FINAL.pdf" }, { "record_type": "standard_links", "record_id": "cxl-2-0", "label": "CXL 2.0: switching and memory pooling", "maker": "CXL Consortium", "date": "2020-11-10", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_CXL", "value": 32, "unit": "GT/s per lane", "source_id": "cxldeck", "source_kind": "", "source_title": "Compute Express Link (CXL): Enabling an Interoperable Ecosystem", "source_publisher": "CXL Consortium", "source_url": "https://www.snia.org/sites/default/files/2025-05/SNIA-SDC23-CXL-Enabling-an-interoperable-ecosystem.pdf" }, { "record_type": "standard_links", "record_id": "samsung-cxl-module-2021", "label": "Samsung unveils the first memory module for CXL, DDR5-based and validated on Intel server platforms", "maker": "Samsung", "date": "2021-05-11", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "sample", "value": "DDR5 CXL memory module", "unit": "", "source_id": "cxlmodule", "source_kind": "", "source_title": "Samsung Unveils Industry-First Memory Module Incorporating New CXL Interconnect Standard", "source_publisher": "Samsung", "source_url": "https://news.samsung.com/global/samsung-unveils-industry-first-memory-module-incorporating-new-cxl-interconnect-standard" }, { "record_type": "standard_links", "record_id": "pcie-6-0", "label": "PCI Express Base 6.0: PAM4 signaling at 64 GT/s", "maker": "PCI-SIG", "date": "2022-01-11", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Base 6.0", "unit": "", "source_id": "pcisig", "source_kind": "", "source_title": "PCI-SIG Specifications list", "source_publisher": "PCI-SIG", "source_url": "https://pcisig.com/specifications" }, { "record_type": "standard_links", "record_id": "pcie-6-0", "label": "PCI Express Base 6.0: PAM4 signaling at 64 GT/s", "maker": "PCI-SIG", "date": "2022-01-11", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_PCIe", "value": 64, "unit": "GT/s per lane", "source_id": "pcie6faq", "source_kind": "", "source_title": "PCI Express 6.0 FAQ (PCI-SIG)", "source_publisher": "PCI-SIG", "source_url": "https://pcisig.com/faq?field_category_value%5B%5D=pci_express_6.0" }, { "record_type": "standard_links", "record_id": "cxl-3-0", "label": "CXL 3.0: fabrics, at twice the rate of CXL 2.0", "maker": "CXL Consortium", "date": "2022-08-02", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "64 GT/s", "unit": "", "source_id": "cxl30pr", "source_kind": "", "source_title": "CXL Consortium releases Compute Express Link 3.0 specification (2 Aug 2022)", "source_publisher": "CXL Consortium", "source_url": "https://computeexpresslink.org/wp-content/uploads/2023/12/CXL_3.0-Specification-Release_FINAL.pdf" }, { "record_type": "standard_links", "record_id": "cxl-3-0", "label": "CXL 3.0: fabrics, at twice the rate of CXL 2.0", "maker": "CXL Consortium", "date": "2022-08-02", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_CXL", "value": 64, "unit": "GT/s per lane", "source_id": "cxldeck", "source_kind": "", "source_title": "Compute Express Link (CXL): Enabling an Interoperable Ecosystem", "source_publisher": "CXL Consortium", "source_url": "https://www.snia.org/sites/default/files/2025-05/SNIA-SDC23-CXL-Enabling-an-interoperable-ecosystem.pdf" }, { "record_type": "standard_links", "record_id": "pcie-7-0", "label": "PCI Express Base 7.0 doubles the rate to 128 GT/s", "maker": "PCI-SIG", "date": "2025-06-11", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Base 7.0", "unit": "", "source_id": "pcisig", "source_kind": "", "source_title": "PCI-SIG Specifications list", "source_publisher": "PCI-SIG", "source_url": "https://pcisig.com/specifications" }, { "record_type": "standard_links", "record_id": "pcie-7-0", "label": "PCI Express Base 7.0 doubles the rate to 128 GT/s", "maker": "PCI-SIG", "date": "2025-06-11", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_PCIe", "value": 128, "unit": "GT/s per lane", "source_id": "pcie7", "source_kind": "", "source_title": "The PCIe 7.0 Specification, Version 1.0 is Now Available to Members", "source_publisher": "PCI-SIG", "source_url": "https://pcisig.com/specifications/pcie-70-specification-version-03-now-available-members" }, { "record_type": "standard_links", "record_id": "cxl-4-0", "label": "CXL 4.0 doubles the rate to 128 GT/s", "maker": "CXL Consortium", "date": "2025-11-18", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "128 GT/s", "unit": "", "source_id": "cxl4", "source_kind": "", "source_title": "CXL Consortium Releases the Compute Express Link 4.0 Specification Increasing Speed and Bandwidth", "source_publisher": "CXL Consortium", "source_url": "https://computeexpresslink.org/wp-content/uploads/2025/11/CXL_4.0-Specification-Release_FINAL_Website-Copy.pdf" }, { "record_type": "standard_links", "record_id": "cxl-4-0", "label": "CXL 4.0 doubles the rate to 128 GT/s", "maker": "CXL Consortium", "date": "2025-11-18", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_CXL", "value": 128, "unit": "GT/s per lane", "source_id": "cxl4", "source_kind": "", "source_title": "CXL Consortium Releases the Compute Express Link 4.0 Specification Increasing Speed and Bandwidth", "source_publisher": "CXL Consortium", "source_url": "https://computeexpresslink.org/wp-content/uploads/2025/11/CXL_4.0-Specification-Release_FINAL_Website-Copy.pdf" }, { "record_type": "standard_links", "record_id": "micron-9650-2026", "label": "Micron 9650, the first PCIe Gen6 SSD in mass production", "maker": "Micron", "date": "2026-02-11", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "shipping", "value": "Gen6; 28 GB/s", "unit": "", "source_id": "micron9650", "source_kind": "", "source_title": "Micron 9650 SSD, the world’s first PCIe Gen6 SSD, reaches a new shipping milestone", "source_publisher": "Micron", "source_url": "https://www.micron.com/about/blog/storage/ssd/micron-9650-ssd-the-worlds-first-pcie-gen6-ssd-reaches-a-new-shipping-milestone" }, { "record_type": "standard_links", "record_id": "pcie-8-0-specification-draft-0-5", "label": "PCIe 8.0 Specification, Draft 0.5", "maker": "PCI-SIG", "date": "2026-05-01", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "First official draft, for members. PCI-SIG’s post sets a target and a release in 2028.