{ "name": "Fab Tracker sites", "url": "https://eyesonflash.com/bit-market/fab-tracker/", "creator": "Eyes on Flash", "rights": "All rights reserved. Copyright Sean Webster, Eyes on Flash (https://eyesonflash.com). You may read these files and link to them; do not copy, republish or redistribute them without written permission. Each figure comes from the source named on its row.", "dateModified": "2026-11-03", "about": "One row per sourced fact about a site: its status, a product it makes (production, with the node and tool where given), a layer count, a date the owner expects (expected_), the products it makes, and a co-owner with its share. date is the date the fact names, where it names one; last_checked is when the site was last checked. Dates are as the source states them: YYYY, YYYY-MM, YYYY-MM-DD, or a part of a year (YYYY-early, -mid, -late, -H1, -H2). Coordinates are left out: most are the city centre, not the plant. claim_id is the Eyes on Flash ledger claim the figure comes from and quote is words that appear in it; source_title and source_url name its first public source, source_urls lists them all separated by \" | \".", "columns": [ "last_checked", "site_id", "site_name", "owners", "city", "country", "kind", "measure", "value", "date", "claim_id", "quote", "source_title", "source_url", "source_urls" ], "rows": [ { "last_checked": "2026-10-12", "site_id": "kioxia-kitakami-k2", "site_name": "Kitakami K2", "owners": "Kioxia / Sandisk", "city": "Kitakami", "country": "JP", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-E-078", "quote": "began operation in September 2025", "source_title": "Kioxia Holdings: First Quarter of FY2026 Financial Results", "source_url": "https://ssl4.eir-parts.net/doc/285A/ir_material_for_fiscal_ym4/209425/00.pdf", "source_urls": "https://ssl4.eir-parts.net/doc/285A/ir_material_for_fiscal_ym4/209425/00.pdf" }, { "last_checked": "2026-10-12", "site_id": "kioxia-kitakami-k2", "site_name": "Kitakami K2", "owners": "Kioxia / Sandisk", "city": "Kitakami", "country": "JP", "kind": "fab", "measure": "products", "value": "NAND", "date": "", "claim_id": "C-D-020", "quote": "10th-generation 3D flash memory", "source_title": "Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products at Kitakami Plant Fab2", "source_url": "https://www.kioxia.com/en-jp/about/news/2026/20260703-2.html", "source_urls": "https://www.kioxia.com/en-jp/about/news/2026/20260703-2.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-kitakami-k2", "site_name": "Kitakami K2", "owners": "Kioxia / Sandisk", "city": "Kitakami", "country": "JP", "kind": "fab", "measure": "owner", "value": "Sandisk", "date": "", "claim_id": "C-D-020", "quote": "Kioxia and Sandisk (July 3, 2026) began production", "source_title": "Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products at Kitakami Plant Fab2", "source_url": "https://www.kioxia.com/en-jp/about/news/2026/20260703-2.html", "source_urls": "https://www.kioxia.com/en-jp/about/news/2026/20260703-2.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-kitakami-k2", "site_name": "Kitakami K2", "owners": "Kioxia / Sandisk", "city": "Kitakami", "country": "JP", "kind": "fab", "measure": "production", "value": "NAND 8th-generation", "date": "2025-09", "claim_id": "C-D-020", "quote": "K2 opened in September 2025 and has produced the companies' 8th-generation 3D flash memory", "source_title": "Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products at Kitakami Plant Fab2", "source_url": "https://www.kioxia.com/en-jp/about/news/2026/20260703-2.html", "source_urls": "https://www.kioxia.com/en-jp/about/news/2026/20260703-2.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-kitakami-k2", "site_name": "Kitakami K2", "owners": "Kioxia / Sandisk", "city": "Kitakami", "country": "JP", "kind": "fab", "measure": "production", "value": "NAND 10th-generation", "date": "2026-07-03", "claim_id": "C-D-020", "quote": "(July 3, 2026) began production of their 10th-generation 3D flash memory", "source_title": "Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products at Kitakami Plant Fab2", "source_url": "https://www.kioxia.com/en-jp/about/news/2026/20260703-2.html", "source_urls": "https://www.kioxia.com/en-jp/about/news/2026/20260703-2.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-kitakami-k2", "site_name": "Kitakami K2", "owners": "Kioxia / Sandisk", "city": "Kitakami", "country": "JP", "kind": "fab", "measure": "layers", "value": 332, "date": "2026-07-03", "claim_id": "C-D-088", "quote": "332 layers", "source_title": "Kioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power Consumption", "source_url": "https://apac.kioxia.com/en-apac/about/news/2026/20260703-1.html", "source_urls": "https://apac.kioxia.com/en-apac/about/news/2026/20260703-1.html" }, { "last_checked": "2026-10-12", "site_id": "micron-singapore-hbm-packaging", "site_name": "Singapore HBM packaging", "owners": "Micron", "city": "Singapore", "country": "SG", "kind": "packaging", "measure": "status", "value": "building", "date": "", "claim_id": "C-E-084", "quote": "Singapore HBM advanced packaging ground broken January 2025", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-singapore-hbm-packaging", "site_name": "Singapore HBM packaging", "owners": "Micron", "city": "Singapore", "country": "SG", "kind": "packaging", "measure": "expected_first-output", "value": "2027-early", "date": "2027-early", "claim_id": "C-E-064", "quote": "Singapore HBM advanced packaging initial output early calendar 2027", "source_title": "Fiscal Q4 2026 Earnings Call Prepared Remarks", "source_url": "https://s25.q4cdn.com/621799436/files/doc_financials/2026/q4/Q4-FY26-Prepared-Remarks.pdf", "source_urls": "https://s25.q4cdn.com/621799436/files/doc_financials/2026/q4/Q4-FY26-Prepared-Remarks.pdf" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-yongin-phase-1", "site_name": "Yongin Phase 1", "owners": "SK hynix", "city": "Yongin", "country": "KR", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-D-301", "quote": "SK hynix is currently constructing its first fab in Yongin (Y1)", "source_title": "SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory Demand", "source_url": "https://news.skhynix.com/en/fab-facility-investment-2026/", "source_urls": "https://news.skhynix.com/en/fab-facility-investment-2026/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-yongin-phase-1", "site_name": "Yongin Phase 1", "owners": "SK hynix", "city": "Yongin", "country": "KR", "kind": "fab", "measure": "expected_cleanroom-open", "value": "2027-early", "date": "2027-early", "claim_id": "C-E-081", "quote": "Yongin Phase 1 cleanroom opens in early 2027", "source_title": "SK hynix Announces 2Q26 Financial Results", "source_url": "https://news.skhynix.com/en/q2-2026-business-results/", "source_urls": "https://news.skhynix.com/en/q2-2026-business-results/" }, { "last_checked": "2026-10-12", "site_id": "micron-idaho-id1", "site_name": "Idaho ID1", "owners": "Micron", "city": "Boise", "country": "US", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-E-068", "quote": "construction began October 2023", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-idaho-id1", "site_name": "Idaho ID1", "owners": "Micron", "city": "Boise", "country": "US", "kind": "fab", "measure": "products", "value": "DRAM", "date": "", "claim_id": "C-D-008", "quote": "add new DRAM wafer capacity", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-idaho-id1", "site_name": "Idaho ID1", "owners": "Micron", "city": "Boise", "country": "US", "kind": "fab", "measure": "expected_first-output", "value": "2027-mid", "date": "2027-mid", "claim_id": "C-E-064", "quote": "Idaho ID1 wafer output mid-calendar 2027", "source_title": "Fiscal Q4 2026 Earnings Call Prepared Remarks", "source_url": "https://s25.q4cdn.com/621799436/files/doc_financials/2026/q4/Q4-FY26-Prepared-Remarks.pdf", "source_urls": "https://s25.q4cdn.com/621799436/files/doc_financials/2026/q4/Q4-FY26-Prepared-Remarks.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-tongluo", "site_name": "Tongluo, Taiwan", "owners": "Micron", "city": "Tongluo", "country": "TW", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-E-084", "quote": "a similar-sized second cleanroom under construction", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-tongluo", "site_name": "Tongluo, Taiwan", "owners": "Micron", "city": "Tongluo", "country": "TW", "kind": "fab", "measure": "products", "value": "DRAM", "date": "", "claim_id": "C-D-009", "quote": "existing production capacity for DRAM and HBM products", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-tongluo", "site_name": "Tongluo, Taiwan", "owners": "Micron", "city": "Tongluo", "country": "TW", "kind": "fab", "measure": "expected_shipments-start", "value": "2027-mid", "date": "2027-mid", "claim_id": "C-E-084", "quote": "meaningful shipments from the existing fab from mid-calendar 2027", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-idaho-id2", "site_name": "Idaho ID2", "owners": "Micron", "city": "Boise", "country": "US", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-E-084", "quote": "construction of the second Idaho fab began in 2026", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-idaho-id2", "site_name": "Idaho ID2", "owners": "Micron", "city": "Boise", "country": "US", "kind": "fab", "measure": "products", "value": "DRAM", "date": "", "claim_id": "C-D-008", "quote": "add new DRAM wafer capacity", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-idaho-id2", "site_name": "Idaho ID2", "owners": "Micron", "city": "Boise", "country": "US", "kind": "fab", "measure": "expected_first-output", "value": "2028-late", "date": "2028-late", "claim_id": "C-E-064", "quote": "ID2 late calendar 2028", "source_title": "Fiscal Q4 2026 Earnings Call Prepared Remarks", "source_url": "https://s25.q4cdn.com/621799436/files/doc_financials/2026/q4/Q4-FY26-Prepared-Remarks.pdf", "source_urls": "https://s25.q4cdn.com/621799436/files/doc_financials/2026/q4/Q4-FY26-Prepared-Remarks.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-hiroshima-cleanroom", "site_name": "Hiroshima cleanroom", "owners": "Micron", "city": "Higashihiroshima", "country": "JP", "kind": "cleanroom", "measure": "status", "value": "building", "date": "", "claim_id": "C-E-084", "quote": "Hiroshima cleanroom ground broken July 2026", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-hiroshima-cleanroom", "site_name": "Hiroshima cleanroom", "owners": "Micron", "city": "Higashihiroshima", "country": "JP", "kind": "cleanroom", "measure": "products", "value": "DRAM", "date": "", "claim_id": "C-E-064", "quote": "Japan DRAM expansion", "source_title": "Fiscal Q4 2026 Earnings Call Prepared Remarks", "source_url": "https://s25.q4cdn.com/621799436/files/doc_financials/2026/q4/Q4-FY26-Prepared-Remarks.pdf", "source_urls": "https://s25.q4cdn.com/621799436/files/doc_financials/2026/q4/Q4-FY26-Prepared-Remarks.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-hiroshima-cleanroom", "site_name": "Hiroshima cleanroom", "owners": "Micron", "city": "Higashihiroshima", "country": "JP", "kind": "cleanroom", "measure": "expected_first-output", "value": "2028-late", "date": "2028-late", "claim_id": "C-E-084", "quote": "initial output late calendar 2028", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-singapore-nand", "site_name": "Singapore NAND fab", "owners": "Micron", "city": "Singapore", "country": "SG", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-E-084", "quote": "Singapore NAND wafer fab ground broken January 2026", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-singapore-nand", "site_name": "Singapore NAND fab", "owners": "Micron", "city": "Singapore", "country": "SG", "kind": "fab", "measure": "products", "value": "NAND", "date": "", "claim_id": "C-D-012", "quote": "existing NAND manufacturing complex in Singapore", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-singapore-nand", "site_name": "Singapore NAND fab", "owners": "Micron", "city": "Singapore", "country": "SG", "kind": "fab", "measure": "expected_first-output", "value": "2028-H2", "date": "2028-H2", "claim_id": "C-E-064", "quote": "Singapore NAND facility output second half of calendar 2028", "source_title": "Fiscal Q4 2026 Earnings Call Prepared Remarks", "source_url": "https://s25.q4cdn.com/621799436/files/doc_financials/2026/q4/Q4-FY26-Prepared-Remarks.pdf", "source_urls": "https://s25.q4cdn.com/621799436/files/doc_financials/2026/q4/Q4-FY26-Prepared-Remarks.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-new-york-fab-1", "site_name": "New York fab 1", "owners": "Micron", "city": "Clay", "country": "US", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-E-069", "quote": "poured its first foundation concrete in July 2026", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-new-york-fab-1", "site_name": "New York fab 1", "owners": "Micron", "city": "Clay", "country": "US", "kind": "fab", "measure": "products", "value": "DRAM", "date": "", "claim_id": "C-D-008", "quote": "add new DRAM wafer capacity", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-new-york-fab-1", "site_name": "New York fab 1", "owners": "Micron", "city": "Clay", "country": "US", "kind": "fab", "measure": "expected_first-output", "value": "2030", "date": "2030", "claim_id": "C-E-069", "quote": "expects initial wafer output in calendar 2030", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-boise", "site_name": "Boise", "owners": "Micron", "city": "Boise", "country": "US", "kind": "rnd", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-141", "quote": "Boise, Idaho, USA", "source_title": "Corporate profile", "source_url": "https://www.micron.com/about/company/corporate-profile", "source_urls": "https://www.micron.com/about/company/corporate-profile" }, { "last_checked": "2026-10-12", "site_id": "micron-research-labs", "site_name": "Micron Research Labs", "owners": "Micron", "city": "Boise", "country": "US", "kind": "rnd", "measure": "status", "value": "announced", "date": "", "claim_id": "C-D-006", "quote": "In August 2026 Micron announced Micron Research Labs", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-manassas", "site_name": "Manassas fab", "owners": "Micron", "city": "Manassas", "country": "US", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-004", "quote": "first production starts of its 1-alpha DDR4 technology in its Manassas, Virginia, fab", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-manassas", "site_name": "Manassas fab", "owners": "Micron", "city": "Manassas", "country": "US", "kind": "fab", "measure": "products", "value": "DRAM", "date": "", "claim_id": "C-D-004", "quote": "1-alpha DDR4 technology", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-manassas", "site_name": "Manassas fab", "owners": "Micron", "city": "Manassas", "country": "US", "kind": "fab", "measure": "production", "value": "DRAM 1-alpha", "date": "2026", "claim_id": "C-D-004", "quote": "In 2026 Micron launched first production starts of its 1-alpha DDR4 technology in its Manassas", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-gujarat", "site_name": "Gujarat assembly and test", "owners": "Micron", "city": "Sanand", "country": "IN", "kind": "assembly", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-007", "quote": "commenced commercial shipments and started ramping production in 2026", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-hiroshima", "site_name": "Hiroshima fab", "owners": "Micron", "city": "Higashihiroshima", "country": "JP", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-141", "quote": "Hiroshima, Japan", "source_title": "Corporate profile", "source_url": "https://www.micron.com/about/company/corporate-profile", "source_urls": "https://www.micron.com/about/company/corporate-profile" }, { "last_checked": "2026-10-12", "site_id": "micron-hiroshima", "site_name": "Hiroshima fab", "owners": "Micron", "city": "Higashihiroshima", "country": "JP", "kind": "fab", "measure": "products", "value": "DRAM", "date": "", "claim_id": "C-E-064", "quote": "Japan DRAM expansion", "source_title": "Fiscal Q4 2026 Earnings Call Prepared Remarks", "source_url": "https://s25.q4cdn.com/621799436/files/doc_financials/2026/q4/Q4-FY26-Prepared-Remarks.pdf", "source_urls": "https://s25.q4cdn.com/621799436/files/doc_financials/2026/q4/Q4-FY26-Prepared-Remarks.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-hiroshima", "site_name": "Hiroshima fab", "owners": "Micron", "city": "Higashihiroshima", "country": "JP", "kind": "fab", "measure": "production", "value": "DRAM 1-beta", "date": "2023-05-17", "claim_id": "C-D-087", "quote": "said on 2023-05-17 that it mass produces its 1-beta DRAM node in its Hiroshima fab", "source_title": "Micron to Bring EUV Technology to Japan, Advancing Next-Generation Memory Manufacturing", "source_url": "https://s25.q4cdn.com/621799436/files/doc_news/2023/05/Micron-to-Bring-EUV-Technology-to-Japan-Advancing-Next-Generation-Memory-Manufacturing.pdf", "source_urls": "https://s25.q4cdn.com/621799436/files/doc_news/2023/05/Micron-to-Bring-EUV-Technology-to-Japan-Advancing-Next-Generation-Memory-Manufacturing.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-hiroshima", "site_name": "Hiroshima fab", "owners": "Micron", "city": "Higashihiroshima", "country": "JP", "kind": "fab", "measure": "production", "value": "DRAM 1-gamma (EUV) planned", "date": "2025", "claim_id": "C-D-087", "quote": "will produce the EUV-based 1-gamma node there, and expects to ramp EUV on 1-gamma in Taiwan and Japan from 2025", "source_title": "Micron to Bring EUV Technology to Japan, Advancing Next-Generation Memory Manufacturing", "source_url": "https://s25.q4cdn.com/621799436/files/doc_news/2023/05/Micron-to-Bring-EUV-Technology-to-Japan-Advancing-Next-Generation-Memory-Manufacturing.pdf", "source_urls": "https://s25.q4cdn.com/621799436/files/doc_news/2023/05/Micron-to-Bring-EUV-Technology-to-Japan-Advancing-Next-Generation-Memory-Manufacturing.