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "PCIe 8.0 Specification, Draft 0.5", "source_publisher": "PCI-SIG", "source_url": "https://pcisig.com/blog/pcier-80-specification-draft-05-now-available-track-2560-gts-transfer-speeds-2028" }, { "record_type": "standard_nvme", "record_id": "nvme-1-0", "label": "NVM Express 1.0 ratified", "maker": "NVM Express", "date": "2011-03-01", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Revision 1.0", "unit": "", "source_id": "nvme10", "source_kind": "", "source_title": "NVM Express Revision 1.0", "source_publisher": "NVM Express", "source_url": "https://www.nvmexpress.org/wp-content/uploads/NVM-Express-1_0-Gold.pdf" }, { "record_type": "standard_nvme", "record_id": "samsung-kv-ssd-2019", "label": "Samsung builds the first standards-based key value SSD prototype, on SNIA’s KV API", "maker": "Samsung", "date": "2019-09-04", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "sample", "value": "SNIA KV API", "unit": "", "source_id": "kvssd", "source_kind": "", "source_title": "Samsung Successfully Develops Industry’s First “Key Value” SSD Prototype that Meets New Open Standard", "source_publisher": "Samsung", "source_url": "https://news.samsung.com/us/samsung-successfully-develops-industrys-first-key-value-ssd-prototype-meets-new-open-standard/" }, { "record_type": "standard_nvme", "record_id": "zns-1-0-2020", "label": "NVMe Zoned Namespace (ZNS) Command Set 1.0", "maker": "NVM Express", "date": "2020-06", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "ZNS Command Set 1.0", "unit": "", "source_id": "znsdeck", "source_kind": "", "source_title": "New NVMe Command Sets: Zoned Namespace (ZNS) and Key Value (KV)", "source_publisher": "NVM Express", "source_url": "https://nvmexpress.org/wp-content/uploads/New-NVMe%C2%AE-Command-Sets-Zoned-Namespace-ZNS-Key-Value-KV.pdf" }, { "record_type": "standard_nvme", "record_id": "wd-zn540-2020", "label": "Western Digital says it is sampling a ZNS SSD, the Ultrastar DC ZN540", "maker": "Western Digital", "date": "2020-11-09", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "sample", "value": "ZNS NVMe SSD", "unit": "", "source_id": "wd", "source_kind": "", "source_title": "Western Digital Expands Flash Portfolio for Scaling Data-Centric Architectures in the Zettabyte Era", "source_publisher": "Western Digital", "source_url": "https://www.westerndigital.com/company/newsroom/press-releases/2020/2020-11-09-western-digital-expands-flash-portfolio-for-scaling-data-centric-architectures" }, { "record_type": "standard_nvme", "record_id": "nvme-2-0", "label": "NVMe 2.0: the base spec split into separate command sets", "maker": "NVM Express", "date": "2021-06-03", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Revision 2.0", "unit": "", "source_id": "nvme20", "source_kind": "", "source_title": "NVM Express Announces the Rearchitected NVMe 2.0 Library of Specifications", "source_publisher": "NVM Express", "source_url": "https://nvmexpress.org/nvm-express-announces-the-rearchitected-nvme-2-0-library-of-specifications/" }, { "record_type": "standard_nvme", "record_id": "nvme-kv-2021", "label": "Key Value Command Set, in the NVMe 2.0 library", "maker": "NVM Express", "date": "2021-06-03", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "KV Command Set", "unit": "", "source_id": "nvme20", "source_kind": "", "source_title": "NVM Express Announces the Rearchitected NVMe 2.0 Library of Specifications", "source_publisher": "NVM Express", "source_url": "https://nvmexpress.org/nvm-express-announces-the-rearchitected-nvme-2-0-library-of-specifications/" }, { "record_type": "standard_nvme", "record_id": "wd-zn540-datasheet-2021", "label": "Western Digital’s Ultrastar DC ZN540 data sheet lists ZNS part and model numbers, the earliest dated product document found", "maker": "Western Digital", "date": "2021-09", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "shipping", "value": "ZNS NVMe SSD, 2 TB and 4 TB", "unit": "", "source_id": "wd-zn540-ds", "source_kind": "", "source_title": "Ultrastar DC ZN540 data sheet", "source_publisher": "Western Digital", "source_url": "https://documents.westerndigital.com/content/dam/doc-library/en_us/assets/public/western-digital/collateral/data-sheet/data-sheet-ultrastar-dc-zn540.pdf" }, { "record_type": "standard_nvme", "record_id": "nvme-fdp-2022", "label": "Flexible Data Placement (TP4146) ratified", "maker": "NVM Express", "date": "2022-12", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "TP4146", "unit": "", "source_id": "fdp", "source_kind": "", "source_title": "Flexible Data Placement (FDP) Overview, FMS 2023", "source_publisher": "NVM Express", "source_url": "https://nvmexpress.org/wp-content/uploads/FMS-2023-Flexible-Data-Placement-FDP-Overview.pdf" }, { "record_type": "standard_nvme", "record_id": "fdp-demo-fms-2023", "label": "Samsung and Meta demonstrate Flexible Data Placement at FMS 2023, cutting write amplification", "maker": "Samsung and Meta", "date": "2023-08", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "sample", "value": "FDP with CacheLib", "unit": "", "source_id": "fms23", "source_kind": "", "source_title": "Samsung Announces Innovations To Enhance Memory Customer Experience in Data-Centric Era at FMS 2023", "source_publisher": "Samsung", "source_url": "https://semiconductor.samsung.com/news-events/tech-blog/samsung-announces-innovations-to-enhance-memory-customer-experience-in-data-centric-era-at-fms-2023/" }, { "record_type": "standard_nvme", "record_id": "nvme-2-3", "label": "NVMe Base 2.3 ratified", "maker": "NVM Express", "date": "2025-08-01", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Revision 2.3", "unit": "", "source_id": "nvmearch", "source_kind": "", "source_title": "NVM Express Specification Archives", "source_publisher": "NVM Express", "source_url": "https://nvmexpress.org/nvm-express-specification-archives/" }, { "record_type": "standard_nvme", "record_id": "swordfish-v1-2-9-published-as-a-snia-standard", "label": "Swordfish v1.2.9, published as a SNIA standard", "maker": "SNIA", "date": "2026-07", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "Date shown is that of SNIA’s blog post announcing it.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "Swordfish v1.2.9, published as a SNIA standard", "source_publisher": "SNIA", "source_url": "https://www.snia.org/blog/2026/swordfishr-v129-published-standard" }, { "record_type": "standard_nvme", "record_id": "nvme-2-4", "label": "NVMe Base 2.4, the newest revision", "maker": "NVM Express", "date": "2026-07-31", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "context", "value": "Revision 2.4", "unit": "", "source_id": "nvme24", "source_kind": "", "source_title": "NVM Express Base Specification, Revision 2.4", "source_publisher": "NVM Express", "source_url": "https://nvmexpress.org/wp-content/uploads/NVM-Express-Base-Specification-Revision-2.4-Ratified-2026.07.31.pdf" }, { "record_type": "standard_nvme", "record_id": "nvme-over-pcie-transport-specification-revision-1-4", "label": "NVMe over PCIe Transport Specification, Revision 1.4", "maker": "NVMe", "date": "2026-07-31", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "Ratified 31 July 2026.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "NVMe over PCIe Transport Specification, Revision 1.4", "source_publisher": "NVMe", "source_url": "https://nvmexpress.org/wp-content/uploads/NVM-Express-NVMe-over-PCIe-Transport-Specification-Revision-1.4-Ratified-2026.07.31.pdf" }, { "record_type": "standard_datacenter", "record_id": "ocp-1-0", "label": "NVMe Cloud SSD Specification 1.0", "maker": "Open Compute Project", "date": "2020-03-18", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Version 1.0", "unit": "", "source_id": "ocp1", "source_kind": "", "source_title": "NVMe Cloud SSD Specification, Version 1.0", "source_publisher": "Open Compute Project", "source_url": "https://www.opencompute.org/documents/nvme-cloud-ssd-specification-v1-0-3-pdf" }, { "record_type": "standard_datacenter", "record_id": "ocp-2-0", "label": "Datacenter NVMe SSD 2.0: latency monitoring, power states, SPDM", "maker": "Open Compute Project", "date": "2021-05-18", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Version 2.0", "unit": "", "source_id": "ocp26", "source_kind": "", "source_title": "Datacenter NVMe SSD Specification, Version 2.6 (revision history)", "source_publisher": "Open Compute Project", "source_url": "https://www.opencompute.org/documents/datacenter-nvme-ssd-specification-v2-6-2-pdf" }, { "record_type": "standard_datacenter", "record_id": "ocp-2-5", "label": "Datacenter NVMe SSD 2.5: telemetry data areas and FDP", "maker": "Open Compute Project", "date": "2023-09-22", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Version 2.5", "unit": "", "source_id": "ocp26", "source_kind": "", "source_title": "Datacenter NVMe SSD Specification, Version 2.6 (revision history)", "source_publisher": "Open Compute Project", "source_url": "https://www.opencompute.org/documents/datacenter-nvme-ssd-specification-v2-6-2-pdf" }, { "record_type": "standard_datacenter", "record_id": "bow-flexi-v1-0-0", "label": "BoW.Flexi V1.0.0", "maker": "OCP", "date": "2026", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "BoW.Flexi V1.0.0", "source_publisher": "OCP", "source_url": "https://www.opencompute.org/contribution-type/specification/" }, { "record_type": "standard_datacenter", "record_id": "enhanced-telemetry-optics-product-software-specification-v1-", "label": "Enhanced Telemetry Optics Product Software Specification V1.0.0", "maker": "OCP", "date": "2026", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "Enhanced Telemetry Optics Product Software Specification V1.0.0", "source_publisher": "OCP", "source_url": "https://www.opencompute.org/contribution-type/specification/" }, { "record_type": "standard_datacenter", "record_id": "foundation-chiplet-system-architecture-fcsa-v1-1-0", "label": "Foundation Chiplet System Architecture (FCSA) V1.1.0", "maker": "OCP", "date": "2026", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "Foundation Chiplet System Architecture (FCSA) V1.1.0", "source_publisher": "OCP", "source_url": "https://www.opencompute.org/contribution-type/specification/" }, { "record_type": "standard_datacenter", "record_id": "mgx-accelerated-computing-rack-and-trays-specification-v1-2-", "label": "MGX Accelerated Computing Rack and Trays Specification V1.2.0", "maker": "OCP", "date": "2026", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "MGX Accelerated Computing Rack and Trays Specification V1.2.0", "source_publisher": "OCP", "source_url": "https://www.opencompute.org/contribution-type/specification/" }, { "record_type": "standard_datacenter", "record_id": "mqd-mqdb-ocp-design-specification-v1-0-0", "label": "MQD/MQDB OCP Design Specification V1.0.0", "maker": "OCP", "date": "2026", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "MQD/MQDB OCP Design Specification V1.0.0", "source_publisher": "OCP", "source_url": "https://www.opencompute.org/contribution-type/specification/" }, { "record_type": "standard_datacenter", "record_id": "open-boot-and-management-framework-interface-consolidation-p", "label": "Open Boot and Management Framework Interface Consolidation Protocol (OBMF-ICP) V1.0.0", "maker": "OCP", "date": "2026", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "Open Boot and Management Framework Interface Consolidation Protocol (OBMF-ICP) V1.0.0", "source_publisher": "OCP", "source_url": "https://www.opencompute.org/contribution-type/specification/" }, { "record_type": "standard_datacenter", "record_id": "scale-up-ethernet-transport-sue-t-base-specification-v1-0-0", "label": "Scale-Up Ethernet Transport (SUE-T) Base Specification v1.0.0", "maker": "OCP", "date": "2026", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "Scale-Up Ethernet Transport (SUE-T) Base Specification v1.0.0", "source_publisher": "OCP", "source_url": "https://www.opencompute.org/contribution-type/specification/" }, { "record_type": "standard_datacenter", "record_id": "single-phase-direct-to-chip-cold-plate-test-specification-v1", "label": "Single-Phase Direct-to-Chip Cold Plate Test Specification V1.0.0", "maker": "OCP", "date": "2026", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "Single-Phase Direct-to-Chip Cold Plate Test Specification V1.0.0", "source_publisher": "OCP", "source_url": "https://www.opencompute.org/contribution-type/specification/" }, { "record_type": "standard_datacenter", "record_id": "transparent-remote-optical-transceiver-messaging-with-epps-d", "label": "Transparent Remote Optical Transceiver Messaging with ePPS Design Specification V0.9.0", "maker": "OCP", "date": "2026", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "Transparent Remote Optical Transceiver Messaging with ePPS Design Specification V0.9.0", "source_publisher": "OCP", "source_url": "https://www.opencompute.org/contribution-type/specification/" }, { "record_type": "standard_datacenter", "record_id": "universal-quick-disconnect-uqd-specification-v2-0-0", "label": "Universal Quick Disconnect (UQD) Specification V2.0.0", "maker": "OCP", "date": "2026", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "Universal Quick Disconnect (UQD) Specification V2.0.0", "source_publisher": "OCP", "source_url": "https://www.opencompute.org/contribution-type/specification/" }, { "record_type": "standard_datacenter", "record_id": "sff-8472-sfp-management-interface-12-5a", "label": "SFF-8472 SFP+ management interface 12.5a", "maker": "SNIA", "date": "2026-01-16", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "SFF-8472 SFP+ management interface 12.5a", "source_publisher": "SNIA", "source_url": "https://www.snia.org/technology-communities/sff/specifications" }, { "record_type": "standard_datacenter", "record_id": "sff-9400-universal-4-8x-pinouts-1-1", "label": "SFF-9400 Universal 4/8X pinouts 1.1", "maker": "SNIA", "date": "2026-01-19", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "SFF-9400 Universal 4/8X pinouts 1.1", "source_publisher": "SNIA", "source_url": "https://www.snia.org/technology-communities/sff/specifications" }, { "record_type": "standard_datacenter", "record_id": "gov-ta-0001-sff-twg-process-guide-3-0", "label": "GOV-TA-0001 SFF TWG process guide 3.0", "maker": "SNIA", "date": "2026-01-30", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "GOV-TA-0001 SFF TWG process guide 3.0", "source_publisher": "SNIA", "source_url": "https://www.snia.org/technology-communities/sff/specifications" }, { "record_type": "standard_datacenter", "record_id": "sff-ta-1045-hybrid-orthogonal-edsff-connector-pin-and-signal", "label": "SFF-TA-1045 hybrid orthogonal EDSFF connector pin and signal definition 1.0", "maker": "SNIA", "date": "2026-03-13", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "SFF-TA-1045 hybrid orthogonal EDSFF connector pin and signal definition 1.0", "source_publisher": "SNIA", "source_url": "https://www.snia.org/technology-communities/sff/specifications" }, { "record_type": "standard_datacenter", "record_id": "sff-ta-1044-hybrid-orthogonal-edsff-connector-system-1-0", "label": "SFF-TA-1044 hybrid orthogonal EDSFF connector system 1.0", "maker": "SNIA", "date": "2026-03-27", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "SFF-TA-1044 hybrid orthogonal EDSFF connector system 1.0", "source_publisher": "SNIA", "source_url": "https://www.snia.org/technology-communities/sff/specifications" }, { "record_type": "standard_datacenter", "record_id": "sff-ta-1041-ulp-gen-7-pcie-connector-1-0", "label": "SFF-TA-1041 ULP Gen 7 PCIe connector 