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-muar", "site_name": "Muar", "owners": "Micron", "city": "Muar", "country": "MY", "kind": "assembly", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-141", "quote": "Muar, Malaysia", "source_title": "Corporate profile", "source_url": "https://www.micron.com/about/company/corporate-profile", "source_urls": "https://www.micron.com/about/company/corporate-profile" }, { "last_checked": "2026-10-12", "site_id": "micron-penang", "site_name": "Penang", "owners": "Micron", "city": "Penang", "country": "MY", "kind": "assembly", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-141", "quote": "Penang, Malaysia", "source_title": "Corporate profile", "source_url": "https://www.micron.com/about/company/corporate-profile", "source_urls": "https://www.micron.com/about/company/corporate-profile" }, { "last_checked": "2026-10-12", "site_id": "micron-singapore-nand-complex", "site_name": "Singapore NAND complex", "owners": "Micron", "city": "Singapore", "country": "SG", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-012", "quote": "existing NAND manufacturing complex in Singapore", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-singapore-nand-complex", "site_name": "Singapore NAND complex", "owners": "Micron", "city": "Singapore", "country": "SG", "kind": "fab", "measure": "products", "value": "NAND", "date": "", "claim_id": "C-D-012", "quote": "existing NAND manufacturing complex in Singapore", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-singapore-nand-complex", "site_name": "Singapore NAND complex", "owners": "Micron", "city": "Singapore", "country": "SG", "kind": "fab", "measure": "production", "value": "NAND", "date": "2022-07-26", "claim_id": "C-D-089", "quote": "232-layer NAND, announced 2022-07-26, in its Singapore fab", "source_title": "Micron Ships World’s First 232-Layer NAND, Extends Technology Leadership", "source_url": "https://investors.micron.com/news/press-release/2022/Micron-Ships-Worlds-First-232-Layer-NAND-Extends-Technology-Leadership-07-26-2022/default.aspx", "source_urls": "https://investors.micron.com/news/press-release/2022/Micron-Ships-Worlds-First-232-Layer-NAND-Extends-Technology-Leadership-07-26-2022/default.aspx" }, { "last_checked": "2026-10-12", "site_id": "micron-singapore-nand-complex", "site_name": "Singapore NAND complex", "owners": "Micron", "city": "Singapore", "country": "SG", "kind": "fab", "measure": "layers", "value": 232, "date": "2022-07-26", "claim_id": "C-D-089", "quote": "232-layer NAND", "source_title": "Micron Ships World’s First 232-Layer NAND, Extends Technology Leadership", "source_url": "https://investors.micron.com/news/press-release/2022/Micron-Ships-Worlds-First-232-Layer-NAND-Extends-Technology-Leadership-07-26-2022/default.aspx", "source_urls": "https://investors.micron.com/news/press-release/2022/Micron-Ships-Worlds-First-232-Layer-NAND-Extends-Technology-Leadership-07-26-2022/default.aspx" }, { "last_checked": "2026-10-12", "site_id": "micron-taichung", "site_name": "Taichung", "owners": "Micron", "city": "Taichung", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-141", "quote": "Taichung, Taiwan", "source_title": "Corporate profile", "source_url": "https://www.micron.com/about/company/corporate-profile", "source_urls": "https://www.micron.com/about/company/corporate-profile" }, { "last_checked": "2026-10-12", "site_id": "micron-taichung", "site_name": "Taichung", "owners": "Micron", "city": "Taichung", "country": "TW", "kind": "fab", "measure": "products", "value": "DRAM", "date": "", "claim_id": "C-D-009", "quote": "existing production capacity for DRAM and HBM products", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-taoyuan", "site_name": "Taoyuan", "owners": "Micron", "city": "Taoyuan", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-141", "quote": "Taoyuan, Taiwan", "source_title": "Corporate profile", "source_url": "https://www.micron.com/about/company/corporate-profile", "source_urls": "https://www.micron.com/about/company/corporate-profile" }, { "last_checked": "2026-10-12", "site_id": "micron-taoyuan", "site_name": "Taoyuan", "owners": "Micron", "city": "Taoyuan", "country": "TW", "kind": "fab", "measure": "products", "value": "DRAM", "date": "", "claim_id": "C-D-009", "quote": "existing production capacity for DRAM and HBM products", "source_title": "Form 10-K for the fiscal year ended September 3, 2026", "source_url": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf", "source_urls": "https://d18rn0p25nwr6d.cloudfront.net/CIK-0000723125/5dafce68-38e8-4cad-a8f3-ab56d04d73fd.pdf" }, { "last_checked": "2026-10-12", "site_id": "micron-xian", "site_name": "Xi'an", "owners": "Micron", "city": "Xi'an", "country": "CN", "kind": "assembly", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-141", "quote": "Xian, China", "source_title": "Corporate profile", "source_url": "https://www.micron.com/about/company/corporate-profile", "source_urls": "https://www.micron.com/about/company/corporate-profile" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-icheon", "site_name": "Icheon", "owners": "SK hynix", "city": "Icheon", "country": "KR", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-016", "quote": "Its existing production bases are Icheon and Cheongju", "source_title": "Explainer: SK hynix’s Mid-to-Long-Term Investment Strategy", "source_url": "https://news.skhynix.com/en/fact-05/", "source_urls": "https://news.skhynix.com/en/fact-05/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-icheon", "site_name": "Icheon", "owners": "SK hynix", "city": "Icheon", "country": "KR", "kind": "fab", "measure": "production", "value": "DRAM", "date": "2015-08", "claim_id": "C-D-080", "quote": "M14 in Icheon in 2015-08", "source_title": "SK hynix company history", "source_url": "https://www.skhynix.com/company/UI-FR-CP05/", "source_urls": "https://www.skhynix.com/company/UI-FR-CP05/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-icheon", "site_name": "Icheon", "owners": "SK hynix", "city": "Icheon", "country": "KR", "kind": "fab", "measure": "production", "value": "DRAM", "date": "2021-02-01", "claim_id": "C-D-084", "quote": "completed its M16 DRAM plant in Icheon on 2021-02-01", "source_title": "SK hynix Announces the Completion of M16 Plant Construction", "source_url": "https://news.skhynix.com/en/sk-hynix-announces-the-completion-of-m16-plant-construction/", "source_urls": "https://news.skhynix.com/en/sk-hynix-announces-the-completion-of-m16-plant-construction/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-icheon", "site_name": "Icheon", "owners": "SK hynix", "city": "Icheon", "country": "KR", "kind": "fab", "measure": "production", "value": "DRAM 1a nm (EUV) planned", "date": "2021-H2", "claim_id": "C-D-084", "quote": "M16 is SK hynix's first fab with EUV and was to make 1a nm DRAM from the second half of 2021", "source_title": "SK hynix Announces the Completion of M16 Plant Construction", "source_url": "https://news.skhynix.com/en/sk-hynix-announces-the-completion-of-m16-plant-construction/", "source_urls": "https://news.skhynix.com/en/sk-hynix-announces-the-completion-of-m16-plant-construction/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-icheon", "site_name": "Icheon", "owners": "SK hynix", "city": "Icheon", "country": "KR", "kind": "fab", "measure": "production", "value": "DRAM (High NA EUV)", "date": "2025-09-03", "claim_id": "C-D-194", "quote": "SK hynix (Seoul, September 3, 2025): SK hynix assembled the industry's first High NA EUV lithography system for mass production at the M16 fabrication plant in Icheon", "source_title": "SK hynix Introduces Industry’s First Commercial High NA EUV", "source_url": "https://news.skhynix.com/en/sk-hynix-introduces-industrys-first-commercial-high-na-euv/", "source_urls": "https://news.skhynix.com/en/sk-hynix-introduces-industrys-first-commercial-high-na-euv/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-cheongju", "site_name": "Cheongju M11, M12, M15", "owners": "SK hynix", "city": "Cheongju", "country": "KR", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-304", "quote": "The Cheongju Campus already houses the M11, M12 and M15 fabs", "source_title": "SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory Demand", "source_url": "https://news.skhynix.com/en/fab-facility-investment-2026/", "source_urls": "https://news.skhynix.com/en/fab-facility-investment-2026/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-cheongju", "site_name": "Cheongju M11, M12, M15", "owners": "SK hynix", "city": "Cheongju", "country": "KR", "kind": "fab", "measure": "production", "value": "NAND", "date": "2018-10", "claim_id": "C-D-080", "quote": "M15 in Cheongju was completed in 2018-10", "source_title": "SK hynix company history", "source_url": "https://www.skhynix.com/company/UI-FR-CP05/", "source_urls": "https://www.skhynix.com/company/UI-FR-CP05/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-cheongju-m17", "site_name": "Cheongju M17", "owners": "SK hynix", "city": "Cheongju", "country": "KR", "kind": "fab", "measure": "status", "value": "announced", "date": "", "claim_id": "C-D-305", "quote": "the board approved about 54 trillion won", "source_title": "SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory Demand", "source_url": "https://news.skhynix.com/en/fab-facility-investment-2026/", "source_urls": "https://news.skhynix.com/en/fab-facility-investment-2026/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-cheongju-m17", "site_name": "Cheongju M17", "owners": "SK hynix", "city": "Cheongju", "country": "KR", "kind": "fab", "measure": "products", "value": "NAND", "date": "", "claim_id": "C-D-300", "quote": "new DRAM and NAND fabs in Yongin (Y2) and Cheongju (M17)", "source_title": "SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory Demand", "source_url": "https://news.skhynix.com/en/fab-facility-investment-2026/", "source_urls": "https://news.skhynix.com/en/fab-facility-investment-2026/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-cheongju-m17", "site_name": "Cheongju M17", "owners": "SK hynix", "city": "Cheongju", "country": "KR", "kind": "fab", "measure": "expected_cleanroom-open", "value": "2028-12", "date": "2028-12", "claim_id": "C-D-303", "quote": "first cleanroom in December 2028", "source_title": "SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory Demand", "source_url": "https://news.skhynix.com/en/fab-facility-investment-2026/", "source_urls": "https://news.skhynix.com/en/fab-facility-investment-2026/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-yongin-y2", "site_name": "Yongin Y2", "owners": "SK hynix", "city": "Yongin", "country": "KR", "kind": "fab", "measure": "status", "value": "announced", "date": "", "claim_id": "C-D-305", "quote": "the board approved about 54 trillion won", "source_title": "SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory Demand", "source_url": "https://news.skhynix.com/en/fab-facility-investment-2026/", "source_urls": "https://news.skhynix.com/en/fab-facility-investment-2026/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-yongin-y2", "site_name": "Yongin Y2", "owners": "SK hynix", "city": "Yongin", "country": "KR", "kind": "fab", "measure": "products", "value": "DRAM / HBM", "date": "", "claim_id": "C-D-302", "quote": "to produce HBM and next-generation DRAM", "source_title": "SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory Demand", "source_url": "https://news.skhynix.com/en/fab-facility-investment-2026/", "source_urls": "https://news.skhynix.com/en/fab-facility-investment-2026/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-yongin-y2", "site_name": "Yongin Y2", "owners": "SK hynix", "city": "Yongin", "country": "KR", "kind": "fab", "measure": "expected_cleanroom-open", "value": "2029-06", "date": "2029-06", "claim_id": "C-D-302", "quote": "first cleanroom targeted for June 2029", "source_title": "SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory Demand", "source_url": "https://news.skhynix.com/en/fab-facility-investment-2026/", "source_urls": "https://news.skhynix.com/en/fab-facility-investment-2026/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-west-lafayette", "site_name": "West Lafayette HBM packaging", "owners": "SK hynix", "city": "West Lafayette", "country": "US", "kind": "packaging", "measure": "status", "value": "building", "date": "", "claim_id": "C-D-013", "quote": "SK hynix held a groundbreaking ceremony for an advanced packaging production facility for AI memory in West Lafayette, Indiana", "source_title": "SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI”", "source_url": "https://news.skhynix.com/en/groundbreaking-ceremony-in-indiana/", "source_urls": "https://news.skhynix.com/en/groundbreaking-ceremony-in-indiana/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-west-lafayette", "site_name": "West Lafayette HBM packaging", "owners": "SK hynix", "city": "West Lafayette", "country": "US", "kind": "packaging", "measure": "products", "value": "HBM", "date": "", "claim_id": "C-D-013", "quote": "mass production of next-generation HBM", "source_title": "SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI”", "source_url": "https://news.skhynix.com/en/groundbreaking-ceremony-in-indiana/", "source_urls": "https://news.skhynix.com/en/groundbreaking-ceremony-in-indiana/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-west-lafayette", "site_name": "West Lafayette HBM packaging", "owners": "SK hynix", "city": "West Lafayette", "country": "US", "kind": "packaging", "measure": "expected_cleanroom-open", "value": "2028-10", "date": "2028-10", "claim_id": "C-D-013", "quote": "the cleanroom is to open by October 2028", "source_title": "SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI”", "source_url": "https://news.skhynix.com/en/groundbreaking-ceremony-in-indiana/", "source_urls": "https://news.skhynix.com/en/groundbreaking-ceremony-in-indiana/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-west-lafayette", "site_name": "West Lafayette HBM packaging", "owners": "SK hynix", "city": "West Lafayette", "country": "US", "kind": "packaging", "measure": "expected_first-output", "value": "2029-H2", "date": "2029-H2", "claim_id": "C-D-013", "quote": "mass production of next-generation HBM to begin in the second half of 2029", "source_title": "SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI”", "source_url": "https://news.skhynix.com/en/groundbreaking-ceremony-in-indiana/", "source_urls": "https://news.skhynix.com/en/groundbreaking-ceremony-in-indiana/" }, { "last_checked": "2026-10-12", "site_id": "samsung-giheung", "site_name": "Giheung", "owners": "Samsung Electronics", "city": "Giheung", "country": "KR", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-268", "quote": "The Giheung fab was founded in 1983", "source_title": "Manufacturing sites | Manufacturing", "source_url": "https://semiconductor.samsung.com/foundry/manufacturing/manufacturing-sites/", "source_urls": "https://semiconductor.samsung.com/foundry/manufacturing/manufacturing-sites/" }, { "last_checked": "2026-10-12", "site_id": "samsung-hwaseong", "site_name": "Hwaseong", "owners": "Samsung Electronics", "city": "Hwaseong", "country": "KR", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-268", "quote": "the Hwaseong fab followed in 2000 and produces 10nm to 3nm processes", "source_title": "Manufacturing sites | Manufacturing", "source_url": "https://semiconductor.samsung.com/foundry/manufacturing/manufacturing-sites/", "source_urls": "https://semiconductor.samsung.com/foundry/manufacturing/manufacturing-sites/" }, { "last_checked": "2026-10-12", "site_id": "samsung-hwaseong", "site_name": "Hwaseong", "owners": "Samsung Electronics", "city": "Hwaseong", "country": "KR", "kind": "fab", "measure": "production", "value": "logic 5nm (EUV) planned", "date": "2020-H2", "claim_id": "C-D-306", "quote": "5nm EUV mass production in the Hwaseong fab is scheduled for the second half of 2020", "source_title": "Samsung Electronics Expands its Foundry Capacity with A New Production Line in Pyeongtaek, Korea", "source_url": "https://news.samsung.com/global/samsung-electronics-expands-its-foundry-capacity-with-a-new-production-line-in-pyeongtaek-korea", "source_urls": "https://news.samsung.com/global/samsung-electronics-expands-its-foundry-capacity-with-a-new-production-line-in-pyeongtaek-korea" }, { "last_checked": "2026-10-12", "site_id": "samsung-pyeongtaek", "site_name": "Pyeongtaek", "owners": "Samsung Electronics", "city": "Pyeongtaek", "country": "KR", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-266", "quote": "the Pyeongtaek fab mass produces further advanced nodes", "source_title": "Manufacturing sites | Manufacturing", "source_url": "https://semiconductor.samsung.com/foundry/manufacturing/manufacturing-sites/", "source_urls": "https://semiconductor.samsung.com/foundry/manufacturing/manufacturing-sites/" }, { "last_checked": "2026-10-12", "site_id": "samsung-pyeongtaek", "site_name": "Pyeongtaek", "owners": "Samsung Electronics", "city": "Pyeongtaek", "country": "KR", "kind": "fab", "measure": "production", "value": "NAND fourth-generation", "date": "2017-07-04", "claim_id": "C-D-264", "quote": "began mass production and first shipments on July 4, 2017", "source_title": "Samsung Electronics Begins Mass Production at New Semiconductor Plant in Pyeongtaek, South Korea", "source_url": "https://news.samsung.com/global/samsung-electronics-begins-mass-production-at-new-semiconductor-plant-in-pyeongtaek-south-korea", "source_urls": "https://news.samsung.com/global/samsung-electronics-begins-mass-production-at-new-semiconductor-plant-in-pyeongtaek-south-korea" }, { "last_checked": "2026-10-12", "site_id": "samsung-pyeongtaek", "site_name": "Pyeongtaek", "owners": "Samsung Electronics", "city": "Pyeongtaek", "country": "KR", "kind": "fab", "measure": "layers", "value": 64, "date": "2017-07-04", "claim_id": "C-D-262", "quote": "fourth-generation 64-layer V-NAND", "source_title": "Samsung Electronics Begins Mass Production at New Semiconductor Plant in Pyeongtaek, South Korea", "source_url": "https://news.samsung.com/global/samsung-electronics-begins-mass-production-at-new-semiconductor-plant-in-pyeongtaek-south-korea", "source_urls": "https://news.samsung.com/global/samsung-electronics-begins-mass-production-at-new-semiconductor-plant-in-pyeongtaek-south-korea" }, { "last_checked": "2026-10-12", "site_id": "samsung-pyeongtaek", "site_name": "Pyeongtaek", "owners": "Samsung Electronics", "city": "Pyeongtaek", "country": "KR", "kind": "fab", "measure": "production", "value": "logic 5nm (EUV) planned", "date": "2021-H2", "claim_id": "C-D-311", "quote": "a new Pyeongtaek foundry line for 5nm EUV began construction that month and is expected to start volume production in the second half of 2021", "source_title": "Samsung Electronics Expands its Foundry Capacity with A New Production Line in Pyeongtaek, Korea", "source_url": "https://news.samsung.com/global/samsung-electronics-expands-its-foundry-capacity-with-a-new-production-line-in-pyeongtaek-korea", "source_urls": "https://news.samsung.com/global/samsung-electronics-expands-its-foundry-capacity-with-a-new-production-line-in-pyeongtaek-korea" }, { "last_checked": "2026-10-12", "site_id": "samsung-cheonan", "site_name": "Cheonan", "owners": "Samsung Electronics", "city": "Cheonan", "country": "KR", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-018", "quote": "five campuses in Korea: Giheung, Hwaseong, Pyeongtaek, Cheonan and Onyang", "source_title": "Empowering Communities | Sustainability", "source_url": "https://semiconductor.samsung.com/sustainability/people/empowering-communities/", "source_urls": "https://semiconductor.samsung.com/sustainability/people/empowering-communities/" }, { "last_checked": "2026-10-12", "site_id": "samsung-onyang", "site_name": "Onyang", "owners": "Samsung Electronics", "city": "Asan", "country": "KR", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-018", "quote": "five campuses in Korea: Giheung, Hwaseong, Pyeongtaek, Cheonan and Onyang", "source_title": "Empowering Communities | Sustainability", "source_url": "https://semiconductor.samsung.com/sustainability/people/empowering-communities/", "source_urls": "https://semiconductor.samsung.com/sustainability/people/empowering-communities/" }, { "last_checked": "2026-10-12", "site_id": "kioxia-yokkaichi", "site_name": "Yokkaichi Plant (Fab1 to Fab7)", "owners": "Kioxia / Sandisk", "city": "Yokkaichi", "country": "JP", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-251", "quote": "Fab6 started operation in 2018 and the Memory R&D Center construction was completed in 2018", "source_title": "History of Yokkaichi Plant", "source_url": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html", "source_urls": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-yokkaichi", "site_name": "Yokkaichi Plant (Fab1 to Fab7)", "owners": "Kioxia / Sandisk", "city": "Yokkaichi", "country": "JP", "kind": "fab", "measure": "products", "value": "NAND", "date": "", "claim_id": "C-D-248", "quote": "production of NAND flash memory started in 1999", "source_title": "History of Yokkaichi Plant", "source_url": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html", "source_urls": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-yokkaichi", "site_name": "Yokkaichi Plant (Fab1 to Fab7)", "owners": "Kioxia / Sandisk", "city": "Yokkaichi", "country": "JP", "kind": "fab", "measure": "owner", "value": "Sandisk", "date": "", "claim_id": "C-D-019", "quote": "their joint venture framework at Kioxia's Yokkaichi Plant", "source_title": "Kioxia and Sandisk to Invest Over $31 Billion in Japan, Extending Leadership in Memory Industry", "source_url": "https://www.kioxia.com/en-jp/about/news/2026/20260827-3.html", "source_urls": "https://www.kioxia.com/en-jp/about/news/2026/20260827-3.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-yokkaichi", "site_name": "Yokkaichi Plant (Fab1 to Fab7)", "owners": "Kioxia / Sandisk", "city": "Yokkaichi", "country": "JP", "kind": "fab", "measure": "production", "value": "DRAM", "date": "1993", "claim_id": "C-D-259", "quote": "Fab1 started operation in 1993 with 16Mbit DRAM", "source_title": "History of Yokkaichi Plant", "source_url": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html", "source_urls": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-yokkaichi", "site_name": "Yokkaichi Plant (Fab1 to Fab7)", "owners": "Kioxia / Sandisk", "city": "Yokkaichi", "country": "JP", "kind": "fab", "measure": "production", "value": "DRAM", "date": "1996", "claim_id": "C-D-259", "quote": "Fab2 started operation in 1996 with 64Mbit DRAM", "source_title": "History of Yokkaichi Plant", "source_url": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html", "source_urls": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-yokkaichi", "site_name": "Yokkaichi Plant (Fab1 to Fab7)", "owners": "Kioxia / Sandisk", "city": "Yokkaichi", "country": "JP", "kind": "fab", "measure": "production", "value": "NAND", "date": "1999", "claim_id": "C-D-248", "quote": "production of NAND flash memory started in 1999", "source_title": "History of Yokkaichi Plant", "source_url": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html", "source_urls": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-yokkaichi", "site_name": "Yokkaichi Plant (Fab1 to Fab7)", "owners": "Kioxia / Sandisk", "city": "Yokkaichi", "country": "JP", "kind": "fab", "measure": "production", "value": "NAND", "date": "2005", "claim_id": "C-D-249", "quote": "the 300mm-wafer Fab3 started operation in 2005", "source_title": "History of Yokkaichi Plant", "source_url": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html", "source_urls": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-yokkaichi", "site_name": "Yokkaichi Plant (Fab1 to Fab7)", "owners": "Kioxia / Sandisk", "city": "Yokkaichi", "country": "JP", "kind": "fab", "measure": "production", "value": "NAND", "date": "2007-06", "claim_id": "C-D-254", "quote": "Fab4 started operations in June 2007", "source_title": "History of Yokkaichi Plant", "source_url": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html", "source_urls": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-yokkaichi", "site_name": "Yokkaichi Plant (Fab1 to Fab7)", "owners": "Kioxia / Sandisk", "city": "Yokkaichi", "country": "JP", "kind": "fab", "measure": "production", "value": "NAND 19nm", "date": "2011", "claim_id": "C-D-258", "quote": "Fab5 construction was completed in April 2011 and mass production of the world's first and smallest 19nm NAND flash memory started", "source_title": "History of Yokkaichi Plant", "source_url": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html", "source_urls": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-yokkaichi", "site_name": "Yokkaichi Plant (Fab1 to Fab7)", "owners": "Kioxia / Sandisk", "city": "Yokkaichi", "country": "JP", "kind": "fab", "measure": "production", "value": "NAND", "date": "2014", "claim_id": "C-D-250", "quote": "Fab5 (Phase2) started operation in 2014", "source_title": "History of Yokkaichi Plant", "source_url": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html", "source_urls": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-yokkaichi", "site_name": "Yokkaichi Plant (Fab1 to Fab7)", "owners": "Kioxia / Sandisk", "city": "Yokkaichi", "country": "JP", "kind": "fab", "measure": "production", "value": "NAND BiCS FLASH", "date": "2016", "claim_id": "C-D-250", "quote": "mass production of 3D flash memory BiCS FLASH started in 2016", "source_title": "History of Yokkaichi Plant", "source_url": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html", "source_urls": "https://www.kioxia.com/en-jp/about/yokkaichi/history.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-yokkaichi", "site_name": "Yokkaichi Plant (Fab1 to Fab7)", "owners": "Kioxia / Sandisk", "city": "Yokkaichi", "country": "JP", "kind": "fab", "measure": "production", "value": "NAND", "date": "2018-09", "claim_id": "C-D-074", "quote": "2018-09; 96-layer", "source_title": "Toshiba Memory and Western Digital Celebrate the Opening of Fab 6 and Memory R&D Center at Yokkaichi, Japan", "source_url": "https://www.kioxia.com/en-jp/about/news/2018/20180919-1.html", "source_urls": "https://www.kioxia.com/en-jp/about/news/2018/20180919-1.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-yokkaichi", "site_name": "Yokkaichi Plant (Fab1 to Fab7)", "owners": "Kioxia / Sandisk", "city": "Yokkaichi", "country": "JP", "kind": "fab", "measure": "layers", "value": 96, "date": "2018-09", "claim_id": "C-D-074", "quote": "96-layer 3D flash", "source_title": "Toshiba Memory and Western Digital Celebrate the Opening of Fab 6 and Memory R&D Center at Yokkaichi, Japan", "source_url": "https://www.kioxia.com/en-jp/about/news/2018/20180919-1.html", "source_urls": "https://www.kioxia.com/en-jp/about/news/2018/20180919-1.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-yokkaichi", "site_name": "Yokkaichi Plant (Fab1 to Fab7)", "owners": "Kioxia / Sandisk", "city": "Yokkaichi", "country": "JP", "kind": "fab", "measure": "production", "value": "NAND fifth-generation BiCS FLASH planned", "date": "2020-01-31", "claim_id": "C-D-076", "quote": "unveiled 112-layer fifth-generation BiCS FLASH on 2020-01-31, about 20 percent denser than 96-layer, to be made at its Yokkaichi Plant", "source_title": "Kioxia Corporation Unveils 5th-Generation BiCS FLASH™", "source_url": "https://www.kioxia.com/en-jp/business/news/2020/20200131-1.html", "source_urls": "https://www.kioxia.com/en-jp/business/news/2020/20200131-1.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-yokkaichi", "site_name": "Yokkaichi Plant (Fab1 to Fab7)", "owners": "Kioxia / Sandisk", "city": "Yokkaichi", "country": "JP", "kind": "fab", "measure": "layers", "value": 112, "date": "2020-01-31", "claim_id": "C-D-076", "quote": "112-layer fifth-generation BiCS FLASH", "source_title": "Kioxia Corporation Unveils 5th-Generation BiCS FLASH™", "source_url": "https://www.kioxia.com/en-jp/business/news/2020/20200131-1.html", "source_urls": "https://www.kioxia.com/en-jp/business/news/2020/20200131-1.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-kitakami-k1", "site_name": "Kitakami K1", "owners": "Kioxia / Sandisk", "city": "Kitakami", "country": "JP", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-021", "quote": "the Kitakami Plant has Fab1 and Fab2", "source_title": "Kioxia and Sandisk Announce Beginning of Operation of Fab2 at Kitakami Plant, Japan to Meet the Market Demand Driven by AI", "source_url": "https://apac.kioxia.com/en-apac/about/news/2025/20250930-1.html", "source_urls": "https://apac.kioxia.com/en-apac/about/news/2025/20250930-1.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-kitakami-k1", "site_name": "Kitakami K1", "owners": "Kioxia / Sandisk", "city": "Kitakami", "country": "JP", "kind": "fab", "measure": "owner", "value": "Sandisk", "date": "", "claim_id": "C-D-021", "quote": "joint venture partnership of over 20 years", "source_title": "Kioxia and Sandisk Announce Beginning of Operation of Fab2 at Kitakami Plant, Japan to Meet the Market Demand Driven by AI", "source_url": "https://apac.kioxia.com/en-apac/about/news/2025/20250930-1.html", "source_urls": "https://apac.kioxia.com/en-apac/about/news/2025/20250930-1.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-kitakami-k1", "site_name": "Kitakami K1", "owners": "Kioxia / Sandisk", "city": "Kitakami", "country": "JP", "kind": "fab", "measure": "production", "value": "NAND fifth-generation BiCS FLASH planned", "date": "2020-01-31", "claim_id": "C-D-076", "quote": "unveiled 112-layer fifth-generation BiCS FLASH on 2020-01-31, about 20 percent denser than 96-layer, to be made at its Yokkaichi Plant", "source_title": "Kioxia Corporation Unveils 5th-Generation BiCS FLASH™", "source_url": "https://www.kioxia.com/en-jp/business/news/2020/20200131-1.html", "source_urls": "https://www.kioxia.com/en-jp/business/news/2020/20200131-1.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-kitakami-k1", "site_name": "Kitakami K1", "owners": "Kioxia / Sandisk", "city": "Kitakami", "country": "JP", "kind": "fab", "measure": "layers", "value": 112, "date": "2020-01-31", "claim_id": "C-D-076", "quote": "112-layer fifth-generation BiCS FLASH", "source_title": "Kioxia Corporation Unveils 5th-Generation BiCS FLASH™", "source_url": "https://www.kioxia.com/en-jp/business/news/2020/20200131-1.html", "source_urls": "https://www.kioxia.com/en-jp/business/news/2020/20200131-1.html" }, { "last_checked": "2026-10-12", "site_id": "kioxia-kitakami-k1", "site_name": "Kitakami K1", "owners": "Kioxia / Sandisk", "city": "Kitakami", "country": "JP", "kind": "fab", "measure": "production", "value": "NAND", "date": "2020", "claim_id": "C-D-075", "quote": "started Fab1 operation in 2020", "source_title": "Kitakami Plant (KIOXIA Iwate Corporation)", "source_url": "https://www.kioxia.com/en-jp/about/kitakami.html", "source_urls": "https://www.kioxia.com/en-jp/about/kitakami.html" }, { "last_checked": "2026-10-12", "site_id": "cxmt-hefei", "site_name": "Hefei Fab A (A1, A2)", "owners": "CXMT", "city": "Hefei", "country": "CN", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-313", "quote": "2022.06 Fab A2 (Hefei) construction completed", "source_title": "About CXMT", "source_url": "https://www.cxmt.com/en/about.html", "source_urls": "https://www.cxmt.com/en/about.html" }, { "last_checked": "2026-10-12", "site_id": "cxmt-hefei", "site_name": "Hefei Fab A (A1, A2)", "owners": "CXMT", "city": "Hefei", "country": "CN", "kind": "fab", "measure": "products", "value": "DRAM", "date": "", "claim_id": "C-D-247", "quote": "manufactures DRAM", "source_title": "About CXMT", "source_url": "https://www.cxmt.com/en/about.html", "source_urls": "https://www.cxmt.com/en/about.html" }, { "last_checked": "2026-10-12", "site_id": "cxmt-hefei", "site_name": "Hefei Fab A (A1, A2)", "owners": "CXMT", "city": "Hefei", "country": "CN", "kind": "fab", "measure": "production", "value": "DRAM", "date": "2019", "claim_id": "C-D-312", "quote": "2019.09 CXMT announced 8Gb DDR4 for mass production", "source_title": "About CXMT", "source_url": "https://www.cxmt.com/en/about.html", "source_urls": "https://www.cxmt.com/en/about.html" }, { "last_checked": "2026-10-12", "site_id": "cxmt-beijing", "site_name": "Beijing Fab C (C1, C2)", "owners": "CXMT", "city": "Beijing", "country": "CN", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-313", "quote": "2022.01 operation began on the Fab C1 (Beijing) trial production line", "source_title": "About CXMT", "source_url": "https://www.cxmt.com/en/about.html", "source_urls": "https://www.cxmt.com/en/about.html" }, { "last_checked": "2026-10-12", "site_id": "cxmt-beijing", "site_name": "Beijing Fab C (C1, C2)", "owners": "CXMT", "city": "Beijing", "country": "CN", "kind": "fab", "measure": "products", "value": "DRAM", "date": "", "claim_id": "C-D-247", "quote": "manufactures DRAM", "source_title": "About CXMT", "source_url": "https://www.cxmt.com/en/about.html", "source_urls": "https://www.cxmt.com/en/about.html" }, { "last_checked": "2026-10-12", "site_id": "cxmt-beijing", "site_name": "Beijing Fab C (C1, C2)", "owners": "CXMT", "city": "Beijing", "country": "CN", "kind": "fab", "measure": "production", "value": "DRAM", "date": "2022", "claim_id": "C-D-313", "quote": "2022.01 operation began on the Fab C1 (Beijing) trial production line", "source_title": "About CXMT", "source_url": "https://www.cxmt.com/en/about.html", "source_urls": "https://www.cxmt.com/en/about.html" }, { "last_checked": "2026-10-12", "site_id": "ymtc-wuhan", "site_name": "Wuhan fabs 1 and 2", "owners": "YMTC", "city": "Wuhan", "country": "CN", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-025", "quote": "YMTC's two existing Wuhan fabs, focused on NAND", "source_title": "[News] China’s NAND Giant YMTC Reportedly Moves into HBM Using TSV, Following CXMT and Huawei", "source_url": "https://www.trendforce.com/news/2025/09/26/news-chinas-nand-giant-ymtc-reportedly-moves-into-hbm-using-tsv-following-cxmt-and-huawei/", "source_urls": "https://www.trendforce.com/news/2025/09/26/news-chinas-nand-giant-ymtc-reportedly-moves-into-hbm-using-tsv-following-cxmt-and-huawei/" }, { "last_checked": "2026-10-12", "site_id": "ymtc-wuhan", "site_name": "Wuhan fabs 1 and 2", "owners": "YMTC", "city": "Wuhan", "country": "CN", "kind": "fab", "measure": "products", "value": "NAND", "date": "", "claim_id": "C-D-025", "quote": "YMTC's two existing Wuhan fabs, focused on NAND", "source_title": "[News] China’s NAND Giant YMTC Reportedly Moves into HBM Using TSV, Following CXMT and Huawei", "source_url": "https://www.trendforce.com/news/2025/09/26/news-chinas-nand-giant-ymtc-reportedly-moves-into-hbm-using-tsv-following-cxmt-and-huawei/", "source_urls": "https://www.trendforce.com/news/2025/09/26/news-chinas-nand-giant-ymtc-reportedly-moves-into-hbm-using-tsv-following-cxmt-and-huawei/" }, { "last_checked": "2026-10-12", "site_id": "ymtc-wuhan", "site_name": "Wuhan fabs 1 and 2", "owners": "YMTC", "city": "Wuhan", "country": "CN", "kind": "fab", "measure": "production", "value": "NAND Gen 1", "date": "2018", "claim_id": "C-D-269", "quote": "Gen 1 (X0-A030) in 2018", "source_title": "YMTC Company Profile and Milestones", "source_url": "https://www.ymtc.com/en/intro.html", "source_urls": "https://www.ymtc.com/en/intro.html" }, { "last_checked": "2026-10-12", "site_id": "ymtc-wuhan", "site_name": "Wuhan fabs 1 and 2", "owners": "YMTC", "city": "Wuhan", "country": "CN", "kind": "fab", "measure": "production", "value": "NAND Gen 2", "date": "2019", "claim_id": "C-D-269", "quote": "Gen 2 (X1-9050) in 2019", "source_title": "YMTC Company Profile and Milestones", "source_url": "https://www.ymtc.com/en/intro.html", "source_urls": "https://www.ymtc.com/en/intro.html" }, { "last_checked": "2026-10-12", "site_id": "ymtc-wuhan", "site_name": "Wuhan fabs 1 and 2", "owners": "YMTC", "city": "Wuhan", "country": "CN", "kind": "fab", "measure": "production", "value": "NAND Gen 3", "date": "2021", "claim_id": "C-D-270", "quote": "Gen 3 TLC/QLC (X2-9060/X2-6070) in 2021", "source_title": "YMTC Company Profile and Milestones", "source_url": "https://www.ymtc.com/en/intro.html", "source_urls": "https://www.ymtc.com/en/intro.html" }, { "last_checked": "2026-10-12", "site_id": "ymtc-wuhan", "site_name": "Wuhan fabs 1 and 2", "owners": "YMTC", "city": "Wuhan", "country": "CN", "kind": "fab", "measure": "production", "value": "NAND Gen 4", "date": "2022", "claim_id": "C-D-271", "quote": "Gen 4 TLC (X3-9060/X3-9070) in 2022", "source_title": "YMTC Company Profile and Milestones", "source_url": "https://www.ymtc.com/en/intro.html", "source_urls": "https://www.ymtc.com/en/intro.html" }, { "last_checked": "2026-10-12", "site_id": "ymtc-wuhan", "site_name": "Wuhan fabs 1 and 2", "owners": "YMTC", "city": "Wuhan", "country": "CN", "kind": "fab", "measure": "layers", "value": 232, "date": "2022", "claim_id": "C-D-097", "quote": "232 active layers", "source_title": "Comparison: Latest 3D NAND Products from YMTC, Samsung, SK hynix and Micron (TechInsights)", "source_url": "https://www.techinsights.com/blog/comparison-latest-3d-nand-products-ymtc-samsung-sk-hynix-and-micron", "source_urls": "https://www.techinsights.com/blog/comparison-latest-3d-nand-products-ymtc-samsung-sk-hynix-and-micron | https://www.techinsights.com/blog/comparison-latest-3d-nand-products-ymtc-samsung-sk-hynix-and-micron" }, { "last_checked": "2026-10-12", "site_id": "ymtc-wuhan", "site_name": "Wuhan fabs 1 and 2", "owners": "YMTC", "city": "Wuhan", "country": "CN", "kind": "fab", "measure": "production", "value": "NAND Gen 5", "date": "2024", "claim_id": "C-D-272", "quote": "Gen 5 TLC (X4-9060/X4-9070) in 2024", "source_title": "YMTC Company Profile and Milestones", "source_url": "https://www.ymtc.com/en/intro.html", "source_urls": "https://www.ymtc.com/en/intro.html" }, { "last_checked": "2026-10-12", "site_id": "ymtc-wuhan-phase-3", "site_name": "Wuhan Phase III", "owners": "YMTC", "city": "Wuhan", "country": "CN", "kind": "fab", "measure": "status", "value": "announced", "date": "", "claim_id": "C-D-154", "quote": "Changcun Phase III (Wuhan) Integrated Circuit Co. has registered capital of RMB 20.72 billion (nearly $3 billion)", "source_title": "[News] China’s YMTC Launches $3B Wuhan Phase III Venture, Signaling NAND Expansion Ambitions", "source_url": "https://www.trendforce.com/news/2025/09/09/news-chinas-ymtc-launches-3b-wuhan-phase-iii-venture-signaling-nand-expansion-ambitions/", "source_urls": "https://www.trendforce.com/news/2025/09/09/news-chinas-ymtc-launches-3b-wuhan-phase-iii-venture-signaling-nand-expansion-ambitions/" }, { "last_checked": "2026-10-12", "site_id": "ymtc-wuhan-phase-3", "site_name": "Wuhan Phase III", "owners": "YMTC", "city": "Wuhan", "country": "CN", "kind": "fab", "measure": "products", "value": "NAND", "date": "", "claim_id": "C-D-025", "quote": "focused on NAND", "source_title": "[News] China’s NAND Giant YMTC Reportedly Moves into HBM Using TSV, Following CXMT and Huawei", "source_url": "https://www.trendforce.com/news/2025/09/26/news-chinas-nand-giant-ymtc-reportedly-moves-into-hbm-using-tsv-following-cxmt-and-huawei/", "source_urls": "https://www.trendforce.com/news/2025/09/26/news-chinas-nand-giant-ymtc-reportedly-moves-into-hbm-using-tsv-following-cxmt-and-huawei/" }, { "last_checked": "2026-10-12", "site_id": "ymtc-wuhan-phase-3", "site_name": "Wuhan Phase III", "owners": "YMTC", "city": "Wuhan", "country": "CN", "kind": "fab", "measure": "owner", "value": "YMTC (50.2%)", "date": "", "claim_id": "C-D-154", "quote": "YMTC holds a 50.2% stake", "source_title": "[News] China’s YMTC Launches $3B Wuhan Phase III Venture, Signaling NAND Expansion Ambitions", "source_url": "https://www.trendforce.com/news/2025/09/09/news-chinas-ymtc-launches-3b-wuhan-phase-iii-venture-signaling-nand-expansion-ambitions/", "source_urls": "https://www.trendforce.com/news/2025/09/09/news-chinas-ymtc-launches-3b-wuhan-phase-iii-venture-signaling-nand-expansion-ambitions/" }, { "last_checked": "2026-10-12", "site_id": "tsmc-ap1", "site_name": "Advanced Backend Fab 1", "owners": "TSMC", "city": "Hsinchu", "country": "TW", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-278", "quote": "Advanced Backend Fab 1 (Hsinchu Science Park)", "source_title": "TSMC Fabs - Taiwan Semiconductor Manufacturing Company Limited", "source_url": "https://www.tsmc.com/english/aboutTSMC/TSMC_Fabs", "source_urls": "https://www.tsmc.com/english/aboutTSMC/TSMC_Fabs" }, { "last_checked": "2026-10-12", "site_id": "tsmc-ap2", "site_name": "Advanced Backend Fab 2", "owners": "TSMC", "city": "Tainan", "country": "TW", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-278", "quote": "Advanced Backend Fab 2 (Southern Taiwan Science Park, Tainan)", "source_title": "TSMC Fabs - Taiwan Semiconductor Manufacturing Company Limited", "source_url": "https://www.tsmc.com/english/aboutTSMC/TSMC_Fabs", "source_urls": "https://www.tsmc.com/english/aboutTSMC/TSMC_Fabs" }, { "last_checked": "2026-10-12", "site_id": "tsmc-ap3", "site_name": "Advanced Backend Fab 3", "owners": "TSMC", "city": "Taoyuan", "country": "TW", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-276", "quote": "Advanced Backend Fab 3 (Longtan, Taoyuan)", "source_title": "TSMC Fabs - Taiwan Semiconductor Manufacturing Company Limited", "source_url": "https://www.tsmc.com/english/aboutTSMC/TSMC_Fabs", "source_urls": "https://www.tsmc.com/english/aboutTSMC/TSMC_Fabs" }, { "last_checked": "2026-10-12", "site_id": "tsmc-ap5", "site_name": "Advanced Backend Fab 5", "owners": "TSMC", "city": "Taichung", "country": "TW", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-276", "quote": "Advanced Backend Fab 5 (Central Taiwan Science Park, Taichung)", "source_title": "TSMC Fabs - Taiwan Semiconductor Manufacturing Company Limited", "source_url": "https://www.tsmc.com/english/aboutTSMC/TSMC_Fabs", "source_urls": "https://www.tsmc.com/english/aboutTSMC/TSMC_Fabs" }, { "last_checked": "2026-10-12", "site_id": "tsmc-ap6", "site_name": "Advanced Backend Fab 6", "owners": "TSMC", "city": "Zhunan", "country": "TW", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-277", "quote": "Advanced Backend Fab 6 (Zhunan, Miaoli)", "source_title": "TSMC Fabs - Taiwan Semiconductor Manufacturing Company Limited", "source_url": "https://www.tsmc.com/english/aboutTSMC/TSMC_Fabs", "source_urls": "https://www.tsmc.com/english/aboutTSMC/TSMC_Fabs" }, { "last_checked": "2026-10-12", "site_id": "seagate-springtown", "site_name": "Springtown", "owners": "Seagate", "city": "Springtown", "country": "GB", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-030", "quote": "Springtown, Northern Ireland, manufacture of recording heads", "source_title": "Seagate Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "seagate-springtown", "site_name": "Springtown", "owners": "Seagate", "city": "Springtown", "country": "GB", "kind": "plant", "measure": "products", "value": "heads", "date": "", "claim_id": "C-D-030", "quote": "Springtown, Northern Ireland, manufacture of recording heads", "source_title": "Seagate Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "seagate-minnesota", "site_name": "Minnesota", "owners": "Seagate", "city": "Bloomington", "country": "US", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-030", "quote": "Minnesota, manufacture of recording