1.0", "maker": "SNIA", "date": "2026-04-07", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "SFF-TA-1041 ULP Gen 7 PCIe connector 1.0", "source_publisher": "SNIA", "source_url": "https://www.snia.org/technology-communities/sff/specifications" }, { "record_type": "standard_datacenter", "record_id": "sff-8636-management-interface-for-4-lane-modules-and-cables-", "label": "SFF-8636 management interface for 4-lane modules and cables 2.12", "maker": "SNIA", "date": "2026-04-29", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "SFF-8636 management interface for 4-lane modules and cables 2.12", "source_publisher": "SNIA", "source_url": "https://www.snia.org/technology-communities/sff/specifications" }, { "record_type": "standard_datacenter", "record_id": "sff-8024-module-management-reference-code-tables-4-14", "label": "SFF-8024 module management reference code tables 4.14", "maker": "SNIA", "date": "2026-06-04", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "SFF-8024 module management reference code tables 4.14", "source_publisher": "SNIA", "source_url": "https://www.snia.org/technology-communities/sff/specifications" }, { "record_type": "standard_datacenter", "record_id": "sff-ta-1038-low-profile-high-density-flexible-cable-connecto", "label": "SFF-TA-1038 low-profile high-density flexible cable connector 1.0", "maker": "SNIA", "date": "2026-06-07", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "SFF-TA-1038 low-profile high-density flexible cable connector 1.0", "source_publisher": "SNIA", "source_url": "https://www.snia.org/technology-communities/sff/specifications" }, { "record_type": "standard_datacenter", "record_id": "sff-8613-mini-multilane-4-8x-unshielded-connector-hdun-3-6", "label": "SFF-8613 mini multilane 4/8X unshielded connector (HDun) 3.6", "maker": "SNIA", "date": "2026-06-22", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "SFF-8613 mini multilane 4/8X unshielded connector (HDun) 3.6", "source_publisher": "SNIA", "source_url": "https://www.snia.org/technology-communities/sff/specifications" }, { "record_type": "standard_datacenter", "record_id": "sff-8419-sfp-power-and-low-speed-interface-2-0a", "label": "SFF-8419 SFP+ power and low-speed interface 2.0a", "maker": "SNIA", "date": "2026-07-10", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "SFF-8419 SFP+ power and low-speed interface 2.0a", "source_publisher": "SNIA", "source_url": "https://www.snia.org/technology-communities/sff/specifications" }, { "record_type": "standard_datacenter", "record_id": "sff-ta-1008-enterprise-and-datacenter-standard-form-factor-e", "label": "SFF-TA-1008 enterprise and datacenter standard form factor (E3) 3.0a", "maker": "SNIA", "date": "2026-07-10", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "The E3 form factor spec.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "SFF-TA-1008 enterprise and datacenter standard form factor (E3) 3.0a", "source_publisher": "SNIA", "source_url": "https://www.snia.org/technology-communities/sff/specifications" }, { "record_type": "standard_datacenter", "record_id": "sff-8614-mini-multilane-4-8x-shielded-cage-connector-hdsh-3-", "label": "SFF-8614 mini multilane 4/8X shielded cage/connector (HDsh) 3.6", "maker": "SNIA", "date": "2026-07-20", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "SFF-8614 mini multilane 4/8X shielded cage/connector (HDsh) 3.6", "source_publisher": "SNIA", "source_url": "https://www.snia.org/technology-communities/sff/specifications" }, { "record_type": "standard_datacenter", "record_id": "sff-ta-1048-compression-mount-high-speed-cable-interconnect-", "label": "SFF-TA-1048 compression mount high-speed cable interconnect 1.0", "maker": "SNIA", "date": "2026-09-29", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "SFF-TA-1048 compression mount high-speed cable interconnect 1.0", "source_publisher": "SNIA", "source_url": "https://www.snia.org/technology-communities/sff/specifications" }, { "record_type": "standard_datacenter", "record_id": "sff-ta-1039-pcie-active-module-cable-supplemental-specificat", "label": "SFF-TA-1039 PCIe active module/cable supplemental specification 1.0", "maker": "SNIA", "date": "2026-10-16", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "SFF-TA-1039 PCIe active module/cable supplemental specification 1.0", "source_publisher": "SNIA", "source_url": "https://www.snia.org/technology-communities/sff/specifications" }, { "record_type": "standard_mobile", "record_id": "ufs-1-0", "label": "UFS 1.0, the first Universal Flash Storage standard", "maker": "JEDEC", "date": "2011-02-24", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "300 MB/s", "unit": "", "source_id": "ufs1", "source_kind": "", "source_title": "JEDEC Announces Publication of Universal Flash Storage (UFS) Standard", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec-announces-publication-universal-flash-storage-ufs-standard" }, { "record_type": "standard_mobile", "record_id": "ufs-1-0", "label": "UFS 1.0, the first Universal Flash Storage standard", "maker": "JEDEC", "date": "2011-02-24", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_UFS", "value": 2.9, "unit": "Gb/s per lane", "source_id": "ufs1", "source_kind": "", "source_title": "JEDEC Announces Publication of Universal Flash Storage (UFS) Standard", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec-announces-publication-universal-flash-storage-ufs-standard" }, { "record_type": "standard_mobile", "record_id": "ufs-2-0", "label": "UFS 2.0 (JESD220B)", "maker": "JEDEC", "date": "2013-09-18", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "HS-G3 5.8 Gb/s per lane (optional)", "unit": "", "source_id": "ufs2", "source_kind": "", "source_title": "JEDEC Publishes Universal Flash Storage (UFS) Standard v2.0", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec-publishes-universal-flash-storage-ufs-standard-v20" }, { "record_type": "standard_mobile", "record_id": "ufs-2-0", "label": "UFS 2.0 (JESD220B)", "maker": "JEDEC", "date": "2013-09-18", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_UFS", "value": 5.8, "unit": "Gb/s per lane", "source_id": "jesd220b", "source_kind": "", "source_title": "JESD220B Universal Flash Storage (UFS) Version 2.0", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/sites/default/files/docs/JESD220B.pdf" }, { "record_type": "standard_mobile", "record_id": "ufs-3-0", "label": "UFS 3.0 (JESD220D)", "maker": "JEDEC", "date": "2018-01-30", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "HS-G4 11.6 Gb/s per lane", "unit": "", "source_id": "ufs3", "source_kind": "", "source_title": "JEDEC Publishes Universal Flash Storage (UFS) and UFSHCI Version 3.0 and UFS Card Extension", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec-publishes-universal-flash-storage-ufs-ufshci-version-30-and-ufs-card" }, { "record_type": "standard_mobile", "record_id": "ufs-3-0", "label": "UFS 3.0 (JESD220D)", "maker": "JEDEC", "date": "2018-01-30", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_UFS", "value": 11.6, "unit": "Gb/s per lane", "source_id": "ufs3", "source_kind": "", "source_title": "JEDEC Publishes Universal Flash Storage (UFS) and UFSHCI Version 3.0 and UFS Card Extension", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec-publishes-universal-flash-storage-ufs-ufshci-version-30-and-ufs-card" }, { "record_type": "standard_mobile", "record_id": "ufs-3-1", "label": "UFS 3.1 (JESD220E) adds Write Booster, DeepSleep and HPB", "maker": "JEDEC", "date": "2020-01-30", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "context", "value": "Write Booster", "unit": "", "source_id": "ufs31", "source_kind": "", "source_title": "JEDEC Publishes Update to Universal Flash Storage (UFS) Standard", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec-publishes-update-universal-flash-storage-ufs-standard" }, { "record_type": "standard_mobile", "record_id": "ufs-4-0", "label": "UFS 4.0 (JESD220F)", "maker": "JEDEC", "date": "2022-08-17", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "About 4.2 GB/s", "unit": "", "source_id": "ufs4", "source_kind": "", "source_title": "JEDEC Updates Universal Flash Storage (UFS) and Supporting Memory Interface Standards", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec-updates-universal-flash-storage-ufs-and-supporting-memory-interface" }, { "record_type": "standard_mobile", "record_id": "ufs-4-0", "label": "UFS 4.0 (JESD220F)", "maker": "JEDEC", "date": "2022-08-17", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_UFS", "value": 23.32, "unit": "Gb/s per lane", "source_id": "mipimphy", "source_kind": "", "source_title": "MIPI M-PHY", "source_publisher": "MIPI Alliance", "source_url": "https://www.mipi.org/specifications/m-phy" }, { "record_type": "standard_mobile", "record_id": "ufs-4-1", "label": "UFS 4.1 (JESD220G)", "maker": "JEDEC", "date": "2025-01-08", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "context", "value": "Update to UFS 4.0", "unit": "", "source_id": "ufs41", "source_kind": "", "source_title": "JEDEC Announces Updates to Universal Flash Storage (UFS) and Memory Interface Standards, UFS 4.1", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec%C2%AE-announces-updates-universal-flash-storage-ufs-and-memory-interface" }, { "record_type": "standard_mobile", "record_id": "jesd220h-universal-flash-storage-ufs-5-0", "label": "JESD220H Universal Flash Storage (UFS) 5.0", "maker": "JEDEC", "date": "2026-02", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "Universal Flash Storage 5.0. The catalog page offers it for purchase.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "JESD220H Universal Flash Storage (UFS) 5.0", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/standards-documents/docs/jesd220h" }, { "record_type": "standard_mobile", "record_id": "ufs-5-0", "label": "UFS 5.0 (JESD220H), on MIPI M-PHY 6.0", "maker": "JEDEC", "date": "2026-02-26", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "HS-G6 46.6 Gb/s per lane", "unit": "", "source_id": "ufs5", "source_kind": "", "source_title": "JEDEC Announces Updates to Universal Flash Storage (UFS) and Memory Interface Standards, UFS 5.0", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec%C2%AE-announces-updates-universal-flash-storage-ufs-and-memory-interface-0" }, { "record_type": "standard_mobile", "record_id": "ufs-5-0", "label": "UFS 5.0 (JESD220H), on MIPI M-PHY 6.0", "maker": "JEDEC", "date": "2026-02-26", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_UFS", "value": 46.6, "unit": "Gb/s per lane", "source_id": "ufs5", "source_kind": "", "source_title": "JEDEC Announces Updates to Universal Flash Storage (UFS) and Memory Interface Standards, UFS 5.0", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec%C2%AE-announces-updates-universal-flash-storage-ufs-and-memory-interface-0" }, { "record_type": "standard_peripheral", "record_id": "usb-3-0", "label": "USB 3.0 released, ten times the rate of USB 2.0", "maker": "USB 3.0 Promoter