heads", "source_title": "Seagate Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "seagate-minnesota", "site_name": "Minnesota", "owners": "Seagate", "city": "Bloomington", "country": "US", "kind": "plant", "measure": "products", "value": "heads", "date": "", "claim_id": "C-D-030", "quote": "Minnesota, manufacture of recording heads", "source_title": "Seagate Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "seagate-wuxi", "site_name": "Wuxi", "owners": "Seagate", "city": "Wuxi", "country": "CN", "kind": "assembly", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-030", "quote": "Wuxi, China, manufacture of drives and drive subassemblies", "source_title": "Seagate Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "seagate-johor", "site_name": "Johor", "owners": "Seagate", "city": "Johor Bahru", "country": "MY", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-030", "quote": "Johor, Malaysia, manufacture of substrates", "source_title": "Seagate Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "seagate-woodlands", "site_name": "Woodlands", "owners": "Seagate", "city": "Singapore", "country": "SG", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-030", "quote": "Woodlands, Singapore, manufacture of media", "source_title": "Seagate Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "seagate-woodlands", "site_name": "Woodlands", "owners": "Seagate", "city": "Singapore", "country": "SG", "kind": "plant", "measure": "products", "value": "media", "date": "", "claim_id": "C-D-030", "quote": "Woodlands, Singapore, manufacture of media", "source_title": "Seagate Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "seagate-korat", "site_name": "Korat", "owners": "Seagate", "city": "Nakhon Ratchasima", "country": "TH", "kind": "assembly", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-030", "quote": "Korat, Thailand, manufacture of drives and drive subassemblies", "source_title": "Seagate Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "seagate-teparuk", "site_name": "Teparuk", "owners": "Seagate", "city": "Samut Prakan", "country": "TH", "kind": "assembly", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-030", "quote": "Teparuk, Thailand, manufacture of drive subassemblies", "source_title": "Seagate Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1137789/000113778926000159/stx-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "western-digital-fremont", "site_name": "Fremont", "owners": "Western Digital", "city": "Fremont", "country": "US", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-031", "quote": "Fremont, California (manufacturing and R&D)", "source_title": "Western Digital Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "western-digital-san-jose", "site_name": "San Jose", "owners": "Western Digital", "city": "San Jose", "country": "US", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-031", "quote": "San Jose, California (manufacturing, R&D", "source_title": "Western Digital Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "western-digital-shenzhen", "site_name": "Shenzhen", "owners": "Western Digital", "city": "Shenzhen", "country": "CN", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-031", "quote": "Shenzhen, China (manufacturing)", "source_title": "Western Digital Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "western-digital-johor-bahru", "site_name": "Johor Bahru", "owners": "Western Digital", "city": "Johor Bahru", "country": "MY", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-031", "quote": "Johor Bahru, Malaysia (manufacturing)", "source_title": "Western Digital Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "western-digital-kuching", "site_name": "Kuching", "owners": "Western Digital", "city": "Kuching", "country": "MY", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-031", "quote": "Kuching, Malaysia (manufacturing and R&D)", "source_title": "Western Digital Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "western-digital-penang", "site_name": "Penang", "owners": "Western Digital", "city": "Penang", "country": "MY", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-031", "quote": "Penang, Malaysia (manufacturing)", "source_title": "Western Digital Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "western-digital-laguna", "site_name": "Laguna", "owners": "Western Digital", "city": "Laguna", "country": "PH", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-031", "quote": "Laguna, Philippines (manufacturing and administrative)", "source_title": "Western Digital Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "western-digital-bang-pa-in", "site_name": "Bang Pa-In", "owners": "Western Digital", "city": "Bang Pa-In", "country": "TH", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-031", "quote": "Bang Pa-In, Thailand (manufacturing and R&D)", "source_title": "Western Digital Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "western-digital-prachinburi", "site_name": "Prachinburi", "owners": "Western Digital", "city": "Prachinburi", "country": "TH", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-031", "quote": "Prachinburi, Thailand (manufacturing)", "source_title": "Western Digital Form 10-K, fiscal year ended July 3, 2026", "source_url": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/106040/000162828026057139/wdc-20260703.htm" }, { "last_checked": "2026-10-12", "site_id": "nanya-new-taipei-new-fab", "site_name": "New Taipei new fab", "owners": "Nanya Technology", "city": "New Taipei", "country": "TW", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-D-032", "quote": "held a groundbreaking ceremony for a new semiconductor fab in New Taipei City's Nanlin Technology Park", "source_title": "Nanya Technology New Fab Groundbreaking Ceremony", "source_url": "https://www.nanya.com/en/IR/16/?IRId=793", "source_urls": "https://www.nanya.com/en/IR/16/?IRId=793" }, { "last_checked": "2026-10-12", "site_id": "nanya-new-taipei-new-fab", "site_name": "New Taipei new fab", "owners": "Nanya Technology", "city": "New Taipei", "country": "TW", "kind": "fab", "measure": "products", "value": "DRAM", "date": "", "claim_id": "C-D-032", "quote": "an advanced DRAM fab with a double-deck cleanroom", "source_title": "Nanya Technology New Fab Groundbreaking Ceremony", "source_url": "https://www.nanya.com/en/IR/16/?IRId=793", "source_urls": "https://www.nanya.com/en/IR/16/?IRId=793" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-wuxi", "site_name": "Wuxi", "owners": "SK hynix", "city": "Wuxi", "country": "CN", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-142", "quote": "Wuxi Headquarters (Production site)", "source_title": "SK hynix Global Network", "source_url": "https://www.skhynix.com/company/UI-FR-CP06/", "source_urls": "https://www.skhynix.com/company/UI-FR-CP06/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-wuxi", "site_name": "Wuxi", "owners": "SK hynix", "city": "Wuxi", "country": "CN", "kind": "plant", "measure": "products", "value": "DRAM", "date": "", "claim_id": "C-D-150", "quote": "monthly DRAM wafer capacity", "source_title": "[News] SK hynix Reportedly to Double DRAM Capacity to 1M Monthly Wafers by 2030, Speeds Yongin Expansion", "source_url": "https://www.trendforce.com/news/2026/06/05/news-sk-hynix-reportedly-to-double-dram-capacity-to-1m-monthly-wafers-by-2030-speeds-yongin-expansion/", "source_urls": "https://www.trendforce.com/news/2026/06/05/news-sk-hynix-reportedly-to-double-dram-capacity-to-1m-monthly-wafers-by-2030-speeds-yongin-expansion/" }, { "last_checked": "2026-10-12", "site_id": "sk-hynix-wuxi", "site_name": "Wuxi", "owners": "SK hynix", "city": "Wuxi", "country": "CN", "kind": "plant", "measure": "production", "value": "DRAM", "date": "2019-04", "claim_id": "C-D-080", "quote": "the expanded Wuxi fab C2F in 2019-04", "source_title": "SK hynix company history", "source_url": "https://www.skhynix.com/company/UI-FR-CP05/", "source_urls": "https://www.skhynix.com/company/UI-FR-CP05/" }, { "last_checked": "2026-11-03", "site_id": "sk-hynix-cheongju-m15x", "site_name": "Cheongju M15X", "owners": "SK hynix", "city": "Cheongju", "country": "KR", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-D-148", "quote": "SK hynix's M15X fab in Cheongju is scheduled to begin operations in the second half of 2026", "source_title": "[News] SK hynix Reportedly to Double DRAM Capacity to 1M Monthly Wafers by 2030, Speeds Yongin Expansion", "source_url": "https://www.trendforce.com/news/2026/06/05/news-sk-hynix-reportedly-to-double-dram-capacity-to-1m-monthly-wafers-by-2030-speeds-yongin-expansion/", "source_urls": "https://www.trendforce.com/news/2026/06/05/news-sk-hynix-reportedly-to-double-dram-capacity-to-1m-monthly-wafers-by-2030-speeds-yongin-expansion/" }, { "last_checked": "2026-11-03", "site_id": "sk-hynix-cheongju-m15x", "site_name": "Cheongju M15X", "owners": "SK hynix", "city": "Cheongju", "country": "KR", "kind": "fab", "measure": "products", "value": "DRAM", "date": "", "claim_id": "C-D-149", "quote": "All newly added SK hynix capacity is currently designated for DRAM production", "source_title": "[News] SK hynix Reportedly to Double DRAM Capacity to 1M Monthly Wafers by 2030, Speeds Yongin Expansion", "source_url": "https://www.trendforce.com/news/2026/06/05/news-sk-hynix-reportedly-to-double-dram-capacity-to-1m-monthly-wafers-by-2030-speeds-yongin-expansion/", "source_urls": "https://www.trendforce.com/news/2026/06/05/news-sk-hynix-reportedly-to-double-dram-capacity-to-1m-monthly-wafers-by-2030-speeds-yongin-expansion/" }, { "last_checked": "2026-11-03", "site_id": "sk-hynix-cheongju-m15x", "site_name": "Cheongju M15X", "owners": "SK hynix", "city": "Cheongju", "country": "KR", "kind": "fab", "measure": "expected_first-output", "value": "2026-H2", "date": "2026-H2", "claim_id": "C-D-148", "quote": "scheduled to begin operations in the second half of 2026", "source_title": "[News] SK hynix Reportedly to Double DRAM Capacity to 1M Monthly Wafers by 2030, Speeds Yongin Expansion", "source_url": "https://www.trendforce.com/news/2026/06/05/news-sk-hynix-reportedly-to-double-dram-capacity-to-1m-monthly-wafers-by-2030-speeds-yongin-expansion/", "source_urls": "https://www.trendforce.com/news/2026/06/05/news-sk-hynix-reportedly-to-double-dram-capacity-to-1m-monthly-wafers-by-2030-speeds-yongin-expansion/" }, { "last_checked": "2026-11-03", "site_id": "sk-hynix-cheongju-m15x", "site_name": "Cheongju M15X", "owners": "SK hynix", "city": "Cheongju", "country": "KR", "kind": "fab", "measure": "expected_full-ramp", "value": "2026", "date": "2026", "claim_id": "C-D-324", "quote": "October 28, 2026: To respond to surging HBM demand, the company will ramp up M15X to maximum capacity by the end of the year", "source_title": "SK hynix Announces 3Q26 Financial Results", "source_url": "https://news.skhynix.com/en/q3-2026-business-results/", "source_urls": "https://news.skhynix.com/en/q3-2026-business-results/" }, { "last_checked": "2026-10-13", "site_id": "samsung-pyeongtaek-p5", "site_name": "Pyeongtaek P5", "owners": "Samsung Electronics", "city": "Pyeongtaek", "country": "KR", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-D-152", "quote": "Samsung has resumed construction of its Pyeongtaek Campus Line 5 (P5)", "source_title": "[News] Samsung Reportedly Plans 200K 1c DRAM Wafers/Month by 2026, About One-Third of Its Total Output", "source_url": "https://www.trendforce.com/news/2025/11/19/news-samsung-reportedly-plans-200k-1c-dram-wafersmonth-by-2026-about-one-third-of-its-total-output/", "source_urls": "https://www.trendforce.com/news/2025/11/19/news-samsung-reportedly-plans-200k-1c-dram-wafersmonth-by-2026-about-one-third-of-its-total-output/" }, { "last_checked": "2026-10-13", "site_id": "samsung-pyeongtaek-p5", "site_name": "Pyeongtaek P5", "owners": "Samsung Electronics", "city": "Pyeongtaek", "country": "KR", "kind": "fab", "measure": "products", "value": "DRAM / HBM", "date": "", "claim_id": "C-D-152", "quote": "a base for next-generation HBM and 1c DRAM", "source_title": "[News] Samsung Reportedly Plans 200K 1c DRAM Wafers/Month by 2026, About One-Third of Its Total Output", "source_url": "https://www.trendforce.com/news/2025/11/19/news-samsung-reportedly-plans-200k-1c-dram-wafersmonth-by-2026-about-one-third-of-its-total-output/", "source_urls": "https://www.trendforce.com/news/2025/11/19/news-samsung-reportedly-plans-200k-1c-dram-wafersmonth-by-2026-about-one-third-of-its-total-output/" }, { "last_checked": "2026-10-13", "site_id": "samsung-pyeongtaek-p5", "site_name": "Pyeongtaek P5", "owners": "Samsung Electronics", "city": "Pyeongtaek", "country": "KR", "kind": "fab", "measure": "expected_first-output", "value": "2028", "date": "2028", "claim_id": "C-D-152", "quote": "targeted for operation in 2028", "source_title": "[News] Samsung Reportedly Plans 200K 1c DRAM Wafers/Month by 2026, About One-Third of Its Total Output", "source_url": "https://www.trendforce.com/news/2025/11/19/news-samsung-reportedly-plans-200k-1c-dram-wafersmonth-by-2026-about-one-third-of-its-total-output/", "source_urls": "https://www.trendforce.com/news/2025/11/19/news-samsung-reportedly-plans-200k-1c-dram-wafersmonth-by-2026-about-one-third-of-its-total-output/" }, { "last_checked": "2026-10-13", "site_id": "samsung-pyeongtaek-p5", "site_name": "Pyeongtaek P5", "owners": "Samsung Electronics", "city": "Pyeongtaek", "country": "KR", "kind": "fab", "measure": "production", "value": "DRAM 1c planned", "date": "2028", "claim_id": "C-D-152", "quote": "targeted for operation in 2028 as a base for next-generation HBM and 1c DRAM", "source_title": "[News] Samsung Reportedly Plans 200K 1c DRAM Wafers/Month by 2026, About One-Third of Its Total Output", "source_url": "https://www.trendforce.com/news/2025/11/19/news-samsung-reportedly-plans-200k-1c-dram-wafersmonth-by-2026-about-one-third-of-its-total-output/", "source_urls": "https://www.trendforce.com/news/2025/11/19/news-samsung-reportedly-plans-200k-1c-dram-wafersmonth-by-2026-about-one-third-of-its-total-output/" }, { "last_checked": "2026-10-13", "site_id": "sk-hynix-dalian", "site_name": "Dalian", "owners": "SK hynix", "city": "Dalian", "country": "CN", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-036", "quote": "the Dalian NAND flash manufacturing facility in China", "source_title": "SK hynix completes the First Phase of Intel NAND and SSD Business Acquisition", "source_url": "https://news.skhynix.com/en/sk-hynix-completes-the-first-phase-of-intel-nand-and-ssd-business-acquisition", "source_urls": "https://news.skhynix.com/en/sk-hynix-completes-the-first-phase-of-intel-nand-and-ssd-business-acquisition" }, { "last_checked": "2026-10-13", "site_id": "sk-hynix-dalian", "site_name": "Dalian", "owners": "SK hynix", "city": "Dalian", "country": "CN", "kind": "fab", "measure": "products", "value": "NAND", "date": "", "claim_id": "C-D-036", "quote": "the Dalian NAND flash manufacturing facility", "source_title": "SK hynix completes the First Phase of Intel NAND and SSD Business Acquisition", "source_url": "https://news.skhynix.com/en/sk-hynix-completes-the-first-phase-of-intel-nand-and-ssd-business-acquisition", "source_urls": "https://news.skhynix.com/en/sk-hynix-completes-the-first-phase-of-intel-nand-and-ssd-business-acquisition" }, { "last_checked": "2026-10-15", "site_id": "samsung-xian", "site_name": "Xi’an", "owners": "Samsung Electronics", "city": "Xi’an", "country": "CN", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-081", "quote": "began full-scale manufacturing on 2014-05-09", "source_title": "Samsung Announces Operation of its Memory Facility in Xi'an, China", "source_url": "https://news.samsung.com/global/samsung-announces-operation-of-its-memory-facility-in-xian-china", "source_urls": "https://news.samsung.com/global/samsung-announces-operation-of-its-memory-facility-in-xian-china" }, { "last_checked": "2026-10-15", "site_id": "samsung-xian", "site_name": "Xi’an", "owners": "Samsung Electronics", "city": "Xi’an", "country": "CN", "kind": "fab", "measure": "products", "value": "NAND", "date": "", "claim_id": "C-D-081", "quote": "making 3D V-NAND", "source_title": "Samsung Announces Operation of its Memory Facility in Xi'an, China", "source_url": "https://news.samsung.com/global/samsung-announces-operation-of-its-memory-facility-in-xian-china", "source_urls": "https://news.samsung.com/global/samsung-announces-operation-of-its-memory-facility-in-xian-china" }, { "last_checked": "2026-10-15", "site_id": "samsung-xian", "site_name": "Xi’an", "owners": "Samsung Electronics", "city": "Xi’an", "country": "CN", "kind": "fab", "measure": "production", "value": "NAND 3D V-NAND", "date": "2014-05-09", "claim_id": "C-D-081", "quote": "began full-scale manufacturing on 2014-05-09, making 3D V-NAND", "source_title": "Samsung Announces Operation of its Memory Facility in Xi'an, China", "source_url": "https://news.samsung.com/global/samsung-announces-operation-of-its-memory-facility-in-xian-china", "source_urls": "https://news.samsung.com/global/samsung-announces-operation-of-its-memory-facility-in-xian-china" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-2", "site_name": "Fab 2", "owners": "TSMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-239", "quote": "Fab 2: commercial production from 1990, 6-inch wafers, 450 nm", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-3", "site_name": "Fab 3", "owners": "TSMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-239", "quote": "Fab 3: commercial production from 1995, 8-inch wafers, 150 nm", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-5", "site_name": "Fab 5", "owners": "TSMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-239", "quote": "Fab 5: commercial production from 1997, 8-inch wafers, 150 nm", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-6", "site_name": "Fab 6", "owners": "TSMC", "city": "Tainan", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-239", "quote": "Fab 6: commercial production from 2000, 8-inch wafers, 110 nm", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-8", "site_name": "Fab 8", "owners": "TSMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-239", "quote": "Fab 8: commercial production from 1998, 8-inch wafers, 110 nm", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-10", "site_name": "Fab 10", "owners": "TSMC", "city": "Shanghai", "country": "CN", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-239", "quote": "Fab 10: commercial production from 2004, 8-inch wafers, 150 nm", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-11", "site_name": "Fab 11", "owners": "TSMC", "city": "Camas", "country": "US", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-239", "quote": "Fab 11: commercial production from 1998, 8-inch wafers, 150 nm", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-12", "site_name": "Fab 12", "owners": "TSMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-240", "quote": "Fab 12: commercial production from 2001, 12-inch wafers, 40 nm", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-12", "site_name": "Fab 12", "owners": "TSMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 10nm", "date": "2017", "claim_id": "C-D-098", "quote": "Fab 12: 10nm (2017 year-end", "source_title": "TSMC Form 20-F for fiscal year 2017", "source_url": "https://www.sec.gov/Archives/edgar/data/1046179/000119312518121866/d459142d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1046179/000119312518121866/d459142d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-12", "site_name": "Fab 12", "owners": "TSMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 7nm", "date": "2020", "claim_id": "C-D-099", "quote": "Fab 12: 7nm (2020 year-end", "source_title": "TSMC Form 20-F for fiscal year 2020", "source_url": "https://www.sec.gov/Archives/edgar/data/1046179/000119312521118512/d94821d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1046179/000119312521118512/d94821d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-12", "site_name": "Fab 12", "owners": "TSMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 3nm", "date": "2022", "claim_id": "C-D-100", "quote": "Fab 12: 3nm (2022 year-end", "source_title": "TSMC Form 20-F for fiscal year 2022", "source_url": "https://www.sec.gov/Archives/edgar/data/1046179/000119312523107214/d428519d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1046179/000119312523107214/d428519d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-12", "site_name": "Fab 12", "owners": "TSMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 40nm", "date": "2025", "claim_id": "C-D-101", "quote": "Fab 12: 40nm (2025 year-end, as printed)", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-14", "site_name": "Fab 14", "owners": "TSMC", "city": "Tainan", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-240", "quote": "Fab 14: commercial production from 2004, 12-inch wafers, 16 nm", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-14", "site_name": "Fab 14", "owners": "TSMC", "city": "Tainan", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 16nm", "date": "2017", "claim_id": "C-D-098", "quote": "Fab 14: 16nm (2017 year-end", "source_title": "TSMC Form 20-F for fiscal year 2017", "source_url": "https://www.sec.gov/Archives/edgar/data/1046179/000119312518121866/d459142d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1046179/000119312518121866/d459142d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-14", "site_name": "Fab 14", "owners": "TSMC", "city": "Tainan", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 16nm", "date": "2025", "claim_id": "C-D-101", "quote": "Fab 14: 16nm (2025 year-end", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-15", "site_name": "Fab 15", "owners": "TSMC", "city": "Taichung", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-240", "quote": "Fab 15: commercial production from 2012, 12-inch wafers, 7 nm", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-15", "site_name": "Fab 15", "owners": "TSMC", "city": "Taichung", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 10nm", "date": "2017", "claim_id": "C-D-098", "quote": "Fab 15: 10nm (2017 year-end", "source_title": "TSMC Form 20-F for fiscal year 2017", "source_url": "https://www.sec.gov/Archives/edgar/data/1046179/000119312518121866/d459142d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1046179/000119312518121866/d459142d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-15", "site_name": "Fab 15", "owners": "TSMC", "city": "Taichung", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 7nm", "date": "2020", "claim_id": "C-D-099", "quote": "Fab 15: 7nm (2020 year-end", "source_title": "TSMC Form 20-F for fiscal year 2020", "source_url": "https://www.sec.gov/Archives/edgar/data/1046179/000119312521118512/d94821d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1046179/000119312521118512/d94821d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-15", "site_name": "Fab 15", "owners": "TSMC", "city": "Taichung", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 7nm", "date": "2025", "claim_id": "C-D-101", "quote": "Fab 15: 7nm (2025 year-end", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-16", "site_name": "Fab 16", "owners": "TSMC", "city": "Nanjing", "country": "CN", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-240", "quote": "Fab 16: commercial production from 2018, 12-inch wafers, 16 nm", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-16", "site_name": "Fab 16", "owners": "TSMC", "city": "Nanjing", "country": "CN", "kind": "fab", "measure": "production", "value": "logic 16nm", "date": "2020", "claim_id": "C-D-099", "quote": "Fab 16: 16nm (2020 year-end", "source_title": "TSMC Form 20-F for fiscal year 2020", "source_url": "https://www.sec.gov/Archives/edgar/data/1046179/000119312521118512/d94821d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1046179/000119312521118512/d94821d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-16", "site_name": "Fab 16", "owners": "TSMC", "city": "Nanjing", "country": "CN", "kind": "fab", "measure": "production", "value": "logic 16nm", "date": "2025", "claim_id": "C-D-101", "quote": "Fab 16: 16nm (2025 year-end", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-18", "site_name": "Fab 18", "owners": "TSMC", "city": "Tainan", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-240", "quote": "Fab 18: commercial production from 2020, 12-inch wafers, 3 nm", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-18", "site_name": "Fab 18", "owners": "TSMC", "city": "Tainan", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 5nm", "date": "2020", "claim_id": "C-D-099", "quote": "Fab 18: 5nm (2020 year-end", "source_title": "TSMC Form 20-F for fiscal year 2020", "source_url": "https://www.sec.gov/Archives/edgar/data/1046179/000119312521118512/d94821d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1046179/000119312521118512/d94821d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-18", "site_name": "Fab 18", "owners": "TSMC", "city": "Tainan", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 3nm", "date": "2022", "claim_id": "C-D-100", "quote": "Fab 18: 3nm (2022 year-end", "source_title": "TSMC Form 20-F for fiscal year 2022", "source_url": "https://www.sec.gov/Archives/edgar/data/1046179/000119312523107214/d428519d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1046179/000119312523107214/d428519d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-18", "site_name": "Fab 18", "owners": "TSMC", "city": "Tainan", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 3nm", "date": "2025", "claim_id": "C-D-101", "quote": "Fab 18: 3nm (2025 year-end", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-20", "site_name": "Fab 20", "owners": "TSMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-241", "quote": "Fab 20: commercial production from 2025, 12-inch wafers, 2 nm", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-20", "site_name": "Fab 20", "owners": "TSMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 2nm", "date": "2025", "claim_id": "C-D-101", "quote": "Fab 20: 2nm (2025 year-end", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-21", "site_name": "Fab 21", "owners": "TSMC", "city": "Phoenix", "country": "US", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-241", "quote": "Fab 21: commercial production from 2024, 12-inch wafers, 5 nm", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-21", "site_name": "Fab 21", "owners": "TSMC", "city": "Phoenix", "country": "US", "kind": "fab", "measure": "production", "value": "logic 4nm", "date": "2024", "claim_id": "C-D-291", "quote": "began volume production of 4nm technology in fourth quarter of 2024", "source_title": "TSMC 2025 Annual Report", "source_url": "https://investor.tsmc.com/sites/ir/annual-report/2025/2025%20Annual%20Report_E.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/annual-report/2025/2025%20Annual%20Report_E.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-22", "site_name": "Fab 22", "owners": "TSMC", "city": "Kaohsiung", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-241", "quote": "Fab 22: commercial production from 2025, 12-inch wafers, 2 nm", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-22", "site_name": "Fab 22", "owners": "TSMC", "city": "Kaohsiung", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 2nm", "date": "2025", "claim_id": "C-D-101", "quote": "Fab 22: 2nm (2025 year-end", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-23", "site_name": "Fab 23", "owners": "TSMC", "city": "Kumamoto", "country": "JP", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-241", "quote": "Fab 23: commercial production from 2024, 12-inch wafers, 28 nm", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-23", "site_name": "Fab 23", "owners": "TSMC", "city": "Kumamoto", "country": "JP", "kind": "fab", "measure": "owner", "value": "TSMC (72.6%)", "date": "", "claim_id": "C-D-041", "quote": "approximately 72.6% of the equity interest in JASM", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-23", "site_name": "Fab 23", "owners": "TSMC", "city": "Kumamoto", "country": "JP", "kind": "fab", "measure": "production", "value": "logic", "date": "2024-late", "claim_id": "C-D-290", "quote": "started volume production at the end of 2024 (late 2024)", "source_title": "TSMC 2025 Annual Report", "source_url": "https://investor.tsmc.com/sites/ir/annual-report/2025/2025%20Annual%20Report_E.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/annual-report/2025/2025%20Annual%20Report_E.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-fab-23", "site_name": "Fab 23", "owners": "TSMC", "city": "Kumamoto", "country": "JP", "kind": "fab", "measure": "production", "value": "logic 28nm", "date": "2025", "claim_id": "C-D-101", "quote": "Fab 23 (Kumamoto): 28nm (2025 year-end", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-arizona-fab-2", "site_name": "Arizona second fab", "owners": "TSMC", "city": "Phoenix", "country": "US", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-D-172", "quote": "Construction of our second facility is ongoing", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-arizona-fab-3", "site_name": "Arizona third fab", "owners": "TSMC", "city": "Phoenix", "country": "US", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-D-172", "quote": "the construction of our third facility commenced in 2025", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-jasm-fab-2", "site_name": "Kumamoto second fab", "owners": "TSMC", "city": "Kumamoto", "country": "JP", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-D-041", "quote": "Construction on the second site commenced in October 2025", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-jasm-fab-2", "site_name": "Kumamoto second fab", "owners": "TSMC", "city": "Kumamoto", "country": "JP", "kind": "fab", "measure": "owner", "value": "TSMC (72.6%)", "date": "", "claim_id": "C-D-041", "quote": "approximately 72.6% of the equity interest in JASM", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-esmc-dresden", "site_name": "ESMC Dresden (Fab 24)", "owners": "TSMC", "city": "Dresden", "country": "DE", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-D-158", "quote": "where Fab 24 and related facilities will be located", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-esmc-dresden", "site_name": "ESMC Dresden (Fab 24)", "owners": "TSMC", "city": "Dresden", "country": "DE", "kind": "fab", "measure": "owner", "value": "TSMC (70%)", "date": "", "claim_id": "C-D-157", "quote": "70.0% of the equity interest in ESMC", "source_title": "TSMC Form 20-F for fiscal year 2025", "source_url": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf", "source_urls": "https://investor.tsmc.com/sites/ir/sec-filings/2025_20F%20Report.pdf" }, { "last_checked": "2026-10-13", "site_id": "tsmc-taichung-1-4nm", "site_name": "Taichung 1.4 nm fab", "owners": "TSMC", "city": "Taichung", "country": "TW", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-D-028", "quote": "began construction of its 1.4-nanometer fab in Taichung", "source_title": "GIGAFAB® Facilities - Taiwan Semiconductor Manufacturing Company Limited", "source_url": "https://www.tsmc.com/english/dedicatedFoundry/manufacturing/gigafab", "source_urls": "https://www.tsmc.com/english/dedicatedFoundry/manufacturing/gigafab" }, { "last_checked": "2026-10-13", "site_id": "intel-oregon-hillsboro", "site_name": "Oregon fabs (Hillsboro)", "owners": "Intel", "city": "Hillsboro", "country": "US", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-044", "quote": "Oregon (ramping Intel 18A)", "source_title": "Intel Corporation: Form 10-K for the fiscal year ended December 27, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm" }, { "last_checked": "2026-10-13", "site_id": "intel-oregon-hillsboro", "site_name": "Oregon fabs (Hillsboro)", "owners": "Intel", "city": "Hillsboro", "country": "US", "kind": "fab", "measure": "production", "value": "logic (High NA EUV)", "date": "2024-04", "claim_id": "C-D-309", "quote": "the High NA EUV tool at Fab D1X in Hillsboro, Oregon, in April 2024", "source_title": "With High NA EUV, Intel Foundry Opens New Frontier in Chipmaking", "source_url": "https://www.intel.com/content/www/us/en/newsroom/news/intel-foundry-opens-new-frontier-chipmaking.html", "source_urls": "https://www.intel.com/content/www/us/en/newsroom/news/intel-foundry-opens-new-frontier-chipmaking.html" }, { "last_checked": "2026-10-13", "site_id": "intel-oregon-hillsboro", "site_name": "Oregon fabs (Hillsboro)", "owners": "Intel", "city": "Hillsboro", "country": "US", "kind": "fab", "measure": "production", "value": "logic ramping Intel 18A", "date": "2025", "claim_id": "C-D-044", "quote": "In 2025, our key production fabs were in Oregon (ramping Intel 18A), Arizona (Intel 7 and ramping Intel 18A), Ireland (Intel 4 and Intel 3) and Israel (Intel 7)", "source_title": "Intel Corporation: Form 10-K for the fiscal year ended December 27, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm" }, { "last_checked": "2026-10-13", "site_id": "intel-arizona-ocotillo", "site_name": "Arizona fabs (Ocotillo, Chandler)", "owners": "Intel", "city": "Chandler", "country": "US", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-044", "quote": "Arizona (Intel 7 and ramping Intel 18A)", "source_title": "Intel Corporation: Form 10-K for the fiscal year ended December 27, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm" }, { "last_checked": "2026-10-13", "site_id": "intel-arizona-ocotillo", "site_name": "Arizona fabs (Ocotillo, Chandler)", "owners": "Intel", "city": "Chandler", "country": "US", "kind": "fab", "measure": "production", "value": "logic Intel 7 and ramping Intel 18A", "date": "2025", "claim_id": "C-D-044", "quote": "In 2025, our key production fabs were in Oregon (ramping Intel 18A), Arizona (Intel 7 and ramping Intel 18A), Ireland (Intel 4 and Intel 3) and Israel (Intel 7)", "source_title": "Intel Corporation: Form 10-K for the fiscal year ended December 27, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm" }, { "last_checked": "2026-10-13", "site_id": "intel-ireland-fab-34", "site_name": "Fab 34 (Leixlip)", "owners": "Intel", "city": "Leixlip", "country": "IE", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-044", "quote": "Ireland (Intel 4 and Intel 3)", "source_title": "Intel Corporation: Form 10-K for the fiscal year ended December 27, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm" }, { "last_checked": "2026-10-13", "site_id": "intel-ireland-fab-34", "site_name": "Fab 34 (Leixlip)", "owners": "Intel", "city": "Leixlip", "country": "IE", "kind": "fab", "measure": "production", "value": "logic Intel 4 (EUV)", "date": "2023-09-29", "claim_id": "C-LW-024", "quote": "On 2023-09-29 Intel announced high-volume production of its Intel 4 technology, which uses EUV", "source_title": "Intel’s New Fab in Ireland Begins High-Volume Production of Intel 4...", "source_url": "https://www.intel.com/content/www/us/en/newsroom/news/new-fab-ireland-high-volume-production-intel-4-technology.html", "source_urls": "https://www.intel.com/content/www/us/en/newsroom/news/new-fab-ireland-high-volume-production-intel-4-technology.html" }, { "last_checked": "2026-10-13", "site_id": "intel-ireland-fab-34", "site_name": "Fab 34 (Leixlip)", "owners": "Intel", "city": "Leixlip", "country": "IE", "kind": "fab", "measure": "production", "value": "logic Intel 4 and Intel 3", "date": "2025", "claim_id": "C-D-044", "quote": "In 2025, our key production fabs were in Oregon (ramping Intel 18A), Arizona (Intel 7 and ramping Intel 18A), Ireland (Intel 4 and Intel 3) and Israel (Intel 7)", "source_title": "Intel Corporation: Form 10-K for the fiscal year ended December 27, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm" }, { "last_checked": "2026-10-13", "site_id": "intel-israel", "site_name": "Israel fabs (Kiryat Gat)", "owners": "Intel", "city": "Kiryat Gat", "country": "IL", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-044", "quote": "Israel (Intel 7)", "source_title": "Intel Corporation: Form 10-K for the fiscal year ended December 27, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm" }, { "last_checked": "2026-10-13", "site_id": "intel-israel", "site_name": "Israel fabs (Kiryat Gat)", "owners": "Intel", "city": "Kiryat Gat", "country": "IL", "kind": "fab", "measure": "production", "value": "logic Intel 7", "date": "2025", "claim_id": "C-D-044", "quote": "In 2025, our key production fabs were in Oregon (ramping Intel 18A), Arizona (Intel 7 and ramping Intel 18A), Ireland (Intel 4 and Intel 3) and Israel (Intel 7)", "source_title": "Intel Corporation: Form 10-K for the fiscal year ended December 27, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm" }, { "last_checked": "2026-10-13", "site_id": "intel-new-mexico-packaging", "site_name": "New Mexico advanced packaging (Rio Rancho)", "owners": "Intel", "city": "Rio Rancho", "country": "US", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-044", "quote": "with New Mexico being our key advanced packaging facility", "source_title": "Intel Corporation: Form 10-K for the fiscal year ended December 27, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm" }, { "last_checked": "2026-10-13", "site_id": "intel-ohio", "site_name": "Ohio fabs (New Albany)", "owners": "Intel", "city": "New Albany", "country": "US", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-D-045", "quote": "In 2025 we slowed the pace of construction for our new Ohio fab", "source_title": "Intel Corporation: Form 10-K for the fiscal year ended December 27, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm" }, { "last_checked": "2026-10-13", "site_id": "intel-germany-magdeburg", "site_name": "Germany fab (Magdeburg)", "owners": "Intel", "city": "Magdeburg", "country": "DE", "kind": "fab", "measure": "status", "value": "cancelled", "date": "", "claim_id": "C-D-045", "quote": "In 2025 we discontinued planned expansions in Germany (fab)", "source_title": "Intel Corporation: Form 10-K for the fiscal year ended December 27, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm" }, { "last_checked": "2026-10-13", "site_id": "intel-poland-assembly", "site_name": "Poland assembly and test (Wroclaw)", "owners": "Intel", "city": "Wroclaw", "country": "PL", "kind": "assembly", "measure": "status", "value": "cancelled", "date": "", "claim_id": "C-D-045", "quote": "In 2025 we discontinued planned expansions in Germany (fab) and Poland (assembly and test)", "source_title": "Intel Corporation: Form 10-K for the fiscal year ended December 27, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm" }, { "last_checked": "2026-10-13", "site_id": "gf-malta-fab-8", "site_name": "Malta (Fab 8)", "owners": "GlobalFoundries", "city": "Malta", "country": "US", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-049", "quote": "We currently operate four manufacturing sites in the following locations: Dresden, Germany; Singapore; Malta, New York; and Burlington, Vermont", "source_title": "GlobalFoundries: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1709048/000170904826000022/gfs-20251231.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1709048/000170904826000022/gfs-20251231.htm" }, { "last_checked": "2026-10-13", "site_id": "gf-burlington", "site_name": "Burlington (Essex Junction)", "owners": "GlobalFoundries", "city": "Burlington", "country": "US", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-049", "quote": "We currently operate four manufacturing sites in the following locations: Dresden, Germany; Singapore; Malta, New York; and Burlington, Vermont", "source_title": "GlobalFoundries: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1709048/000170904826000022/gfs-20251231.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1709048/000170904826000022/gfs-20251231.htm" }, { "last_checked": "2026-10-15", "site_id": "gf-dresden", "site_name": "Dresden", "owners": "GlobalFoundries", "city": "Dresden", "country": "DE", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-049", "quote": "We currently operate four manufacturing sites in the following locations: Dresden, Germany; Singapore; Malta, New York; and Burlington, Vermont", "source_title": "GlobalFoundries: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1709048/000170904826000022/gfs-20251231.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1709048/000170904826000022/gfs-20251231.htm" }, { "last_checked": "2026-10-15", "site_id": "gf-dresden", "site_name": "Dresden", "owners": "GlobalFoundries", "city": "Dresden", "country": "DE", "kind": "fab", "measure": "expected_full-ramp", "value": "2028", "date": "2028", "claim_id": "C-D-167", "quote": "more than one million 300mm wafers by the end of 2028", "source_title": "GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI", "source_url": "https://gf.com/gf-press-release/globalfoundries-marks-dresden-expansion-milestone-announces-next-generation-platform-for-physical-ai/", "source_urls": "https://gf.com/gf-press-release/globalfoundries-marks-dresden-expansion-milestone-announces-next-generation-platform-for-physical-ai/" }, { "last_checked": "2026-10-15", "site_id": "gf-singapore", "site_name": "Singapore", "owners": "GlobalFoundries", "city": "Singapore", "country": "SG", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-049", "quote": "We currently operate four manufacturing sites in the following locations: Dresden, Germany; Singapore; Malta, New York; and Burlington, Vermont", "source_title": "GlobalFoundries: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1709048/000170904826000022/gfs-20251231.