Group", "date": "2008-11", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "USB 3.0 SuperSpeed", "unit": "", "source_id": "usb-ss-intel", "source_kind": "", "source_title": "SuperSpeed USB and beyond", "source_publisher": "Intel", "source_url": "https://www.intel.com/content/dam/www/public/us/en/documents/articles/superspeed-usb-and-beyond-article.pdf" }, { "record_type": "standard_peripheral", "record_id": "usb-3-0", "label": "USB 3.0 released, ten times the rate of USB 2.0", "maker": "USB 3.0 Promoter Group", "date": "2008-11", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_USB", "value": 5, "unit": "Gb/s", "source_id": "usb-ss-intel", "source_kind": "", "source_title": "SuperSpeed USB and beyond", "source_publisher": "Intel", "source_url": "https://www.intel.com/content/dam/www/public/us/en/documents/articles/superspeed-usb-and-beyond-article.pdf" }, { "record_type": "standard_peripheral", "record_id": "sata-3-0", "label": "SATA Revision 3.0 released, the last SATA speed step", "maker": "SATA-IO", "date": "2009-05-27", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "Serial ATA Revision 3.0", "unit": "", "source_id": "sata3-pr", "source_kind": "", "source_title": "SATA-IO Releases SATA Revision 3.0 Specification", "source_publisher": "SATA-IO", "source_url": "https://sata-io.org/sites/default/files/documents/SATA-Revision-3.0-Press-Release-FINAL-052609.pdf" }, { "record_type": "standard_peripheral", "record_id": "sata-3-0", "label": "SATA Revision 3.0 released, the last SATA speed step", "maker": "SATA-IO", "date": "2009-05-27", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_SATA", "value": 6, "unit": "Gb/s per lane", "source_id": "sata3-pr", "source_kind": "", "source_title": "SATA-IO Releases SATA Revision 3.0 Specification", "source_publisher": "SATA-IO", "source_url": "https://sata-io.org/sites/default/files/documents/SATA-Revision-3.0-Press-Release-FINAL-052609.pdf" }, { "record_type": "standard_peripheral", "record_id": "thunderbolt-1", "label": "Thunderbolt launched, first on Apple’s new MacBook Pro", "maker": "Intel", "date": "2011-02-24", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "shipping", "value": "Thunderbolt", "unit": "", "source_id": "tb1-intel", "source_kind": "", "source_title": "Intel Announces Thunderbolt Technology: The Fastest Data Connection to Your PC Just Arrived", "source_publisher": "Intel", "source_url": "https://www.intc.com/news-events/press-releases/detail/678/intel-announces-thunderbolttm-technology-the-fastest" }, { "record_type": "standard_peripheral", "record_id": "thunderbolt-1", "label": "Thunderbolt launched, first on Apple’s new MacBook Pro", "maker": "Intel", "date": "2011-02-24", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_Thunderbolt", "value": 10, "unit": "Gb/s", "source_id": "tb1-intel", "source_kind": "", "source_title": "Intel Announces Thunderbolt Technology: The Fastest Data Connection to Your PC Just Arrived", "source_publisher": "Intel", "source_url": "https://www.intc.com/news-events/press-releases/detail/678/intel-announces-thunderbolttm-technology-the-fastest" }, { "record_type": "standard_peripheral", "record_id": "sas-24g", "label": "24G SAS specification development complete", "maker": "SCSI Trade Association", "date": "2017-08-08", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "24G SAS (SAS-4 and SPL-4)", "unit": "", "source_id": "sas24g-sta", "source_kind": "", "source_title": "24G SAS Data Storage Specification Development Complete; SCSI Trade Association Spotlights Technology at 2017 Flash Memory Summit", "source_publisher": "SCSI Trade Association (SNIA)", "source_url": "https://www.snia.org/news_events/newsroom/24g-sas-data-storage-specification-development-complete-scsi-trade-association" }, { "record_type": "standard_peripheral", "record_id": "sas-4-incits", "label": "SAS-4 published as INCITS 534-2019", "maker": "INCITS T10", "date": "2019", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "context", "value": "INCITS 534-2019", "unit": "", "source_id": "t10-sas4", "source_kind": "", "source_title": "Serial Attached SCSI - 4 (SAS-4)", "source_publisher": "INCITS T10", "source_url": "https://www.t10.org/members/w_sas4.htm" }, { "record_type": "standard_peripheral", "record_id": "usb4-announced", "label": "USB4 announced ahead of publication", "maker": "USB Promoter Group", "date": "2019-03-04", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "context", "value": "USB4, pending release", "unit": "", "source_id": "usb4-announce", "source_kind": "", "source_title": "USB Promoter Group Announces USB4 Specification", "source_publisher": "USB Promoter Group", "source_url": "https://www.usb.org/sites/default/files/2019-02/USB_PG_USB4_DevUpdate_Announcement_FINAL_20190226.pdf" }, { "record_type": "standard_peripheral", "record_id": "usb4", "label": "USB4 specification published, up to 40 Gb/s over two lanes", "maker": "USB-IF", "date": "2019-09-03", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "USB4, two lanes", "unit": "", "source_id": "usb4-pub", "source_kind": "", "source_title": "USB-IF Announces Publication of USB4 Specification", "source_publisher": "USB-IF", "source_url": "https://www.usb.org/sites/default/files/2019-09/USB-IF_USB4%20spec%20announcement_FINAL.pdf" }, { "record_type": "standard_peripheral", "record_id": "usb4", "label": "USB4 specification published, up to 40 Gb/s over two