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1709048/000170904826000022/gfs-20251231.htm" }, { "last_checked": "2026-10-13", "site_id": "samsung-taylor", "site_name": "Taylor", "owners": "Samsung Electronics", "city": "Taylor", "country": "US", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-D-051", "quote": "All CHIPS and Science Act facilities will be operational in 2030", "source_title": "Taylor | US Fab", "source_url": "https://semiconductor.samsung.com/sas/company/taylor", "source_urls": "https://semiconductor.samsung.com/sas/company/taylor" }, { "last_checked": "2026-10-13", "site_id": "samsung-taylor", "site_name": "Taylor", "owners": "Samsung Electronics", "city": "Taylor", "country": "US", "kind": "fab", "measure": "products", "value": "logic", "date": "", "claim_id": "C-D-298", "quote": "two leading-edge logic foundry fabs focused on mass production of 2nm process technologies", "source_title": "Samsung Electronics (Texas)", "source_url": "https://www.nist.gov/chips/samsung-electronics-texas-taylor", "source_urls": "https://www.nist.gov/chips/samsung-electronics-texas-taylor" }, { "last_checked": "2026-10-13", "site_id": "samsung-taylor", "site_name": "Taylor", "owners": "Samsung Electronics", "city": "Taylor", "country": "US", "kind": "fab", "measure": "expected_full-ramp", "value": "2030", "date": "2030", "claim_id": "C-D-051", "quote": "All CHIPS and Science Act facilities will be operational in 2030", "source_title": "Taylor | US Fab", "source_url": "https://semiconductor.samsung.com/sas/company/taylor", "source_urls": "https://semiconductor.samsung.com/sas/company/taylor" }, { "last_checked": "2026-10-13", "site_id": "samsung-austin", "site_name": "Austin", "owners": "Samsung Electronics", "city": "Austin", "country": "US", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-267", "quote": "the Austin fab has operated since 1996", "source_title": "Manufacturing sites | Manufacturing", "source_url": "https://semiconductor.samsung.com/foundry/manufacturing/manufacturing-sites/", "source_urls": "https://semiconductor.samsung.com/foundry/manufacturing/manufacturing-sites/" }, { "last_checked": "2026-10-15", "site_id": "smic-shanghai", "site_name": "Shanghai", "owners": "SMIC", "city": "Shanghai", "country": "CN", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-053", "quote": "The major subsidiaries of the Company are SMIC Shanghai, SMIC Beijing, SMIC Tianjin, SMNC, SMIC Shenzhen", "source_title": "SMIC 2025 Annual Report", "source_url": "https://www.hkexnews.hk/listedco/listconews/sehk/2026/0408/2026040801181.pdf", "source_urls": "https://www.hkexnews.hk/listedco/listconews/sehk/2026/0408/2026040801181.pdf" }, { "last_checked": "2026-10-15", "site_id": "smic-shanghai", "site_name": "Shanghai", "owners": "SMIC", "city": "Shanghai", "country": "CN", "kind": "plant", "measure": "production", "value": "logic", "date": "2016-10-13", "claim_id": "C-D-174", "quote": "SMIC release (October 13, 2016)", "source_title": "SMIC Shanghai Starts Construction of a New 12-Inch Wafer Fab", "source_url": "https://www.smics.com/en/site/news_read/4554", "source_urls": "https://www.smics.com/en/site/news_read/4554" }, { "last_checked": "2026-10-15", "site_id": "smic-beijing", "site_name": "Beijing", "owners": "SMIC", "city": "Beijing", "country": "CN", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-053", "quote": "The major subsidiaries of the Company are SMIC Shanghai, SMIC Beijing, SMIC Tianjin, SMNC, SMIC Shenzhen", "source_title": "SMIC 2025 Annual Report", "source_url": "https://www.hkexnews.hk/listedco/listconews/sehk/2026/0408/2026040801181.pdf", "source_urls": "https://www.hkexnews.hk/listedco/listconews/sehk/2026/0408/2026040801181.pdf" }, { "last_checked": "2026-10-15", "site_id": "smic-beijing", "site_name": "Beijing", "owners": "SMIC", "city": "Beijing", "country": "CN", "kind": "plant", "measure": "production", "value": "DRAM 0.11 micron", "date": "2004-07-23", "claim_id": "C-D-187", "quote": "Fab 4 commenced pilot production on July 23, 2004, starting with standard DRAM on 0.11 micron", "source_title": "The First 12-inch Wafer Fab in China Mainland Starts Production Successfully", "source_url": "https://www.smics.com/en/site/news_read/4194", "source_urls": "https://www.smics.com/en/site/news_read/4194" }, { "last_checked": "2026-10-15", "site_id": "smic-beijing", "site_name": "Beijing", "owners": "SMIC", "city": "Beijing", "country": "CN", "kind": "plant", "measure": "production", "value": "logic", "date": "2016-10-13", "claim_id": "C-D-174", "quote": "SMIC release (October 13, 2016)", "source_title": "SMIC Shanghai Starts Construction of a New 12-Inch Wafer Fab", "source_url": "https://www.smics.com/en/site/news_read/4554", "source_urls": "https://www.smics.com/en/site/news_read/4554" }, { "last_checked": "2026-10-15", "site_id": "smic-tianjin", "site_name": "Tianjin", "owners": "SMIC", "city": "Tianjin", "country": "CN", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-053", "quote": "The major subsidiaries of the Company are SMIC Shanghai, SMIC Beijing, SMIC Tianjin, SMNC, SMIC Shenzhen", "source_title": "SMIC 2025 Annual Report", "source_url": "https://www.hkexnews.hk/listedco/listconews/sehk/2026/0408/2026040801181.pdf", "source_urls": "https://www.hkexnews.hk/listedco/listconews/sehk/2026/0408/2026040801181.pdf" }, { "last_checked": "2026-10-15", "site_id": "smic-tianjin", "site_name": "Tianjin", "owners": "SMIC", "city": "Tianjin", "country": "CN", "kind": "plant", "measure": "production", "value": "logic", "date": "2016-10-13", "claim_id": "C-D-174", "quote": "SMIC release (October 13, 2016)", "source_title": "SMIC Shanghai Starts Construction of a New 12-Inch Wafer Fab", "source_url": "https://www.smics.com/en/site/news_read/4554", "source_urls": "https://www.smics.com/en/site/news_read/4554" }, { "last_checked": "2026-10-15", "site_id": "smic-shenzhen", "site_name": "Shenzhen", "owners": "SMIC", "city": "Shenzhen", "country": "CN", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-053", "quote": "The major subsidiaries of the Company are SMIC Shanghai, SMIC Beijing, SMIC Tianjin, SMNC, SMIC Shenzhen", "source_title": "SMIC 2025 Annual Report", "source_url": "https://www.hkexnews.hk/listedco/listconews/sehk/2026/0408/2026040801181.pdf", "source_urls": "https://www.hkexnews.hk/listedco/listconews/sehk/2026/0408/2026040801181.pdf" }, { "last_checked": "2026-10-15", "site_id": "smic-shenzhen", "site_name": "Shenzhen", "owners": "SMIC", "city": "Shenzhen", "country": "CN", "kind": "plant", "measure": "production", "value": "logic", "date": "2016-10-13", "claim_id": "C-D-174", "quote": "SMIC release (October 13, 2016)", "source_title": "SMIC Shanghai Starts Construction of a New 12-Inch Wafer Fab", "source_url": "https://www.smics.com/en/site/news_read/4554", "source_urls": "https://www.smics.com/en/site/news_read/4554" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8a", "site_name": "Fab 8A", "owners": "UMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-055", "quote": "Fab 8A: 8-inch wafer production", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8a", "site_name": "Fab 8A", "owners": "UMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "production", "value": "logic", "date": "1995", "claim_id": "C-D-314", "quote": "Fab 8A: volume production since 1995", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8a", "site_name": "Fab 8A", "owners": "UMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 0.11 micron", "date": "2025", "claim_id": "C-D-314", "quote": "Fab 8A, 2025 year-end: 0.11 micron finest", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8c-8d", "site_name": "Fab 8C and 8D", "owners": "UMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-055", "quote": "Fab 8C and Fab 8D: 8-inch wafer production", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8c-8d", "site_name": "Fab 8C and 8D", "owners": "UMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "production", "value": "logic", "date": "1998", "claim_id": "C-D-314", "quote": "Fab 8C: volume production since 1998", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8c-8d", "site_name": "Fab 8C and 8D", "owners": "UMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "production", "value": "logic", "date": "2000", "claim_id": "C-D-314", "quote": "Fab 8D: volume production since 2000", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8c-8d", "site_name": "Fab 8C and 8D", "owners": "UMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 0.11 micron", "date": "2025", "claim_id": "C-D-314", "quote": "Fab 8C and Fab 8D, 2025 year-end: 0.11 micron finest", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8e", "site_name": "Fab 8E", "owners": "UMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-055", "quote": "Fab 8E: 8-inch wafer production", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8e", "site_name": "Fab 8E", "owners": "UMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "production", "value": "logic", "date": "1998", "claim_id": "C-D-314", "quote": "Fab 8E: volume production since 1998", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8e", "site_name": "Fab 8E", "owners": "UMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 0.11 micron", "date": "2025", "claim_id": "C-D-314", "quote": "Fab 8E, 2025 year-end: 0.11 micron finest", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8f", "site_name": "Fab 8F", "owners": "UMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-055", "quote": "Fab 8F: 8-inch wafer production", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8f", "site_name": "Fab 8F", "owners": "UMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "production", "value": "logic", "date": "2000", "claim_id": "C-D-315", "quote": "Fab 8F: volume production since 2000", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8f", "site_name": "Fab 8F", "owners": "UMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 0.11 micron", "date": "2025", "claim_id": "C-D-315", "quote": "Fab 8F, 2025 year-end: 0.11 micron finest", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8s", "site_name": "Fab 8S", "owners": "UMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-055", "quote": "Fab 8S: 8-inch wafer production", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8s", "site_name": "Fab 8S", "owners": "UMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "production", "value": "logic", "date": "2000", "claim_id": "C-D-315", "quote": "Fab 8S: volume production since 2000", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8s", "site_name": "Fab 8S", "owners": "UMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 0.11 micron", "date": "2025", "claim_id": "C-D-315", "quote": "Fab 8S, 2025 year-end: 0.11 micron finest", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8n", "site_name": "Fab 8N", "owners": "UMC", "city": "Suzhou", "country": "CN", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-055", "quote": "Fab 8N: 8-inch wafer production, Suzhou", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8n", "site_name": "Fab 8N", "owners": "UMC", "city": "Suzhou", "country": "CN", "kind": "fab", "measure": "production", "value": "logic", "date": "2003", "claim_id": "C-D-315", "quote": "Fab 8N (Suzhou): volume production since 2003", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-8n", "site_name": "Fab 8N", "owners": "UMC", "city": "Suzhou", "country": "CN", "kind": "fab", "measure": "production", "value": "logic 0.11 micron", "date": "2025", "claim_id": "C-D-315", "quote": "Fab 8N, 2025 year-end: 0.11 micron finest", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-12a", "site_name": "Fab 12A", "owners": "UMC", "city": "Tainan", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-055", "quote": "Fab 12A: 12-inch wafer production, Southern Taiwan Science Park", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-12a", "site_name": "Fab 12A", "owners": "UMC", "city": "Tainan", "country": "TW", "kind": "fab", "measure": "production", "value": "logic", "date": "2002", "claim_id": "C-D-316", "quote": "Fab 12A (Tainan): volume production since 2002", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-12a", "site_name": "Fab 12A", "owners": "UMC", "city": "Tainan", "country": "TW", "kind": "fab", "measure": "production", "value": "logic 0.014 micron", "date": "2025", "claim_id": "C-D-316", "quote": "Fab 12A, 2025 year-end: 0.014 micron finest", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-12i", "site_name": "Fab 12i", "owners": "UMC", "city": "Singapore", "country": "SG", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-055", "quote": "Fab 12i: 12-inch wafer production, Pasir Ris, Singapore", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-12i", "site_name": "Fab 12i", "owners": "UMC", "city": "Singapore", "country": "SG", "kind": "fab", "measure": "production", "value": "logic", "date": "2004", "claim_id": "C-D-316", "quote": "Fab 12i (Singapore): volume production since 2004", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-12i", "site_name": "Fab 12i", "owners": "UMC", "city": "Singapore", "country": "SG", "kind": "fab", "measure": "production", "value": "logic 0.040 micron", "date": "2025", "claim_id": "C-D-316", "quote": "Fab 12i, 2025 year-end: 0.040 micron finest", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-12x", "site_name": "Fab 12X (USCXM)", "owners": "UMC", "city": "Xiamen", "country": "CN", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-055", "quote": "Fab 12X: 12-inch wafer production, Xiamen", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-12x", "site_name": "Fab 12X (USCXM)", "owners": "UMC", "city": "Xiamen", "country": "CN", "kind": "fab", "measure": "production", "value": "logic", "date": "2016", "claim_id": "C-D-316", "quote": "Fab 12X (Xiamen): volume production since 2016", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-12x", "site_name": "Fab 12X (USCXM)", "owners": "UMC", "city": "Xiamen", "country": "CN", "kind": "fab", "measure": "production", "value": "logic 0.022 micron", "date": "2025", "claim_id": "C-D-316", "quote": "Fab 12X, 2025 year-end: 0.022 micron finest", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-12m", "site_name": "Fab 12M", "owners": "UMC", "city": "Kuwana", "country": "JP", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-055", "quote": "The fab in Japan is named Fab 12M located in Mie", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-12m", "site_name": "Fab 12M", "owners": "UMC", "city": "Kuwana", "country": "JP", "kind": "fab", "measure": "production", "value": "logic", "date": "2005", "claim_id": "C-D-316", "quote": "Fab 12M (Mie): volume production since 2005", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-12m", "site_name": "Fab 12M", "owners": "UMC", "city": "Kuwana", "country": "JP", "kind": "fab", "measure": "production", "value": "logic 0.040 micron", "date": "2025", "claim_id": "C-D-316", "quote": "Fab 12M, 2025 year-end: 0.040 micron finest", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-12i-p3", "site_name": "Fab 12i P3", "owners": "UMC", "city": "Singapore", "country": "SG", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-D-056", "quote": "The new fab (Fab 12i P3) will utilize 28nm and 22nm process technologies", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "umc-fab-12i-p3", "site_name": "Fab 12i P3", "owners": "UMC", "city": "Singapore", "country": "SG", "kind": "fab", "measure": "expected_first-output", "value": "2026-H2", "date": "2026-H2", "claim_id": "C-D-056", "quote": "production expected to commence in the second half of 2026", "source_title": "United Microelectronics Corporation: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "tower-migdal-haemek-150", "site_name": "Migdal Haemek 150mm fab", "owners": "Tower Semiconductor", "city": "Migdal Haemek", "country": "IL", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-179", "quote": "Migdal Haemek, Israel: 6-inch (150mm) fab", "source_title": "Tower Semiconductor: manufacturing overview", "source_url": "https://www.towersemi.com/manufacturing/manufacturing-overview", "source_urls": "https://www.towersemi.com/manufacturing/manufacturing-overview" }, { "last_checked": "2026-10-13", "site_id": "tower-migdal-haemek-150", "site_name": "Migdal Haemek 150mm fab", "owners": "Tower Semiconductor", "city": "Migdal Haemek", "country": "IL", "kind": "fab", "measure": "production", "value": "specialty 0.35 micron", "date": "2026", "claim_id": "C-D-320", "quote": "Migdal Haemek 150mm fab, as listed in 2026: 0.35 micron finest", "source_title": "Tower Semiconductor: manufacturing overview", "source_url": "https://www.towersemi.com/manufacturing/manufacturing-overview", "source_urls": "https://www.towersemi.com/manufacturing/manufacturing-overview" }, { "last_checked": "2026-10-13", "site_id": "tower-migdal-haemek-200", "site_name": "Migdal Haemek 200mm fab", "owners": "Tower Semiconductor", "city": "Migdal Haemek", "country": "IL", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-179", "quote": "Migdal Haemek, Israel: 8-inch (200mm) fab", "source_title": "Tower Semiconductor: manufacturing overview", "source_url": "https://www.towersemi.com/manufacturing/manufacturing-overview", "source_urls": "https://www.towersemi.com/manufacturing/manufacturing-overview" }, { "last_checked": "2026-10-13", "site_id": "tower-migdal-haemek-200", "site_name": "Migdal Haemek 200mm fab", "owners": "Tower Semiconductor", "city": "Migdal Haemek", "country": "IL", "kind": "fab", "measure": "production", "value": "specialty 0.13 micron", "date": "2026", "claim_id": "C-D-320", "quote": "Migdal Haemek 200mm fab, as listed in 2026: 0.13 micron finest", "source_title": "Tower Semiconductor: manufacturing overview", "source_url": "https://www.towersemi.com/manufacturing/manufacturing-overview", "source_urls": "https://www.towersemi.com/manufacturing/manufacturing-overview" }, { "last_checked": "2026-10-13", "site_id": "tower-agrate", "site_name": "Agrate", "owners": "Tower Semiconductor", "city": "Agrate Brianza", "country": "IT", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-179", "quote": "Agrate, Italy: 12-inch (300mm)", "source_title": "Tower Semiconductor: manufacturing overview", "source_url": "https://www.towersemi.com/manufacturing/manufacturing-overview", "source_urls": "https://www.towersemi.com/manufacturing/manufacturing-overview" }, { "last_checked": "2026-10-13", "site_id": "tower-agrate", "site_name": "Agrate", "owners": "Tower Semiconductor", "city": "Agrate Brianza", "country": "IT", "kind": "fab", "measure": "production", "value": "specialty 65nm", "date": "2026", "claim_id": "C-D-320", "quote": "Agrate 300mm fab, as listed in 2026: 65nm", "source_title": "Tower Semiconductor: manufacturing overview", "source_url": "https://www.towersemi.com/manufacturing/manufacturing-overview", "source_urls": "https://www.towersemi.com/manufacturing/manufacturing-overview" }, { "last_checked": "2026-10-13", "site_id": "tower-newport-beach", "site_name": "Newport Beach", "owners": "Tower Semiconductor", "city": "Newport Beach", "country": "US", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-176", "quote": "Newport Beach, CA, USA: 8 inch (200mm)", "source_title": "Tower Semiconductor: manufacturing overview", "source_url": "https://www.towersemi.com/manufacturing/manufacturing-overview", "source_urls": "https://www.towersemi.com/manufacturing/manufacturing-overview" }, { "last_checked": "2026-10-13", "site_id": "tower-newport-beach", "site_name": "Newport Beach", "owners": "Tower Semiconductor", "city": "Newport Beach", "country": "US", "kind": "fab", "measure": "production", "value": "specialty 0.13 micron", "date": "2026", "claim_id": "C-D-318", "quote": "Newport Beach 200mm fab, as listed in 2026: 0.13 micron finest", "source_title": "Tower Semiconductor: manufacturing overview", "source_url": "https://www.towersemi.com/manufacturing/manufacturing-overview", "source_urls": "https://www.towersemi.com/manufacturing/manufacturing-overview" }, { "last_checked": "2026-10-13", "site_id": "tower-san-antonio", "site_name": "San Antonio", "owners": "Tower Semiconductor", "city": "San Antonio", "country": "US", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-176", "quote": "San Antonio, TX, USA: 8-inch (200mm)", "source_title": "Tower Semiconductor: manufacturing overview", "source_url": "https://www.towersemi.com/manufacturing/manufacturing-overview", "source_urls": "https://www.towersemi.com/manufacturing/manufacturing-overview" }, { "last_checked": "2026-10-13", "site_id": "tower-san-antonio", "site_name": "San Antonio", "owners": "Tower Semiconductor", "city": "San Antonio", "country": "US", "kind": "fab", "measure": "production", "value": "specialty 0.18 micron", "date": "2026", "claim_id": "C-D-318", "quote": "San Antonio 200mm fab, as listed in 2026: 0.18 micron", "source_title": "Tower Semiconductor: manufacturing overview", "source_url": "https://www.towersemi.com/manufacturing/manufacturing-overview", "source_urls": "https://www.towersemi.com/manufacturing/manufacturing-overview" }, { "last_checked": "2026-10-13", "site_id": "tpsco-tonami", "site_name": "TPSCo Tonami", "owners": "Tower Semiconductor", "city": "Tonami", "country": "JP", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-178", "quote": "Tonami, Japan: 8-inch (200mm)", "source_title": "Tower Semiconductor: manufacturing overview", "source_url": "https://www.towersemi.com/manufacturing/manufacturing-overview", "source_urls": "https://www.towersemi.com/manufacturing/manufacturing-overview" }, { "last_checked": "2026-10-13", "site_id": "tpsco-tonami", "site_name": "TPSCo Tonami", "owners": "Tower Semiconductor", "city": "Tonami", "country": "JP", "kind": "fab", "measure": "owner", "value": "Tower Semiconductor (51%)", "date": "", "claim_id": "C-D-177", "quote": "The company is 51% owned by Tower Semiconductor", "source_title": "Tower Semiconductor: manufacturing overview", "source_url": "https://www.towersemi.com/manufacturing/manufacturing-overview", "source_urls": "https://www.towersemi.com/manufacturing/manufacturing-overview" }, { "last_checked": "2026-10-13", "site_id": "tpsco-tonami", "site_name": "TPSCo Tonami", "owners": "Tower Semiconductor", "city": "Tonami", "country": "JP", "kind": "fab", "measure": "production", "value": "specialty 0.18 micron", "date": "2026", "claim_id": "C-D-319", "quote": "TPSCo Tonami 200mm fab, as listed in 2026: 0.18 micron", "source_title": "Tower Semiconductor: manufacturing overview", "source_url": "https://www.towersemi.com/manufacturing/manufacturing-overview", "source_urls": "https://www.towersemi.com/manufacturing/manufacturing-overview" }, { "last_checked": "2026-10-13", "site_id": "tpsco-uozu", "site_name": "TPSCo Uozu", "owners": "Tower Semiconductor", "city": "Uozu", "country": "JP", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-178", "quote": "Uozu, Japan: 12-inch (300mm)", "source_title": "Tower Semiconductor: manufacturing overview", "source_url": "https://www.towersemi.com/manufacturing/manufacturing-overview", "source_urls": "https://www.towersemi.com/manufacturing/manufacturing-overview" }, { "last_checked": "2026-10-13", "site_id": "tpsco-uozu", "site_name": "TPSCo Uozu", "owners": "Tower Semiconductor", "city": "Uozu", "country": "JP", "kind": "fab", "measure": "owner", "value": "Tower Semiconductor (51%)", "date": "", "claim_id": "C-D-177", "quote": "The company is 51% owned by Tower Semiconductor", "source_title": "Tower Semiconductor: manufacturing overview", "source_url": "https://www.towersemi.com/manufacturing/manufacturing-overview", "source_urls": "https://www.towersemi.com/manufacturing/manufacturing-overview" }, { "last_checked": "2026-10-13", "site_id": "tpsco-uozu", "site_name": "TPSCo Uozu", "owners": "Tower Semiconductor", "city": "Uozu", "country": "JP", "kind": "fab", "measure": "production", "value": "specialty 45nm", "date": "2026", "claim_id": "C-D-319", "quote": "TPSCo Uozu 300mm fab, as listed in 2026: 45nm finest", "source_title": "Tower Semiconductor: manufacturing overview", "source_url": "https://www.towersemi.com/manufacturing/manufacturing-overview", "source_urls": "https://www.towersemi.com/manufacturing/manufacturing-overview" }, { "last_checked": "2026-10-13", "site_id": "rapidus-iim-1", "site_name": "IIM-1 (Chitose)", "owners": "Rapidus", "city": "Chitose", "country": "JP", "kind": "fab", "measure": "status", "value": "tool-in", "date": "", "claim_id": "C-D-164", "quote": "The pilot line has been in operation since April 2025 at IIM", "source_title": "Rapidus Corporation", "source_url": "https://www.rapidus.inc/en", "source_urls": "https://www.rapidus.inc/en" }, { "last_checked": "2026-10-13", "site_id": "rapidus-iim-1", "site_name": "IIM-1 (Chitose)", "owners": "Rapidus", "city": "Chitose", "country": "JP", "kind": "fab", "measure": "products", "value": "logic", "date": "", "claim_id": "C-D-163", "quote": "first successful operation of 2nm GAA transistors", "source_title": "Rapidus Corporation", "source_url": "https://www.rapidus.inc/en", "source_urls": "https://www.rapidus.inc/en" }, { "last_checked": "2026-10-13", "site_id": "rapidus-iim-1", "site_name": "IIM-1 (Chitose)", "owners": "Rapidus", "city": "Chitose", "country": "JP", "kind": "fab", "measure": "expected_first-output", "value": "2027", "date": "2027", "claim_id": "C-D-164", "quote": "Mass production is scheduled to begin in 2027", "source_title": "Rapidus Corporation", "source_url": "https://www.rapidus.inc/en", "source_urls": "https://www.rapidus.inc/en" }, { "last_checked": "2026-10-13", "site_id": "psmc-p1-p2", "site_name": "P1/P2", "owners": "PSMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-281", "quote": "P1/2 fab, No. 12, Li-Hsin Rd. 1, Hsinchu Science Park", "source_title": "PSMC contact information (Japan)", "source_url": "https://www.powerchip.com/ja-jp/contact/psmc-contact-us", "source_urls": "https://www.powerchip.com/ja-jp/contact/psmc-contact-us" }, { "last_checked": "2026-10-13", "site_id": "psmc-p3", "site_name": "P3", "owners": "PSMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-281", "quote": "P3 fab, No. 16-1, Li-Hsin Rd, Hsinchu Science Park", "source_title": "PSMC contact information (Japan)", "source_url": "https://www.powerchip.com/ja-jp/contact/psmc-contact-us", "source_urls": "https://www.powerchip.com/ja-jp/contact/psmc-contact-us" }, { "last_checked": "2026-10-13", "site_id": "psmc-8a", "site_name": "Fab 8A", "owners": "PSMC", "city": "Hsinchu", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-279", "quote": "8A fab, No. 18, Li-Hsin Rd. 1, Hsinchu Science Park", "source_title": "PSMC contact information (Japan)", "source_url": "https://www.powerchip.com/ja-jp/contact/psmc-contact-us", "source_urls": "https://www.powerchip.com/ja-jp/contact/psmc-contact-us" }, { "last_checked": "2026-10-13", "site_id": "psmc-8b", "site_name": "Fab 8B", "owners": "PSMC", "city": "Jhunan", "country": "TW", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-280", "quote": "8B fab, No. 6, Kebei 2nd Rd., Jhunan Science Park, Miaoli", "source_title": "PSMC contact information (Japan)", "source_url": "https://www.powerchip.com/ja-jp/contact/psmc-contact-us", "source_urls": "https://www.powerchip.com/ja-jp/contact/psmc-contact-us" }, { "last_checked": "2026-10-13", "site_id": "amkor-arizona", "site_name": "Arizona Facility (Peoria)", "owners": "Amkor Technology", "city": "Peoria", "country": "US", "kind": "packaging", "measure": "status", "value": "building", "date": "", "claim_id": "C-D-064", "quote": "During 2025, we began construction of the first phase of the Arizona Facility", "source_title": "Amkor Technology Form 10-K for fiscal year 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1047127/000119312526140294/d94485dars.pdf", "source_urls": "https://www.sec.gov/Archives/edgar/data/1047127/000119312526140294/d94485dars.pdf" }, { "last_checked": "2026-10-13", "site_id": "amkor-arizona", "site_name": "Arizona Facility (Peoria)", "owners": "Amkor Technology", "city": "Peoria", "country": "US", "kind": "packaging", "measure": "expected_first-output", "value": "2028-H1", "date": "2028-H1", "claim_id": "C-D-064", "quote": "Manufacturing is expected to begin in the first half of 2028", "source_title": "Amkor Technology Form 10-K for fiscal year 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1047127/000119312526140294/d94485dars.pdf", "source_urls": "https://www.sec.gov/Archives/edgar/data/1047127/000119312526140294/d94485dars.pdf" }, { "last_checked": "2026-10-13", "site_id": "amkor-vietnam-bac-ninh", "site_name": "Vietnam Facility (Bac Ninh)", "owners": "Amkor Technology", "city": "Bac Ninh", "country": "VN", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-065", "quote": "We began delivering advanced packages from the Vietnam Facility in the third quarter of 2024", "source_title": "Amkor Technology Form 10-K for fiscal year 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1047127/000119312526140294/d94485dars.pdf", "source_urls": "https://www.sec.gov/Archives/edgar/data/1047127/000119312526140294/d94485dars.pdf" }, { "last_checked": "2026-10-13", "site_id": "ase-kaohsiung", "site_name": "ASE Inc. Kaohsiung", "owners": "ASE Technology Holding", "city": "Kaohsiung", "country": "TW", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-067", "quote": "ASE Inc., Kaohsiung, R.O.C.: our primary packaging facility", "source_title": "ASE Technology Holding Co., Ltd.: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "ase-chung-li", "site_name": "ASE Chung Li", "owners": "ASE Technology Holding", "city": "Zhongli", "country": "TW", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-067", "quote": "ASE Chung Li, R.O.C.: integrated packaging and testing facility", "source_title": "ASE Technology Holding Co., Ltd.: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "ase-test-taiwan", "site_name": "ASE Test Taiwan", "owners": "ASE Technology Holding", "city": "Kaohsiung", "country": "TW", "kind": "test", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-067", "quote": "ASE Test Taiwan, Kaohsiung, R.O.C.: our primary testing facilities", "source_title": "ASE Technology Holding Co., Ltd.: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "ase-malaysia-penang", "site_name": "ASE Malaysia", "owners": "ASE Technology Holding", "city": "Penang", "country": "MY", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-067", "quote": "ASE Malaysia, Penang, Malaysia: integrated packaging and testing facility", "source_title": "ASE Technology Holding Co., Ltd.: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "ase-korea-paju", "site_name": "ASE Korea", "owners": "ASE Technology Holding", "city": "Paju", "country": "KR", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-067", "quote": "ASE Korea, Paju, South Korea: integrated packaging and testing facility", "source_title": "ASE Technology Holding Co., Ltd.: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "ase-singapore", "site_name": "ASE Singapore", "owners": "ASE Technology Holding", "city": "Singapore", "country": "SG", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-067", "quote": "ASE Singapore Pte. Ltd., Singapore: integrated packaging and testing facility", "source_title": "ASE Technology Holding Co., Ltd.: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "ase-japan-takahata", "site_name": "ASE Japan", "owners": "ASE Technology Holding", "city": "Takahata", "country": "JP", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-067", "quote": "ASE Japan, Takahata, Japan: integrated semiconductor packaging and testing facility", "source_title": "ASE Technology Holding Co., Ltd.: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "ase-wuxi-tongzhi", "site_name": "Wuxi Tongzhi", "owners": "ASE Technology Holding", "city": "Wuxi", "country": "CN", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-067", "quote": "Wuxi Tongzhi, Wuxi, P.R.C.: integrated semiconductor packaging and testing facility", "source_title": "ASE Technology Holding Co., Ltd.: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "spil-taichung", "site_name": "SPIL Taiwan", "owners": "ASE Technology Holding", "city": "Taichung", "country": "TW", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-067", "quote": "Siliconware Precision Industries Co., Ltd., Taichung, Changhua, Yunlin and Hsinchu, R.O.C.: packaging and testing facility", "source_title": "ASE Technology Holding Co., Ltd.: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "spil-suzhou", "site_name": "SPIL Suzhou", "owners": "ASE Technology Holding", "city": "Suzhou", "country": "CN", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-067", "quote": "SPILSZ, Suzhou, P.R.C.: packaging and testing facility", "source_title": "ASE Technology Holding Co., Ltd.: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "ase-che-cheonan", "site_name": "CHE Cheonan", "owners": "ASE Technology Holding", "city": "Cheonan", "country": "KR", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-067", "quote": "CHE, Cheonan, South Korea: integrated semiconductor packaging and testing facility", "source_title": "ASE Technology Holding Co., Ltd.: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm" }, { "last_checked": "2026-10-13", "site_id": "ase-philippines-cavite", "site_name": "ASE Philippines", "owners": "ASE Technology Holding", "city": "Cavite", "country": "PH", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-067", "quote": "ASE Co., Ltd. Philippines Branch, Cavite, the Philippines: integrated semiconductor packaging and testing facility", "source_title": "ASE Technology Holding Co., Ltd.: Form 20-F for the fiscal year ended December 31, 2025", "source_url": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm", "source_urls": "https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm" }, { "last_checked": "2026-10-15", "site_id": "jcet-lingang-automotive", "site_name": "Lingang automotive packaging base", "owners": "JCET", "city": "Shanghai", "country": "CN", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-118", "quote": "following the official production launch at JCET Shanghai Automotive Co., Ltd.", "source_title": "JCET Reports 42.7% YoY Surge in Q1 2026 Net Profit Attributable to Shareholders", "source_url": "https://kyodonewsprwire.jp/release/202604288290", "source_urls": "https://kyodonewsprwire.jp/release/202604288290" }, { "last_checked": "2026-10-13", "site_id": "jcet-shanghai-new-facility", "site_name": "Shanghai new advanced packaging and testing facility", "owners": "JCET", "city": "Shanghai", "country": "CN", "kind": "packaging", "measure": "status", "value": "announced", "date": "", "claim_id": "C-D-068", "quote": "a new advanced packaging and testing manufacturing facility in Shanghai", "source_title": "JCET press release: JCET Reports 79.4% YoY Growth in H1 2026 Net Profit Attributable to Shareholders, Accelerates Advanced Packaging Expansion", "source_url": "https://jcetglobal.com/en/site/news-detail?id=2068", "source_urls": "https://jcetglobal.com/en/site/news-detail?id=2068" }, { "last_checked": "2026-10-13", "site_id": "tel-miyagi-innovative-production-center", "site_name": "Miyagi Innovative Production Center", "owners": "Tokyo Electron", "city": "Taiwa", "country": "JP", "kind": "plant", "measure": "status", "value": "building", "date": "", "claim_id": "C-D-070", "quote": "Miyagi Innovative Production Center, Miyagi: to be completed in summer 2027", "source_title": "Tokyo Electron Corporate Profile (April 2026)", "source_url": "https://www.tel.com/files/about/library/pv8va20000001ffv-att/corporate_guide_e.pdf", "source_urls": "https://www.tel.com/files/about/library/pv8va20000001ffv-att/corporate_guide_e.pdf" }, { "last_checked": "2026-10-13", "site_id": "tel-miyagi-innovative-production-center", "site_name": "Miyagi Innovative Production Center", "owners": "Tokyo Electron", "city": "Taiwa", "country": "JP", "kind": "plant", "measure": "expected_cleanroom-open", "value": "2027", "date": "2027", "claim_id": "C-D-070", "quote": "to be completed in summer 2027", "source_title": "Tokyo Electron Corporate Profile (April 2026)", "source_url": "https://www.tel.com/files/about/library/pv8va20000001ffv-att/corporate_guide_e.pdf", "source_urls": "https://www.tel.com/files/about/library/pv8va20000001ffv-att/corporate_guide_e.pdf" }, { "last_checked": "2026-10-13", "site_id": "tel-tohoku-production-logistics", "site_name": "Tohoku Production and Logistics Center", "owners": "Tokyo Electron", "city": "Oshu", "country": "JP", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-070", "quote": "Tohoku Production and Logistics Center, Iwate: completed in November 2025", "source_title": "Tokyo Electron Corporate Profile (April 2026)", "source_url": "https://www.tel.com/files/about/library/pv8va20000001ffv-att/corporate_guide_e.pdf", "source_urls": "https://www.tel.com/files/about/library/pv8va20000001ffv-att/corporate_guide_e.pdf" }, { "last_checked": "2026-10-13", "site_id": "gw-sherman-300mm", "site_name": "Sherman 300mm silicon wafer fab", "owners": "GlobalWafers", "city": "Sherman", "country": "US", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-D-071", "quote": "construction of new wafer manufacturing facilities in Sherman, Texas and St. Peters, Missouri", "source_title": "Biden-Harris Administration Announces CHIPS Incentives Awards with GlobalWafers to Support Domestic Production of Silicon Wafers", "source_url": "https://www.nist.gov/news-events/news/2024/12/biden-harris-administration-announces-chips-incentives-awards-globalwafers", "source_urls": "https://www.nist.gov/news-events/news/2024/12/biden-harris-administration-announces-chips-incentives-awards-globalwafers" }, { "last_checked": "2026-10-13", "site_id": "gw-sherman-epi", "site_name": "Sherman epitaxy facility", "owners": "GlobalWafers", "city": "Sherman", "country": "US", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-071", "quote": "its existing silicon epitaxy wafer manufacturing facility in Sherman, Texas", "source_title": "Biden-Harris Administration Announces CHIPS Incentives Awards with GlobalWafers to Support Domestic Production of Silicon Wafers", "source_url": "https://www.nist.gov/news-events/news/2024/12/biden-harris-administration-announces-chips-incentives-awards-globalwafers", "source_urls": "https://www.nist.gov/news-events/news/2024/12/biden-harris-administration-announces-chips-incentives-awards-globalwafers" }, { "last_checked": "2026-10-13", "site_id": "gw-st-peters-soi", "site_name": "St. Peters SOI wafer facility (MEMC)", "owners": "GlobalWafers", "city": "St. Peters", "country": "US", "kind": "fab", "measure": "status", "value": "building", "date": "", "claim_id": "C-D-261", "quote": "silicon-on-insulator (SOI) wafers will be produced by MEMC in St. Peters, Missouri", "source_title": "GlobalWafers (Texas)", "source_url": "https://www.nist.gov/chips/globalwafers-texas-sherman", "source_urls": "https://www.nist.gov/chips/globalwafers-texas-sherman" }, { "last_checked": "2026-10-13", "site_id": "shinetsu-isobe", "site_name": "Gunma Complex Isobe Plant", "owners": "Shin-Etsu Chemical", "city": "Annaka", "country": "JP", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-282", "quote": "Gunma Complex Isobe Plant, 13-1, Isobe 2-chome, Annaka-shi, Gunma, Japan: products include semiconductor silicon", "source_title": "Shin-Etsu Chemical: global network, plants", "source_url": "https://www.shinetsu.co.jp/en/company/network/plant", "source_urls": "https://www.shinetsu.co.jp/en/company/network/plant" }, { "last_checked": "2026-10-13", "site_id": "shinetsu-takefu", "site_name": "Takefu Plant", "owners": "Shin-Etsu Chemical", "city": "Echizen", "country": "JP", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-283", "quote": "Takefu Plant, 1-5, Kitago 2-chome, Echizen-shi, Fukui, Japan: products include semiconductor silicon", "source_title": "Shin-Etsu Chemical: global network, plants", "source_url": "https://www.shinetsu.co.jp/en/company/network/plant", "source_urls": "https://www.shinetsu.co.jp/en/company/network/plant" }, { "last_checked": "2026-10-15", "site_id": "jcet-jiangyin", "site_name": "JCET Jiangyin", "owners": "JCET", "city": "Jiangyin", "country": "CN", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-289", "quote": "JCET Jiangyin, 78 Changshan