lanes", "maker": "USB-IF", "date": "2019-09-03", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_USB", "value": 40, "unit": "Gb/s", "source_id": "usb4-pub", "source_kind": "", "source_title": "USB-IF Announces Publication of USB4 Specification", "source_publisher": "USB-IF", "source_url": "https://www.usb.org/sites/default/files/2019-09/USB-IF_USB4%20spec%20announcement_FINAL.pdf" }, { "record_type": "standard_peripheral", "record_id": "thunderbolt-4", "label": "Thunderbolt 4 detailed, always 40 Gb/s", "maker": "Intel", "date": "2020-07-08", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "context", "value": "Thunderbolt 4, 8000-series controllers", "unit": "", "source_id": "tb4-intel", "source_kind": "", "source_title": "Introducing Thunderbolt 4: Universal Cable Connectivity for Everyone", "source_publisher": "Intel", "source_url": "https://download.intel.com/newsroom/archive/2025/en-us-2020-07-08-introducing-thunderbolt-4-universal-cable-connectivity-for-everyone.pdf" }, { "record_type": "standard_peripheral", "record_id": "sata-3-5a", "label": "SATA Revision 3.5a, the newest revision", "maker": "SATA-IO", "date": "2021-03", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "context", "value": "Serial ATA Revision 3.5a", "unit": "", "source_id": "sata-specs", "source_kind": "", "source_title": "Purchase SATA Specification", "source_publisher": "SATA-IO", "source_url": "https://sata-io.org/developers/purchase-specification" }, { "record_type": "standard_peripheral", "record_id": "usb4-v2", "label": "USB4 Version 2.0 published: USB 80Gbps over USB Type-C", "maker": "USB-IF", "date": "2022-10-18", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "spec", "value": "USB4 Version 2.0, PAM3", "unit": "", "source_id": "usb4v2-pub", "source_kind": "", "source_title": "USB-IF Announces Publication of New USB4 Specification to Enable USB 80Gbps Performance", "source_publisher": "USB-IF", "source_url": "https://www.usb.org/sites/default/files/2022-10/USB-IF%20USB%2080Gbps%20Announcement_FINAL_v2.pdf" }, { "record_type": "standard_peripheral", "record_id": "usb4-v2", "label": "USB4 Version 2.0 published: USB 80Gbps over USB Type-C", "maker": "USB-IF", "date": "2022-10-18", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_USB", "value": 80, "unit": "Gb/s", "source_id": "usb4v2-pub", "source_kind": "", "source_title": "USB-IF Announces Publication of New USB4 Specification to Enable USB 80Gbps Performance", "source_publisher": "USB-IF", "source_url": "https://www.usb.org/sites/default/files/2022-10/USB-IF%20USB%2080Gbps%20Announcement_FINAL_v2.pdf" }, { "record_type": "standard_peripheral", "record_id": "thunderbolt-5", "label": "Thunderbolt 5 announced with a prototype laptop and dock", "maker": "Intel", "date": "2023-09-12", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "sample", "value": "Thunderbolt 5, 120 Gb/s Bandwidth Boost", "unit": "", "source_id": "tb5-intel", "source_kind": "", "source_title": "Intel Introduces Thunderbolt 5 Connectivity Standard", "source_publisher": "Intel", "source_url": "https://www.intel.com/content/www/us/en/newsroom/news/intel-introduces-thunderbolt-5-standard.html" }, { "record_type": "standard_peripheral", "record_id": "thunderbolt-5", "label": "Thunderbolt 5 announced with a prototype laptop and dock", "maker": "Intel", "date": "2023-09-12", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "rate_Thunderbolt", "value": 80, "unit": "Gb/s", "source_id": "tb5-intel", "source_kind": "", "source_title": "Intel Introduces Thunderbolt 5 Connectivity Standard", "source_publisher": "Intel", "source_url": "https://www.intel.com/content/www/us/en/newsroom/news/intel-introduces-thunderbolt-5-standard.html" }, { "record_type": "standard_peripheral", "record_id": "sas-5-review", "label": "SAS-5 in public review", "maker": "INCITS T10", "date": "2026-09", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "context", "value": "SAS-5 draft", "unit": "", "source_id": "t10-sas5", "source_kind": "", "source_title": "Serial Attached SCSI - 5 (SAS-5)", "source_publisher": "INCITS T10", "source_url": "https://www.t10.org/members/w_sas5.htm" }, { "record_type": "standard_reliability", "record_id": "jep203-and-jep204-sic-short-circuit-guideline-stress-procedu", "label": "JEP203 and JEP204 (SiC short-circuit guideline; stress-procedure catalog)", "maker": "JEDEC", "date": "2026-06-03", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "Reliability guidelines for silicon-carbide power devices.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "JEP203 and JEP204 (SiC short-circuit guideline; stress-procedure catalog)", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec%C2%AE-releases-new-sic-guidelines-improve-reliability-and-evaluation-power" }, { "record_type": "standard_reliability", "record_id": "jesd264-silicon-photonics-qualification-and-reliability-requ", "label": "JESD264 silicon photonics qualification and reliability requirements", "maker": "JEDEC", "date": "2026-10-01", "bound": "", "derived": false, "teardown": false, "source_page": "", "measure": "document", "value": "Described by JEDEC as the first industry-wide silicon photonics reliability standard.", "unit": "", "source_id": "", "source_kind": "standard", "source_title": "JESD264 silicon photonics qualification and reliability requirements", "source_publisher": "JEDEC", "source_url": "https://www.jedec.org/news/pressreleases/jedec%C2%AE-publishes-first-industry-wide-silicon-photonics-reliability-standard-ai" } ] }