Road, Jiangyin, Jiangsu", "source_title": "JCET Group —— Worldwide LocatIons", "source_url": "https://www.jcetglobal.com/en/site/worldwide-locations", "source_urls": "https://www.jcetglobal.com/en/site/worldwide-locations" }, { "last_checked": "2026-10-15", "site_id": "jcet-suqian", "site_name": "JCET Suqian", "owners": "JCET", "city": "Suqian", "country": "CN", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-284", "quote": "JCET Suqian, No. 5 PuTuoshan Road, Suqian, Jiangsu", "source_title": "JCET Group —— Worldwide LocatIons", "source_url": "https://www.jcetglobal.com/en/site/worldwide-locations", "source_urls": "https://www.jcetglobal.com/en/site/worldwide-locations" }, { "last_checked": "2026-10-15", "site_id": "jcet-chuzhou", "site_name": "JCET Chuzhou", "owners": "JCET", "city": "Chuzhou", "country": "CN", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-285", "quote": "JCET Chuzhou, No.999 Century Avenue, Chuzhou, Anhui", "source_title": "JCET Group —— Worldwide LocatIons", "source_url": "https://www.jcetglobal.com/en/site/worldwide-locations", "source_urls": "https://www.jcetglobal.com/en/site/worldwide-locations" }, { "last_checked": "2026-10-15", "site_id": "jcet-stats-chippac-korea", "site_name": "STATS ChipPAC Korea", "owners": "JCET", "city": "Incheon", "country": "KR", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-286", "quote": "STATS ChipPAC Korea and JCET STATS ChipPAC Korea, Jayumuyeok-ro, Jung-gu. Incheon", "source_title": "JCET Group —— Worldwide LocatIons", "source_url": "https://www.jcetglobal.com/en/site/worldwide-locations", "source_urls": "https://www.jcetglobal.com/en/site/worldwide-locations" }, { "last_checked": "2026-10-15", "site_id": "jcet-stats-chippac-singapore", "site_name": "STATS ChipPAC Singapore", "owners": "JCET", "city": "Singapore", "country": "SG", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-287", "quote": "STATS ChipPAC Singapore, SCS: 5 Yishun Street 23, 768442, Singapore", "source_title": "JCET Group —— Worldwide LocatIons", "source_url": "https://www.jcetglobal.com/en/site/worldwide-locations", "source_urls": "https://www.jcetglobal.com/en/site/worldwide-locations" }, { "last_checked": "2026-10-15", "site_id": "jcet-sandisk-semiconductor-shanghai", "site_name": "SanDisk Semiconductor Shanghai", "owners": "JCET", "city": "Shanghai", "country": "CN", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-288", "quote": "SanDisk Semiconductor Shanghai, No.388, East Jiangchuan Road, Minhang District, Shanghai", "source_title": "JCET Group —— Worldwide LocatIons", "source_url": "https://www.jcetglobal.com/en/site/worldwide-locations", "source_urls": "https://www.jcetglobal.com/en/site/worldwide-locations" }, { "last_checked": "2026-10-15", "site_id": "sumco-kyushu", "site_name": "Kyushu Factory (Kubara, Saga)", "owners": "SUMCO", "city": "Saga", "country": "JP", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-144", "quote": "Kyushu Factory (Kubara) and Kyushu Factory (Saga): Design, development and manufacture of monocrystalline silicon ingots and silicon wafers", "source_title": "Site Data│Sustainability│SUMCO CORPORATION", "source_url": "https://www.sumcosi.com/english/csr/sitedata.html", "source_urls": "https://www.sumcosi.com/english/csr/sitedata.html" }, { "last_checked": "2026-10-15", "site_id": "sumco-yonezawa", "site_name": "Yonezawa Plant", "owners": "SUMCO", "city": "Yonezawa", "country": "JP", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-144", "quote": "Yonezawa Plant: Design, development and manufacture of monocrystalline silicon ingots", "source_title": "Site Data│Sustainability│SUMCO CORPORATION", "source_url": "https://www.sumcosi.com/english/csr/sitedata.html", "source_urls": "https://www.sumcosi.com/english/csr/sitedata.html" }, { "last_checked": "2026-10-15", "site_id": "sumco-chitose", "site_name": "Chitose Plant", "owners": "SUMCO", "city": "Chitose", "country": "JP", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-144", "quote": "Chitose Plant: Design, development and manufacture of silicon wafers", "source_title": "Site Data│Sustainability│SUMCO CORPORATION", "source_url": "https://www.sumcosi.com/english/csr/sitedata.html", "source_urls": "https://www.sumcosi.com/english/csr/sitedata.html" }, { "last_checked": "2026-10-15", "site_id": "sumco-noda", "site_name": "Noda Office", "owners": "SUMCO", "city": "Noda", "country": "JP", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-144", "quote": "Noda Office: Manufacture of silicon wafers", "source_title": "Site Data│Sustainability│SUMCO CORPORATION", "source_url": "https://www.sumcosi.com/english/csr/sitedata.html", "source_urls": "https://www.sumcosi.com/english/csr/sitedata.html" }, { "last_checked": "2026-10-15", "site_id": "sumco-techxiv-nagasaki", "site_name": "SUMCO TECHXIV Nagasaki Plant", "owners": "SUMCO", "city": "Nagasaki", "country": "JP", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-144", "quote": "SUMCO TECHXIV Corporation (STC) Nagasaki Plant and (STC) Miyazaki Plant: monocrystalline silicon ingots and silicon wafers", "source_title": "Site Data│Sustainability│SUMCO CORPORATION", "source_url": "https://www.sumcosi.com/english/csr/sitedata.html", "source_urls": "https://www.sumcosi.com/english/csr/sitedata.html" }, { "last_checked": "2026-10-15", "site_id": "sumco-techxiv-miyazaki", "site_name": "SUMCO TECHXIV Miyazaki Plant", "owners": "SUMCO", "city": "Miyazaki", "country": "JP", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-144", "quote": "SUMCO TECHXIV Corporation (STC) Nagasaki Plant and (STC) Miyazaki Plant: monocrystalline silicon ingots and silicon wafers", "source_title": "Site Data│Sustainability│SUMCO CORPORATION", "source_url": "https://www.sumcosi.com/english/csr/sitedata.html", "source_urls": "https://www.sumcosi.com/english/csr/sitedata.html" }, { "last_checked": "2026-10-15", "site_id": "sumco-phoenix-albuquerque", "site_name": "SUMCO Phoenix Albuquerque Plant", "owners": "SUMCO", "city": "Albuquerque", "country": "US", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-144", "quote": "SUMCO Phoenix Corporation (SPX) Albuquerque Plant and (SPX) Phoenix Plant: silicon wafers", "source_title": "Site Data│Sustainability│SUMCO CORPORATION", "source_url": "https://www.sumcosi.com/english/csr/sitedata.html", "source_urls": "https://www.sumcosi.com/english/csr/sitedata.html" }, { "last_checked": "2026-10-15", "site_id": "sumco-phoenix", "site_name": "SUMCO Phoenix Plant", "owners": "SUMCO", "city": "Phoenix", "country": "US", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-144", "quote": "SUMCO Phoenix Corporation (SPX) Albuquerque Plant and (SPX) Phoenix Plant: silicon wafers", "source_title": "Site Data│Sustainability│SUMCO CORPORATION", "source_url": "https://www.sumcosi.com/english/csr/sitedata.html", "source_urls": "https://www.sumcosi.com/english/csr/sitedata.html" }, { "last_checked": "2026-10-15", "site_id": "pti-hsinchu-industrial-park", "site_name": "Hsinchu Industrial Park plants (2, 3A, 3C, 3D, 3E)", "owners": "Powertech Technology (PTI)", "city": "Hukou, Hsinchu County", "country": "TW", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-297", "quote": "Hsinchu Industrial Park, Hukou Township, Hsinchu County", "source_title": "Locations", "source_url": "https://www.pti.com.tw/en/about/location", "source_urls": "https://www.pti.com.tw/en/about/location" }, { "last_checked": "2026-10-15", "site_id": "pti-hsinchu-science-park", "site_name": "Hsinchu Science Park plants (8, 11A, 11B, 12)", "owners": "Powertech Technology (PTI)", "city": "Hsinchu", "country": "TW", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-294", "quote": "Hsinchu Science Park, Hsinchu City", "source_title": "Locations", "source_url": "https://www.pti.com.tw/en/about/location", "source_urls": "https://www.pti.com.tw/en/about/location" }, { "last_checked": "2026-10-15", "site_id": "intel-arizona-fab-52", "site_name": "Fab 52 (Ocotillo, Chandler)", "owners": "Intel", "city": "Chandler", "country": "US", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-114", "quote": "became fully operational", "source_title": "Intel 2025-26 Corporate Responsibility Report", "source_url": "https://csrreportbuilder.intel.com/pdfbuilder/pdfs/CSR-2025-26-Full-Report.pdf", "source_urls": "https://csrreportbuilder.intel.com/pdfbuilder/pdfs/CSR-2025-26-Full-Report.pdf" }, { "last_checked": "2026-10-15", "site_id": "intel-arizona-fab-52", "site_name": "Fab 52 (Ocotillo, Chandler)", "owners": "Intel", "city": "Chandler", "country": "US", "kind": "fab", "measure": "products", "value": "logic", "date": "", "claim_id": "C-D-114", "quote": "The factory manufactures Intel 18A wafers", "source_title": "Intel 2025-26 Corporate Responsibility Report", "source_url": "https://csrreportbuilder.intel.com/pdfbuilder/pdfs/CSR-2025-26-Full-Report.pdf", "source_urls": "https://csrreportbuilder.intel.com/pdfbuilder/pdfs/CSR-2025-26-Full-Report.pdf" }, { "last_checked": "2026-10-15", "site_id": "intel-arizona-fab-52", "site_name": "Fab 52 (Ocotillo, Chandler)", "owners": "Intel", "city": "Chandler", "country": "US", "kind": "fab", "measure": "production", "value": "logic Intel 18A", "date": "2025-10-09", "claim_id": "C-D-113", "quote": "On October 9, 2025, Intel said Panther Lake and Clearwater Forest are being manufactured at Fab 52 on Intel 18A", "source_title": "Intel Unveils Panther Lake Architecture: First AI PC Platform Built on 18A", "source_url": "https://www.intel.com/content/www/us/en/newsroom/news/client-computing/intel-unveils-panther-lake-architecture-first-ai-pc-platform-built-on-18a.html", "source_urls": "https://www.intel.com/content/www/us/en/newsroom/news/client-computing/intel-unveils-panther-lake-architecture-first-ai-pc-platform-built-on-18a.html" }, { "last_checked": "2026-10-15", "site_id": "sk-hynix-chongqing", "site_name": "Chongqing", "owners": "SK hynix", "city": "Chongqing", "country": "CN", "kind": "packaging", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-119", "quote": "SK hynix's NAND flash backend production base is located in Chongqing, China", "source_title": "SK hynix’s Global CSR Initiatives: Creating Happiness by Connecting People & Technology", "source_url": "https://news.skhynix.com/en/sk-hynixs-global-csr-initiatives-creating-happiness-by-connecting-people-technology/", "source_urls": "https://news.skhynix.com/en/sk-hynixs-global-csr-initiatives-creating-happiness-by-connecting-people-technology/" }, { "last_checked": "2026-10-15", "site_id": "sk-hynix-chongqing", "site_name": "Chongqing", "owners": "SK hynix", "city": "Chongqing", "country": "CN", "kind": "packaging", "measure": "products", "value": "NAND", "date": "", "claim_id": "C-D-119", "quote": "NAND flash backend production base", "source_title": "SK hynix’s Global CSR Initiatives: Creating Happiness by Connecting People & Technology", "source_url": "https://news.skhynix.com/en/sk-hynixs-global-csr-initiatives-creating-happiness-by-connecting-people-technology/", "source_urls": "https://news.skhynix.com/en/sk-hynixs-global-csr-initiatives-creating-happiness-by-connecting-people-technology/" }, { "last_checked": "2026-10-15", "site_id": "micron-tainan", "site_name": "Tainan (former AUO panel plant)", "owners": "Micron", "city": "Tainan", "country": "TW", "kind": "test", "measure": "status", "value": "tool-in", "date": "", "claim_id": "C-D-120", "quote": "equipment moving in since early September 2026", "source_title": "[News] Micron Taiwan Investment Tops NT$1.6T as Four-Site Expansion Accelerates; Nanya Adds Pingtung Project", "source_url": "https://www.trendforce.com/news/2026/10/02/news-micron-taiwan-investment-tops-nt1-6t-as-four-site-expansion-accelerates-nanya-adds-pingtung-project/", "source_urls": "https://www.trendforce.com/news/2026/10/02/news-micron-taiwan-investment-tops-nt1-6t-as-four-site-expansion-accelerates-nanya-adds-pingtung-project/" }, { "last_checked": "2026-10-15", "site_id": "lam-batu-kawan", "site_name": "Lam Manufacturing Malaysia (Batu Kawan)", "owners": "Lam Research", "city": "Batu Kawan", "country": "MY", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-145", "quote": "was opened in August 2021 and is the largest in Lam's network", "source_title": "Lam Manufacturing Malaysia (careers page)", "source_url": "https://www.lamresearch.com/careers/global-opportunities/manufacturing-malaysia/", "source_urls": "https://www.lamresearch.com/careers/global-opportunities/manufacturing-malaysia/" }, { "last_checked": "2026-10-15", "site_id": "kla-newport", "site_name": "Newport R&D and manufacturing center", "owners": "KLA", "city": "Newport", "country": "GB", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-123", "quote": "KLA opened its new $138 million R&D and manufacturing center in Newport, Wales", "source_title": "KLA Invests in Operations in Wales with the Opening of a $138 Million R&D and Manufacturing Facility", "source_url": "https://ir.kla.com/news-events/press-releases/detail/498/kla-invests-in-operations-in-wales-with-the-opening-of-a", "source_urls": "https://ir.kla.com/news-events/press-releases/detail/498/kla-invests-in-operations-in-wales-with-the-opening-of-a" }, { "last_checked": "2026-10-15", "site_id": "hua-hong-shanghai-8inch", "site_name": "Shanghai 8-inch fabs (Jinqiao, Zhangjiang)", "owners": "Hua Hong Semiconductor", "city": "Shanghai", "country": "CN", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-190", "quote": "the company operates three 8-inch wafer fabrication facilities in Shanghai Jinqiao and Shanghai Zhangjiang", "source_title": "Hua Hong Semiconductor fourth quarter and full year 2025 results announcement", "source_url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0212/2026021200389.pdf", "source_urls": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0212/2026021200389.pdf" }, { "last_checked": "2026-10-15", "site_id": "hua-hong-wuxi", "site_name": "Wuxi 12-inch fabs (including FAB9)", "owners": "Hua Hong Semiconductor", "city": "Wuxi", "country": "CN", "kind": "fab", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-190", "quote": "two 12-inch wafer fabrication facilities devoted to specialty processes in Wuxi National Hi-Tech District", "source_title": "Hua Hong Semiconductor fourth quarter and full year 2025 results announcement", "source_url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0212/2026021200389.pdf", "source_urls": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0212/2026021200389.pdf" }, { "last_checked": "2026-10-15", "site_id": "hua-hong-wuxi", "site_name": "Wuxi 12-inch fabs (including FAB9)", "owners": "Hua Hong Semiconductor", "city": "Wuxi", "country": "CN", "kind": "fab", "measure": "products", "value": "specialty", "date": "", "claim_id": "C-D-190", "quote": "two 12-inch wafer fabrication facilities devoted to specialty processes in Wuxi National Hi-Tech District", "source_title": "Hua Hong Semiconductor fourth quarter and full year 2025 results announcement", "source_url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0212/2026021200389.pdf", "source_urls": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0212/2026021200389.pdf" }, { "last_checked": "2026-10-15", "site_id": "vsmc-singapore", "site_name": "VSMC Tampines 300mm fab (VIS and NXP)", "owners": "Vanguard International Semiconductor (VIS)", "city": "Singapore", "country": "SG", "kind": "fab", "measure": "status", "value": "tool-in", "date": "", "claim_id": "C-D-125", "quote": "the fab has entered the risk production stage", "source_title": "VSMC Celebrates the Grand Opening of Its First 300mm Fab in Singapore", "source_url": "https://www.edb.gov.sg/en/news-and-insights/vsmc-celebrates-the-grand-opening-of-its-first-300mm-fab-in-singapore", "source_urls": "https://www.edb.gov.sg/en/news-and-insights/vsmc-celebrates-the-grand-opening-of-its-first-300mm-fab-in-singapore" }, { "last_checked": "2026-10-15", "site_id": "vsmc-singapore", "site_name": "VSMC Tampines 300mm fab (VIS and NXP)", "owners": "Vanguard International Semiconductor (VIS)", "city": "Singapore", "country": "SG", "kind": "fab", "measure": "expected_first-output", "value": "2027", "date": "2027", "claim_id": "C-D-125", "quote": "volume production scheduled to begin in the first quarter of 2027", "source_title": "VSMC Celebrates the Grand Opening of Its First 300mm Fab in Singapore", "source_url": "https://www.edb.gov.sg/en/news-and-insights/vsmc-celebrates-the-grand-opening-of-its-first-300mm-fab-in-singapore", "source_urls": "https://www.edb.gov.sg/en/news-and-insights/vsmc-celebrates-the-grand-opening-of-its-first-300mm-fab-in-singapore" }, { "last_checked": "2026-10-15", "site_id": "vsmc-singapore", "site_name": "VSMC Tampines 300mm fab (VIS and NXP)", "owners": "Vanguard International Semiconductor (VIS)", "city": "Singapore", "country": "SG", "kind": "fab", "measure": "expected_full-ramp", "value": "2029", "date": "2029", "claim_id": "C-D-125", "quote": "At full capacity by 2029", "source_title": "VSMC Celebrates the Grand Opening of Its First 300mm Fab in Singapore", "source_url": "https://www.edb.gov.sg/en/news-and-insights/vsmc-celebrates-the-grand-opening-of-its-first-300mm-fab-in-singapore", "source_urls": "https://www.edb.gov.sg/en/news-and-insights/vsmc-celebrates-the-grand-opening-of-its-first-300mm-fab-in-singapore" }, { "last_checked": "2026-10-15", "site_id": "amat-singapore-tampines", "site_name": "Tampines Campus", "owners": "Applied Materials", "city": "Singapore", "country": "SG", "kind": "plant", "measure": "status", "value": "producing", "date": "", "claim_id": "C-D-126", "quote": "is already operating at volume production", "source_title": "Applied Materials Expands Singapore Manufacturing for AI", "source_url": "https://www.edb.gov.sg/en/about-edb/media-releases-publications/applied-materials-expands-singapore-manufacturing-for-ai.html", "source_urls": "https://www.edb.gov.sg/en/about-edb/media-releases-publications/applied-materials-expands-singapore-manufacturing-for-ai.html" }, { "last_checked": "2026-10-15", "site_id": "gf-malta-new-fab-1", "site_name": "Malta new fab 1 (U.S.-Japan initiative)", "owners": "GlobalFoundries", "city": "Malta", "country": "US", "kind": "fab", "measure": "status", "value": "announced", "date": "", "claim_id": "C-D-183", "quote": "GF was selected as technology provider and operator for two new fabs at its Malta, New York site", "source_title": "GlobalFoundries selected to operate two new semiconductor fabs in New York under landmark U.S.-Japan initiative", "source_url": "https://gf.com/news-and-events/news/globalfoundries-selected-to-operate-two-new-semiconductor-fabs-in-new-york-under-landmark-us-japan-initiative/", "source_urls": "https://gf.com/news-and-events/news/globalfoundries-selected-to-operate-two-new-semiconductor-fabs-in-new-york-under-landmark-us-japan-initiative/" }, { "last_checked": "2026-10-15", "site_id": "gf-malta-new-fab-1", "site_name": "Malta new fab 1 (U.S.-Japan initiative)", "owners": "GlobalFoundries", "city": "Malta", "country": "US", "kind": "fab", "measure": "expected_groundbreaking", "value": "2026", "date": "2026", "claim_id": "C-D-191", "quote": "GF expects to break ground on the first fab at its Malta site later in 2026", "source_title": "GlobalFoundries selected to operate two new semiconductor fabs in New York under landmark U.S.-Japan initiative", "source_url": "https://gf.com/news-and-events/news/globalfoundries-selected-to-operate-two-new-semiconductor-fabs-in-new-york-under-landmark-us-japan-initiative/", "source_urls": "https://gf.com/news-and-events/news/globalfoundries-selected-to-operate-two-new-semiconductor-fabs-in-new-york-under-landmark-us-japan-initiative/" }, { "last_checked": "2026-10-15", "site_id": "gf-malta-new-fab-1", "site_name": "Malta new fab 1 (U.S.-Japan initiative)", "owners": "GlobalFoundries", "city": "Malta", "country": "US", "kind": "fab", "measure": "expected_first-output", "value": "2029", "date": "2029", "claim_id": "C-D-180", "quote": "a new 300mm fab expected to come online in 2029", "source_title": "GlobalFoundries selected to operate two new semiconductor fabs in New York under landmark U.S.-Japan initiative", "source_url": "https://gf.com/news-and-events/news/globalfoundries-selected-to-operate-two-new-semiconductor-fabs-in-new-york-under-landmark-us-japan-initiative/", "source_urls": "https://gf.com/news-and-events/news/globalfoundries-selected-to-operate-two-new-semiconductor-fabs-in-new-york-under-landmark-us-japan-initiative/" } ] }